Intel Core 7 150UL vs Qualcomm Snapdragon X2E-88-100 Comparison

Intel
INTEL

Intel Core 7 150UL

CORE STATE Raptor Lake-PS
CORE SPECS 10 Cores / 12 Threads
CLOCK SPEED 1.7 Base / 5 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 15W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024
VS
Unknown
CPU

Snapdragon X2E-88-100

CORE STATE Glymur
CORE SPECS 18 Cores / 18 Threads
CLOCK SPEED 4 Base / 4.7 GHz Turbo
CACHE —
MAX TDP —
ARCHITECTURE Glymur
nm
PROCESS 3 nm
LAUNCH DATE 2026

Analysis: Intel Core 7 150UL vs Qualcomm Snapdragon X2E-88-100

Head-to-Head Benchmarks

The recorded data contains no direct head-to-head benchmark results for the Intel Core 7 150UL and the Qualcomm Snapdragon X2E-88-100. The benchmark arrays are empty, and the wins counters show zero for both processors. Without measured scores, the database cannot provide a performance comparison based on application tests, synthetic workloads, or gaming frames. The absence of data does not indicate parity; it simply means no comparative measurements have been recorded at this time. Both processors hold an identical percentile rank of 50 against all CPUs in the database, which places them at the median of the recorded population. This percentile tie is the only quantitative performance indicator available, and it does not differentiate between the two parts. The average benchmark score for each is listed as zero, confirming that no aggregate performance data has been compiled. For any builder relying on the database for a performance verdict, the honest conclusion is that the measurements do not yet exist to support one.

Architecture Differences

The two processors diverge sharply at the architectural level. The Intel Core 7 150UL uses Raptor Lake architecture with the Raptor Lake-PS codename, built on Intel's 10 nm process node and manufactured by Intel. The Qualcomm Snapdragon X2E-88-100 uses the Glymur codename within the Snapdragon X2 Elite generation, built on TSMC's 3 nm node. The process node gap is significant: 10 nm versus 3 nm indicates a much denser and more power-efficient transistor layout for the Qualcomm part, though the Intel part compensates with a different design philosophy.

Core counts differ substantially. The Intel chip has 10 cores and 12 threads, meaning it uses a hybrid arrangement where some cores provide extra threads. The Qualcomm chip has 18 cores and 18 threads, indicating a fully single-threaded core layout with no simultaneous multithreading. The Intel part's base clock is 1.70 GHz with a boost clock of 5.00 GHz, while the Qualcomm part runs at a 4.00 GHz base and 4.70 GHz boost. The Intel chip has a much lower base frequency but a higher peak boost, suggesting a design that scales aggressively under load. The Qualcomm part operates at a high base clock across all 18 cores, which points to sustained multi-core throughput rather than burst performance.

Cache hierarchies are completely different. The Intel Core 7 150UL uses 80 KB of L1 cache per core, 1.25 MB of L2 per core, and 12 MB of shared L3 cache. The Qualcomm Snapdragon X2E-88-100 uses 288 KB of L1 per core, 16 MB of L2 per module, and no listed L3 cache. The Qualcomm part also has a measured die size of 220 mm², while the Intel part has no die size recorded. The Intel chip integrates Iris Xe Graphics with 96 execution units, while the Qualcomm chip integrates Adreno X2-90 graphics.

Memory support highlights a fundamental platform split. The Intel chip supports DDR4 and DDR5 memory over a dual-channel bus, with no memory bandwidth figure recorded. The Qualcomm chip supports only LPDDR5X memory over a dual-channel bus, with a recorded memory bandwidth of 152.4 GB/s. The PCIe capabilities also differ: the Intel part provides Gen 4 with 8 lanes (CPU only), while the Qualcomm part provides Gen 5 with 12 lanes (CPU only). The Intel chip targets the desktop market segment and uses Intel Socket 1700, while the Qualcomm chip targets mobile and uses Qualcomm BGA 2343. The Intel part has a TDP of 15 watts, while the Qualcomm part has no TDP recorded. The Intel part releases on 2024-04-07, while the Qualcomm part releases on 2026-04-05. Neither part has an unlocked multiplier, and neither supports ECC memory. The Intel part has a part number listed as unknown, while the Qualcomm part carries the part number X2E88100.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X2E-88-100 has 18 cores and 18 threads. The Intel Core 7 150UL has 10 cores and 12 threads. The Qualcomm part provides 8 additional physical cores.

Q: Which processor has the higher boost clock?

A: The Intel Core 7 150UL reaches a boost clock of 5.00 GHz, while the Qualcomm Snapdragon X2E-88-100 boosts to 4.70 GHz. The Intel part is 0.30 GHz higher at peak boost.

Q: What memory types does each processor support?

A: The Intel Core 7 150UL supports DDR4 and DDR5 memory. The Qualcomm Snapdragon X2E-88-100 supports only LPDDR5X memory. Both use a dual-channel bus.

Q: Which processor uses a smaller manufacturing process?

A: The Qualcomm Snapdragon X2E-88-100 uses a 3 nm process from TSMC. The Intel Core 7 150UL uses a 10 nm process from Intel. The Qualcomm node is considerably smaller.

Q: What is the memory bandwidth of the Qualcomm processor?

A: The Qualcomm Snapdragon X2E-88-100 has a recorded memory bandwidth of 152.4 GB/s. The Intel Core 7 150UL has no memory bandwidth figure recorded.

Q: Do either processors support PCIe Gen 5?

A: Yes, the Qualcomm Snapdragon X2E-88-100 provides Gen 5 with 12 lanes (CPU only). The Intel Core 7 150UL provides Gen 4 with 8 lanes (CPU only).

Specification Differences

The two processors differ across every major specification field in the database. The Intel Core 7 150UL has 10 cores and 12 threads, while the Qualcomm Snapdragon X2E-88-100 has 18 cores and 18 threads. Base clocks are 1.70 GHz for Intel versus 4.00 GHz for Qualcomm. Boost clocks are 5.00 GHz for Intel versus 4.70 GHz for Qualcomm. The Intel TDP is 15 watts, while the Qualcomm TDP is not recorded. The Intel socket is Intel Socket 1700, while the Qualcomm socket is Qualcomm BGA 2343. The Intel architecture is Raptor Lake, while the Qualcomm architecture is not recorded. The codenames are Raptor Lake-PS for Intel and Glymur for Qualcomm. The process nodes are 10 nm for Intel and 3 nm for Qualcomm. The foundries are Intel and TSMC, respectively. The die size is not recorded for Intel, while Qualcomm measures 220 mm².

L1 cache is 80 KB per core for Intel versus 288 KB per core for Qualcomm. L2 cache is 1.25 MB per core for Intel versus 16 MB per module for Qualcomm. L3 cache is 12 MB shared for Intel, while Qualcomm has no L3 cache recorded. Memory support is DDR4 and DDR5 for Intel versus LPDDR5X for Qualcomm. Memory bandwidth is not recorded for Intel, while Qualcomm has 152.4 GB/s. PCIe is Gen 4 with 8 lanes for Intel versus Gen 5 with 12 lanes for Qualcomm. Integrated graphics are Iris Xe Graphics 96EU for Intel versus Adreno X2-90 for Qualcomm. The market segment is Desktop for Intel versus Mobile for Qualcomm. Release dates are 2024-04-07 for Intel and 2026-04-05 for Qualcomm. The part number is unknown for Intel and X2E88100 for Qualcomm. The generation fields read Core 7 (Raptor Lake-PS) for Intel and Snapdragon X2 (Elite) for Qualcomm.

Where Each One Wins

The Intel Core 7 150UL holds advantages in several measurable areas. It has the higher boost clock at 5.00 GHz versus 4.70 GHz, which favors workloads that respond to single-thread burst performance. It supports both DDR4 and DDR5 memory, giving platform flexibility for different memory types. Its TDP is recorded at 15 watts, which provides a concrete power envelope for system design. The Intel part uses Intel Socket 1700, a widely established desktop socket, and targets the desktop market segment. Its integrated Iris Xe Graphics with 96 execution units provides a known graphics baseline.

The Qualcomm Snapdragon X2E-88-100 counters with structural advantages. It has 18 cores versus 10, a 4.00 GHz base clock versus 1.70 GHz, and a smaller 3 nm process node versus 10 nm. Its L1 cache is 288 KB per core versus 80 KB, and its L2 is 16 MB per module versus 1.25 MB per core. It provides 152.4 GB/s of memory bandwidth, a figure the Intel part lacks entirely. It supports PCIe Gen 5 with 12 lanes versus Gen 4 with 8 lanes. Its die size is recorded at 220 mm². The Qualcomm part also has a later release date of 2026-04-05 compared to 2024-04-07, meaning it comes from a more recent design cycle. The mobile market segment and BGA 2343 socket indicate a platform intended for compact, integrated systems.

The Verdict

The recorded data does not include any benchmark scores, so the verdict must rest on specification differences. The Qualcomm Snapdragon X2E-88-100 is the more capable processor on paper in core count, base clock, cache capacity, memory bandwidth, PCIe generation, and manufacturing process. Its 18 cores, 4.00 GHz base clock, 288 KB L1 per core, 16 MB L2 per module, and 152.4 GB/s memory bandwidth position it as a high-throughput part for multi-core workloads. The 3 nm process node from TSMC suggests a modern, dense design. The mobile market segment and LPDDR5X memory support point toward laptops and portable systems where sustained performance per watt matters.

The Intel Core 7 150UL offers the higher boost clock at 5.00 GHz, which can benefit lightly threaded tasks that need peak frequency. Its support for DDR4 and DDR5 memory provides memory type flexibility, and its 15 watt TDP gives a clear power target. The desktop market segment and Intel Socket 1700 make it a drop-in option for existing desktop boards. However, the lower core count, smaller cache, older 10 nm process, and lack of recorded memory bandwidth place it behind the Qualcomm part in most structural metrics.

A builder choosing between the two should look at platform first. The Intel part suits a desktop build on Socket 1700 with either DDR4 or DDR5 memory. The Qualcomm part suits a mobile or compact design on BGA 2343 with LPDDR5X memory. For raw multi-core throughput, the Qualcomm part has the numbers. For peak single-core boost, the Intel part has the higher figure. The lack of benchmark data means no definitive performance ranking can be assigned, but the specification sheet clearly favors the Qualcomm Snapdragon X2E-88-100 in core count, cache, memory bandwidth, and process technology. The Intel Core 7 150UL remains a viable desktop option with a higher boost clock and flexible memory support. The database records both at the 50th percentile, indicating median standing among all tracked CPUs, but that equal rank reflects the absence of measured scores rather than proven equivalence.

DETAILED SPECIFICATIONS

SPECIFICATION
7 150UL
Snapdragon X2E-88-100
Core Specs
Cores
10
18 +80.0%
Threads
12
18 +50.0%
Base Clock (GHz)
1.7
4 +135.3%
Boost Clock (GHz)
5
4.7 -6.0%
Frequency (GHz)
1.7
4 +135.3%
Turbo Clock (GHz)
5
4.7 -6.0%
Multiplier
17
40 +135.3%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
1.25 MB (per core)
16 MB (per module)
L3 Cache
12 MB (shared)
—
Power
TDP (W)
15
—
PL1
15 W
—
PL2
55 W
—
Architecture
Architecture
Raptor Lake
—
Codename
Raptor Lake-PS
Glymur
Generation
Core 7 (Raptor Lake-PS)
Snapdragon X2 (Elite)
Process Size
10 nm
3 nm
Die Size
—
220 mm²
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
—
152.4 GB/s
ECC Memory
No
No
DDR4 Speed
3200 MT/s
—
DDR5 Speed
5200 MT/s
—
Platform
Socket
Intel Socket 1700
Qualcomm BGA 2343
PCIe
Gen 4, 8 Lanes(CPU only)
Gen 5, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 2 E-Cores: 8
12 + 6
E-Core Frequency
1200 MHz up to 3.7 GHz
3.4 GHz
AI/NPU
NPU
—
Yes / 80 TOPS
Graphics
Integrated Graphics
Iris Xe Graphics 96EU
Adreno X2-90
Other
Market
Desktop
Mobile
Production Status
Active
Active
Part Number
unknown
X2E88100
Package
FC-LGA16A
FC-BGA
Tj Max
100°C
—
View Core 7 150UL Details View Snapdragon X2E-88-100 Details