Intel Core 7 150HL vs Qualcomm Snapdragon X2E-88-100 Comparison

Intel
INTEL

Intel Core 7 150HL

CORE STATE Raptor Lake-PS
CORE SPECS 14 Cores / 20 Threads
CLOCK SPEED 2.4 Base / 5 GHz Turbo
CACHE 24 MB (shared)
MAX TDP 45W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024
VS
Unknown
CPU

Snapdragon X2E-88-100

CORE STATE Glymur
CORE SPECS 18 Cores / 18 Threads
CLOCK SPEED 4 Base / 4.7 GHz Turbo
CACHE —
MAX TDP —
ARCHITECTURE Glymur
nm
PROCESS 3 nm
LAUNCH DATE 2026

Analysis: Intel Core 7 150HL vs Qualcomm Snapdragon X2E-88-100

Head-to-Head Benchmarks

The recorded benchmark database contains no direct head-to-head comparisons for the Intel Core 7 150HL and the Qualcomm Snapdragon X2E-88-100. Both processors hold the identical 50th percentile ranking against all CPUs tracked in the database, and both carry an average benchmark score of zero. This means the database has not yet accumulated any measurable performance data for either unit. The winsA and winsB fields are both zero, confirming that neither processor has secured a victory in any recorded test. Without benchmark scores, percentile deltas, or rival comparison entries, the quantitative performance relationship between these two processors remains undefined.

The lack of head-to-head results should not be interpreted as equivalence. The two processors belong to different market segments, with the Intel unit classified as Desktop and the Qualcomm unit classified as Mobile. Their architectural designs diverge substantially, and the absence of recorded measurements prevents any statement about which one delivers higher throughput in a given workload. The database currently shows no multi-core score, no single-core score, and no application-specific results for either product. Consequently, every performance discussion must rely on the specification differences and architectural characteristics captured in the records, rather than on measured outcomes.

The percentile placement at 50 for both CPUs reflects the database's current state of incomplete data. It does not indicate parity in actual performance. As more benchmark submissions arrive for these processors, the percentile values will shift according to the recorded scores. Until then, the only defensible quantitative observations are those derived from the hardware specifications listed in the database.

FAQ

Q: Which processor has more cores according to the database?

A: The Qualcomm Snapdragon X2E-88-100 has 18 cores, while the Intel Core 7 150HL has 14 cores. The Qualcomm part also runs 18 threads, matching its core count, whereas the Intel part supports 20 threads from its 14 cores.

Q: What is the maximum boost clock recorded for each processor?

A: The Intel Core 7 150HL reaches a boost clock of 5.00 GHz, which is higher than the Qualcomm Snapdragon X2E-88-100's boost clock of 4.70 GHz. Conversely, the Qualcomm processor has a higher base clock at 4.00 GHz compared to the Intel processor's 2.40 GHz base clock.

Q: How do the manufacturing processes differ between the two chips?

A: The Intel Core 7 150HL is built on a 10 nm process at Intel's own foundry. The Qualcomm Snapdragon X2E-88-100 is fabricated on a 3 nm process at TSMC. The Qualcomm part also has a recorded die size of 220 mm², while no die size is listed for the Intel part.

Q: Which processor supports PCIe Gen 5, and how many lanes does it provide?

A: The Qualcomm Snapdragon X2E-88-100 supports PCIe Gen 5 with 12 CPU lanes. The Intel Core 7 150HL supports PCIe Gen 4 with 8 CPU lanes. This gives the Qualcomm processor both a newer PCIe generation and a higher lane count for CPU-attached devices.

Q: What integrated graphics do the two processors use?

A: The Intel Core 7 150HL uses Iris Xe Graphics with 96 execution units. The Qualcomm Snapdragon X2E-88-100 uses an Adreno X2-90 GPU. The database does not record any performance comparison between these two integrated graphics solutions.

Q: What memory types does each processor support?

A: The Intel Core 7 150HL supports both DDR4 and DDR5 memory over a dual-channel bus. The Qualcomm Snapdragon X2E-88-100 supports LPDDR5X memory over a dual-channel bus, with a recorded memory bandwidth of 152.4 GB/s. The Intel part has no memory bandwidth figure listed in the database.

Q: When was each processor released?

A: The Intel Core 7 150HL was released on April 7, 2024. The Qualcomm Snapdragon X2E-88-100 was released on April 5, 2026. Both processors are currently listed as Active in production status.

Architecture Differences

The Intel Core 7 150HL belongs to the Raptor Lake architecture, specifically the Raptor Lake-PS codename, and is part of the Core 7 generation. The Qualcomm Snapdragon X2E-88-100 uses the Glymur codename and is part of the Snapdragon X2 Elite generation. The Intel design follows a hybrid layout with 14 cores and 20 threads, allowing for multiple threads per core, while the Qualcomm design uses 18 cores and 18 threads, indicating a one-thread-per-core configuration.

The cache hierarchies differ in structure and capacity. The Intel processor provides 80 KB of L1 cache per core, 2 MB of L2 cache per core, and 24 MB of shared L3 cache. The Qualcomm processor provides 288 KB of L1 cache per core and 16 MB of L2 cache per module, with no L3 cache listed in the database. The Qualcomm L1 allocation is larger per core, but the Intel part has a substantial shared L3 pool that the Qualcomm part lacks entirely. This suggests different cache management philosophies: Intel aggregates a large last-level cache across all cores, while Qualcomm distributes cache closer to each core or module.

The manufacturing process is another major architectural separator. Intel uses a 10 nm node at its own foundry, while Qualcomm uses a 3 nm process at TSMC. The Qualcomm die measures 220 mm². No transistor count or die size is recorded for the Intel processor. The 3 nm process represents a smaller feature size, which typically allows higher transistor density and improved power efficiency per unit of area, though the database does not quantify these effects.

The integrated graphics differ entirely. Intel pairs the CPU with Iris Xe Graphics featuring 96 execution units. Qualcomm pairs its chip with an Adreno X2-90 GPU. The database records no performance data for either graphics solution, so no comparative statement about graphical capability can be made beyond the naming and execution unit count.

Memory architecture also separates the two. The Intel processor supports DDR4 and DDR5 memory, while the Qualcomm processor supports LPDDR5X. Both use dual-channel memory buses, but the Qualcomm part has a recorded memory bandwidth of 152.4 GB/s. The Intel part has no memory bandwidth figure in the database. The Qualcomm memory controller targets mobile power and bandwidth characteristics with LPDDR5X, while the Intel controller accepts both standard desktop DDR4 and DDR5 modules.

PCIe support differs as well. Intel provides Gen 4 with 8 CPU lanes; Qualcomm provides Gen 5 with 12 CPU lanes. The newer generation and higher lane count on the Qualcomm side allow more simultaneous high-speed traffic to attached devices, assuming the platform and devices support Gen 5. The Intel part's Gen 4 lanes remain compatible with a broad range of existing desktop hardware.

Specification Differences

The two processors differ across nearly every recorded specification field. The core counts are 14 for Intel and 18 for Qualcomm. Thread counts are 20 for Intel and 18 for Qualcomm. The base clock is 2.40 GHz for Intel and 4.00 GHz for Qualcomm. The boost clock is 5.00 GHz for Intel and 4.70 GHz for Qualcomm. The Intel part has a TDP of 45 W, while the Qualcomm part has no TDP value recorded.

The sockets are entirely different: Intel Socket 1700 for the Intel processor and Qualcomm BGA 2343 for the Qualcomm processor. The Intel processor is designed for the Desktop market segment, while the Qualcomm processor targets the Mobile market segment. Process nodes are 10 nm for Intel and 3 nm for Qualcomm, with foundries of Intel and TSMC respectively.

Cache specifications diverge as described previously. The Intel L1 is 80 KB per core, L2 is 2 MB per core, and L3 is 24 MB shared. The Qualcomm L1 is 288 KB per core, L2 is 16 MB per module, and there is no L3 entry. The Qualcomm die size is 220 mm²; the Intel die size is not recorded.

Memory support: Intel accepts DDR4 and DDR5, while Qualcomm accepts LPDDR5X. Both are dual-channel. The Qualcomm memory bandwidth is 152.4 GB/s; the Intel memory bandwidth is not recorded. Neither processor supports ECC memory.

PCIe: Intel uses Gen 4 with 8 CPU lanes; Qualcomm uses Gen 5 with 12 CPU lanes. Integrated graphics: Intel uses Iris Xe Graphics 96EU; Qualcomm uses Adreno X2-90. Neither processor has an unlocked multiplier.

Release dates are April 7, 2024 for Intel and April 5, 2026 for Qualcomm. Both are Active in production. The Qualcomm part number is X2E88100; the Intel part number is listed as unknown. Neither processor has a launch MSRP recorded in the database.

Where Each One Wins

Without recorded benchmark scores, the wins for each processor must be reasoned from the specification fields. The Intel Core 7 150HL holds advantages in several areas. Its boost clock of 5.00 GHz is higher than the Qualcomm boost clock of 4.70 GHz, which favors workloads that scale with single-thread frequency bursts. Its thread count of 20 exceeds the Qualcomm thread count of 18, providing more concurrent execution contexts. The Intel L3 cache of 24 MB shared offers a large unified pool for data shared across cores, which can benefit workloads with high data reuse. The Intel processor's support for both DDR4 and DDR5 memory gives platform flexibility across a wide range of desktop motherboards using Socket 1700. The 45 W TDP is explicitly recorded and positions the part for conventional desktop power envelopes. The Iris Xe Graphics with 96 execution units provides a known integrated graphics configuration for display output and light graphics work without a discrete GPU.

The Qualcomm Snapdragon X2E-88-100 holds advantages in other areas. Its 18 cores exceed the Intel core count of 14, which can benefit heavily parallel workloads that scale with physical core count rather than thread count. Its base clock of 4.00 GHz is substantially higher than the Intel base clock of 2.40 GHz, suggesting stronger sustained performance at the floor frequency. The 3 nm process at TSMC represents a far smaller manufacturing node than the Intel 10 nm process, which typically indicates higher transistor density and better power efficiency per operation, though the database records no efficiency measurements. The 288 KB L1 cache per core is larger than the Intel 80 KB per core, which can reduce latency for frequently accessed data within each core. The 152.4 GB/s memory bandwidth is the only recorded bandwidth figure in this comparison, giving the Qualcomm part a concrete memory throughput advantage. PCIe Gen 5 with 12 lanes exceeds the Intel Gen 4 with 8 lanes, enabling faster and more numerous direct connections to storage and accelerators. The 18-thread count matching the 18-core count suggests a simpler scheduling model without simultaneous multithreading.

The market segment distinction matters for use cases. The Intel processor is classified as Desktop, meaning it is intended for desktop systems with Socket 1700 motherboards, user-replaceable memory modules in DDR4 or DDR5 formats, and conventional cooling. The Qualcomm processor is classified as Mobile, meaning it is intended for portable or low-power systems using the BGA 2343 socket, LPDDR5X memory soldered or integrated into the platform, and a 220 mm² die. The release dates place the Intel part in April 2024 and the Qualcomm part in April 2026, so the Qualcomm design arrives roughly two years later in the database timeline.

The database shows zero wins for either processor in head-to-head tests, and the percentile rankings are identical at 50. This is a data limitation, not a performance conclusion. The specification analysis suggests the Intel part suits desktop-oriented workloads that benefit from high boost frequencies, a shared L3 cache, and broad memory compatibility. The Qualcomm part suits mobile-oriented workloads that benefit from many physical cores, a high base clock, a smaller process node, high memory bandwidth, and newer PCIe connectivity. Any claim of overall superiority would require benchmark measurements that the database has not yet recorded.

DETAILED SPECIFICATIONS

SPECIFICATION
7 150HL
Snapdragon X2E-88-100
Core Specs
Cores
14
18 +28.6%
Threads
20
18 -10.0%
Base Clock (GHz)
2.4
4 +66.7%
Boost Clock (GHz)
5
4.7 -6.0%
Frequency (GHz)
2.4
4 +66.7%
Turbo Clock (GHz)
5
4.7 -6.0%
Multiplier
24
40 +66.7%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
2 MB (per core)
16 MB (per module)
L3 Cache
24 MB (shared)
—
Power
TDP (W)
45
—
PL1
45 W
—
PL2
115 W
—
Architecture
Architecture
Raptor Lake
—
Codename
Raptor Lake-PS
Glymur
Generation
Core 7 (Raptor Lake-PS)
Snapdragon X2 (Elite)
Process Size
10 nm
3 nm
Die Size
—
220 mm²
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
—
152.4 GB/s
ECC Memory
No
No
DDR4 Speed
3200 MT/s
—
DDR5 Speed
5200 MT/s
—
Platform
Socket
Intel Socket 1700
Qualcomm BGA 2343
PCIe
Gen 4, 8 Lanes(CPU only)
Gen 5, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 6 E-Cores: 8
12 + 6
E-Core Frequency
1800 MHz up to 3.7 GHz
3.4 GHz
AI/NPU
NPU
—
Yes / 80 TOPS
Graphics
Integrated Graphics
Iris Xe Graphics 96EU
Adreno X2-90
Other
Market
Desktop
Mobile
Production Status
Active
Active
Part Number
unknown
X2E88100
Package
FC-LGA16A
FC-BGA
Tj Max
100°C
—
View Core 7 150HL Details View Snapdragon X2E-88-100 Details