Intel Core 7 150UL vs Qualcomm Snapdragon X2E-96-100 Comparison

Intel
INTEL

Intel Core 7 150UL

CORE STATE Raptor Lake-PS
CORE SPECS 10 Cores / 12 Threads
CLOCK SPEED 1.7 Base / 5 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 15W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024
VS
Unknown
CPU

Snapdragon X2E-96-100

CORE STATE Glymur
CORE SPECS 18 Cores / 18 Threads
CLOCK SPEED 4.45 Base / 5 GHz Turbo
CACHE 9 MB (shared)
MAX TDP —
ARCHITECTURE Glymur
nm
PROCESS 3 nm
LAUNCH DATE 2026

Analysis: Intel Core 7 150UL vs Qualcomm Snapdragon X2E-96-100

FAQ

Q: What are the core and thread counts of each processor?

A: The Intel Core 7 150UL has 10 cores and 12 threads. The Qualcomm Snapdragon X2E-96-100 has 18 cores and 18 threads.

Q: Which processor has a higher base clock speed?

A: The Qualcomm Snapdragon X2E-96-100 has a base clock of 4.45 GHz, while the Intel Core 7 150UL has a base clock of 1.70 GHz. Both processors share the same boost clock of 5.00 GHz.

Q: What process nodes are used by each chip?

A: The Intel Core 7 150UL uses a 10 nm process node fabricated by Intel. The Qualcomm Snapdragon X2E-96-100 uses a 3 nm process node fabricated by TSMC.

Q: Which processor supports more PCIe lanes?

A: The Qualcomm Snapdragon X2E-96-100 supports PCIe Gen 5 with 12 lanes (CPU only), whereas the Intel Core 7 150UL supports PCIe Gen 4 with 8 lanes (CPU only).

Q: What memory types does each processor support?

A: The Intel Core 7 150UL supports DDR4 and DDR5 memory with a dual-channel memory bus. The Qualcomm Snapdragon X2E-96-100 supports LPDDR5X memory with a triple-channel memory bus and a recorded memory bandwidth of 228.6 GB/s.

Q: When were these processors released?

A: The Intel Core 7 150UL was released on 2024-04-07, and the Qualcomm Snapdragon X2E-96-100 was released on 2026-04-05.

Architecture Differences

The two processors come from fundamentally different design approaches. The Intel Core 7 150UL is based on the Raptor Lake architecture, specifically the Raptor Lake-PS codename, and belongs to the Core 7 generation. It uses a 10 nm process node manufactured by Intel and fits the Intel Socket 1700. The Qualcomm Snapdragon X2E-96-100 uses the Glymur codename and belongs to the Snapdragon X2 (Elite) generation. It is built on a 3 nm process node by TSMC and uses the Qualcomm BGA 2343 socket.

The cache hierarchy differs substantially. The Intel processor has an L1 cache of 80 KB per core, an L2 cache of 1.25 MB per core, and a shared L3 cache of 12 MB. The Qualcomm processor has an L1 cache of 288 KB per core, an L2 cache of 16 MB per module, and a shared L3 cache of 9 MB. The die size of the Qualcomm processor is recorded as 220 mm², while the Intel die size is not listed in the database.

The memory architecture also separates these two. Intel supports DDR4 and DDR5 with a dual-channel memory bus, while Qualcomm supports LPDDR5X with a triple-channel memory bus and a rated memory bandwidth of 228.6 GB/s. The PCIe implementation differs as well: Intel uses Gen 4 with 8 lanes (CPU only), and Qualcomm uses Gen 5 with 12 lanes (CPU only).

Integrated graphics differ: the Intel Core 7 150UL includes Iris Xe Graphics 96EU, while the Qualcomm Snapdragon X2E-96-100 includes Adreno X2-90. Neither processor supports ECC memory, and neither has an unlocked multiplier.

Where Each One Wins

The Intel Core 7 150UL is positioned as a desktop processor with a low thermal design power of 15 watts. Its 10 cores and 12 threads, combined with a boost clock of 5.00 GHz, make it suitable for workloads that benefit from Intel's Raptor Lake architecture and the availability of DDR4 or DDR5 memory. The dual-channel memory bus and 12 MB of shared L3 cache provide a balanced foundation for general desktop computing.

The Qualcomm Snapdragon X2E-96-100 is explicitly a mobile processor. Its 18 cores and 18 threads deliver a higher core count, and the base clock of 4.45 GHz is substantially higher than the Intel chip's base clock. The triple-channel LPDDR5X memory bus with 228.6 GB/s bandwidth gives it a clear advantage in memory-intensive tasks. The PCIe Gen 5 support with 12 lanes doubles the lane count and doubles the generation speed compared to Intel's PCIe Gen 4 with 8 lanes, which favors applications that rely on high-throughput peripherals.

The 3 nm process node from TSMC suggests better power efficiency per transistor compared to Intel's 10 nm node, though the database does not record a TDP for the Qualcomm part. The larger L2 cache per module (16 MB) and per-core L1 cache (288 KB) indicate a design tuned for high-bandwidth, parallel workloads.

Specification Differences

| Specification | Intel Core 7 150UL | Qualcomm Snapdragon X2E-96-100 |

|----------------|---------------------|--------------------------------|

| Cores | 10 | 18 |

| Threads | 12 | 18 |

| Base clock | 1.70 GHz | 4.45 GHz |

| Boost clock | 5.00 GHz | 5.00 GHz |

| TDP | 15 watts | Not recorded |

| Socket | Intel Socket 1700 | Qualcomm BGA 2343 |

| Architecture | Raptor Lake | Not recorded |

| Codename | Raptor Lake-PS | Glymur |

| Process node | 10 nm | 3 nm |

| Foundry | Intel | TSMC |

| Die size | Not recorded | 220 mm² |

| L1 cache | 80 KB (per core) | 288 KB (per core) |

| L2 cache | 1.25 MB (per core) | 16 MB (per module) |

| L3 cache | 12 MB (shared) | 9 MB (shared) |

| Memory support | DDR4, DDR5 | LPDDR5X |

| Memory bus | Dual-channel | Triple-channel |

| Memory bandwidth | Not recorded | 228.6 GB/s |

| PCIe | Gen 4, 8 lanes (CPU only) | Gen 5, 12 lanes (CPU only) |

| Integrated graphics | Iris Xe Graphics 96EU | Adreno X2-90 |

| Market segment | Desktop | Mobile |

| Release date | 2024-04-07 | 2026-04-05 |

| Part number | Unknown | X2E96100 |

Head-to-Head Benchmarks

The database does not contain direct head-to-head benchmark scores for these two processors. The recorded fields for head-to-head benchmarks are empty, and the wins for each side are both zero. The average benchmark score for each processor is also zero, and neither has any nearest rivals listed. As a result, the comparative performance analysis must rely on the recorded specification data rather than measured benchmark results.

The most significant differences that affect performance are the core count, base clock, memory bandwidth, and PCIe generation. The Qualcomm Snapdragon X2E-96-100 has 80% more cores (18 versus 10) and 50% more threads (18 versus 12). Its base clock of 4.45 GHz is more than 2.6 times higher than the Intel's 1.70 GHz. Both processors reach the same boost clock of 5.00 GHz.

Memory bandwidth is a clear differentiator. The Qualcomm chip's triple-channel LPDDR5X bus delivers 228.6 GB/s, while the Intel chip's memory bandwidth is not recorded in the database. The memory type also differs: LPDDR5X is a low-power standard typically found in mobile devices, while DDR4 and DDR5 are standard desktop memory types. The Intel processor's dual-channel bus limits theoretical bandwidth compared to triple-channel configurations.

The Qualcomm processor also leads in PCIe connectivity, offering Gen 5 with 12 lanes versus Intel's Gen 4 with 8 lanes. This represents a generational jump and a 50% increase in lane count. For workloads that use NVMe storage or high-end GPUs, the Qualcomm part has a structural advantage.

The process node difference is notable. The 3 nm TSMC process is more advanced than Intel's 10 nm node, which typically allows higher transistor density and better power efficiency. The database does not record a TDP for the Qualcomm chip, so direct power comparisons cannot be made. The Intel chip is rated at 15 watts, which is a low-power desktop design.

Cache capacities show a mixed picture. The Qualcomm chip has a larger L1 cache per core (288 KB versus 80 KB) and a larger L2 cache per module (16 MB versus 1.25 MB per core). However, the Intel chip has a larger shared L3 cache (12 MB versus 9 MB). The L2 difference is particularly pronounced: the Qualcomm chip's 16 MB per module is 12.8 times larger than Intel's 1.25 MB per core, though the per-module versus per-core distinction makes a direct comparison less straightforward.

The release dates differ by roughly two years, with the Qualcomm processor launching on 2026-04-05 and the Intel processor on 2024-04-07. This time gap aligns with the more advanced process node and newer memory standard in the Qualcomm part.

The Verdict

The data indicates that the Qualcomm Snapdragon X2E-96-100 is the more capable processor on paper for multi-threaded and memory-intensive workloads. Its 18 cores, 18 threads, higher base clock, triple-channel LPDDR5X memory with 228.6 GB/s bandwidth, and PCIe Gen 5 support give it clear structural advantages over the Intel Core 7 150UL. The 3 nm TSMC process and 220 mm² die size further position it as a newer, more advanced design.

The Intel Core 7 150UL, however, serves a different market segment. It is a desktop processor with a 15-watt TDP, which makes it suitable for low-power desktop systems. Its 10 cores and 12 threads, combined with a 5.00 GHz boost clock, provide adequate performance for general desktop tasks. The support for DDR4 and DDR5 memory gives system builders flexibility in memory selection, and the Intel Socket 1700 platform is a well-established ecosystem.

For users who prioritize raw core count, memory bandwidth, and the latest PCIe standard, the Qualcomm Snapdragon X2E-96-100 is the stronger choice based on the recorded specifications. For users who need a low-power desktop processor with a familiar socket and dual memory type support, the Intel Core 7 150UL remains a viable option.

Because the database contains no benchmark scores or rival comparisons for either processor, the verdict rests entirely on specification analysis. The Qualcomm part leads in cores, threads, base clock, memory bandwidth, PCIe generation and lanes, process node, and L1/L2 cache sizes. The Intel part leads in L3 cache size (12 MB versus 9 MB) and has a recorded TDP of 15 watts, which is useful for power-constrained desktop designs.

The market segments also differ: the Intel chip targets desktop, and the Qualcomm chip targets mobile. Users selecting a processor should match the market segment to their intended platform. The Qualcomm chip's mobile orientation and triple-channel LPDDR5X memory suggest it is designed for high-performance laptops or compact mobile devices, while the Intel chip's desktop orientation and dual-channel DDR4/DDR5 support suggest traditional desktop builds.

DETAILED SPECIFICATIONS

SPECIFICATION
7 150UL
Snapdragon X2E-96-100
Core Specs
Cores
10
18 +80.0%
Threads
12
18 +50.0%
Base Clock (GHz)
1.7
4.45 +161.8%
Boost Clock (GHz)
5
5 0.0%
Frequency (GHz)
1.7
4.45 +161.8%
Turbo Clock (GHz)
5
5 0.0%
Multiplier
17
44.5 +161.8%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
1.25 MB (per core)
16 MB (per module)
L3 Cache
12 MB (shared)
9 MB (shared)
Power
TDP (W)
15
—
PL1
15 W
—
PL2
55 W
—
Architecture
Architecture
Raptor Lake
—
Codename
Raptor Lake-PS
Glymur
Generation
Core 7 (Raptor Lake-PS)
Snapdragon X2 (Elite)
Process Size
10 nm
3 nm
Die Size
—
220 mm²
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Triple-channel
Memory Bandwidth
—
228.6 GB/s
ECC Memory
No
No
DDR4 Speed
3200 MT/s
—
DDR5 Speed
5200 MT/s
—
Platform
Socket
Intel Socket 1700
Qualcomm BGA 2343
PCIe
Gen 4, 8 Lanes(CPU only)
Gen 5, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 2 E-Cores: 8
12 + 6
E-Core Frequency
1200 MHz up to 3.7 GHz
3.6 GHz
AI/NPU
NPU
—
Yes / 80 TOPS
Graphics
Integrated Graphics
Iris Xe Graphics 96EU
Adreno X2-90
Other
Market
Desktop
Mobile
Production Status
Active
Active
Part Number
unknown
X2E96100
Package
FC-LGA16A
FC-BGA
Tj Max
100°C
—
View Core 7 150UL Details View Snapdragon X2E-96-100 Details