Intel Core 5 211TE vs Qualcomm Snapdragon X2E-88-100 Comparison

Intel
INTEL

Intel Core 5 211TE

CORE STATE Bartlett Lake
CORE SPECS 10 Cores / 16 Threads
CLOCK SPEED 1.7 Base / 4.8 GHz Turbo
CACHE 20 MB (shared)
MAX TDP 45W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2025
VS
Unknown
CPU

Snapdragon X2E-88-100

CORE STATE Glymur
CORE SPECS 18 Cores / 18 Threads
CLOCK SPEED 4 Base / 4.7 GHz Turbo
CACHE —
MAX TDP —
ARCHITECTURE Glymur
nm
PROCESS 3 nm
LAUNCH DATE 2026

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,229
N/A
cinebench_cinebench_r15_singlecore
173
N/A
cinebench_cinebench_r20_multicore
5,124
N/A
cinebench_cinebench_r20_singlecore
723
N/A
cinebench_cinebench_r23_multicore
12,201
N/A
cinebench_cinebench_r23_singlecore
1,722
N/A
passmark_data_compression
133,434
N/A
passmark_data_encryption
7,231
N/A
passmark_extended_instructions
8,615
N/A
passmark_find_prime_numbers
72
N/A
passmark_floating_point_math
26,150
N/A
passmark_integer_math
33,991
N/A
passmark_multithread
11,685
N/A
passmark_physics
1,278
N/A
passmark_random_string_sorting
14,838
N/A
passmark_single_thread
1,408
N/A
passmark_singlethread
1,408
N/A

Analysis: Intel Core 5 211TE vs Qualcomm Snapdragon X2E-88-100

FAQ

Q: How does the Intel Core 5 211TE compare to the Qualcomm Snapdragon X2E-88-100 in terms of core count?

A: The Intel Core 5 211TE has 10 cores and 16 threads, while the Qualcomm Snapdragon X2E-88-100 has 18 cores and 18 threads. The Qualcomm part has more physical cores, but both have the same thread count of 18 on the Qualcomm side versus 16 on the Intel side.

Q: What process nodes do the two processors use?

A: The Intel Core 5 211TE is built on Intel's 10 nm process with a die size of 215 mm², while the Qualcomm Snapdragon X2E-88-100 uses TSMC's 3 nm process with a die size of 220 mm². The Qualcomm chip uses a more advanced manufacturing node.

Q: Which processor supports ECC memory?

A: The Intel Core 5 211TE supports ECC memory, while the Qualcomm Snapdragon X2E-88-100 does not. This makes the Intel part more suitable for error-sensitive workloads.

Q: What is the memory bandwidth difference between the two?

A: The Intel Core 5 211TE has a memory bandwidth of 76.8 GB/s with dual-channel DDR4 or DDR5 support, while the Qualcomm Snapdragon X2E-88-100 has a memory bandwidth of 152.4 GB/s with dual-channel LPDDR5X support. The Qualcomm part has double the memory bandwidth.

Q: How do the integrated graphics compare?

A: The Intel Core 5 211TE uses UHD Graphics 730, while the Qualcomm Snapdragon X2E-88-100 uses Adreno X2-90. The Qualcomm solution is integrated into a mobile-focused chip, while the Intel solution is part of a desktop processor.

Q: What is the release timeline for these parts?

A: The Intel Core 5 211TE was released on January 12, 2025, with a launch MSRP of $221. The Qualcomm Snapdragon X2E-88-100 was released on April 5, 2026, and has no recorded launch MSRP.

Architecture Differences

The Intel Core 5 211TE and Qualcomm Snapdragon X2E-88-100 represent fundamentally different design philosophies. The Intel part uses the Bartlett Lake codename and belongs to the Core 5 generation, built on Intel's 10 nm process. It has 10 cores with 16 threads, indicating a hybrid or efficiency-oriented arrangement where some cores do not add extra threads. The die size is 215 mm², and the chip is fabricated by Intel itself. The L1 cache is 80 KB per core, L2 cache is 1.25 MB per core, and L3 cache is 20 MB shared. It supports DDR4 and DDR5 memory in a dual-channel configuration with a memory bandwidth of 76.8 GB/s. ECC memory is supported, and PCIe connectivity is Gen 5 with 16 lanes from the CPU. The integrated graphics are UHD Graphics 730. The market segment is Desktop, and the socket is Intel Socket 1700.

The Qualcomm Snapdragon X2E-88-100 uses the Glymur codename and belongs to the Snapdragon X2 (Elite) generation. It is built on TSMC's 3 nm process with a die size of 220 mm². The chip has 18 cores and 18 threads, meaning each core has one thread. The L1 cache is 288 KB per core, and the L2 cache is 16 MB per module. There is no listed L3 cache. Memory support is LPDDR5X only, dual-channel, with a memory bandwidth of 152.4 GB/s. ECC memory is not supported. PCIe connectivity is Gen 5 with 12 lanes from the CPU. The integrated graphics are Adreno X2-90. The market segment is Mobile, and the socket is Qualcomm BGA 2343. The manufacturer is listed as Unknown, though the foundry is TSMC.

The architectural split is clear: Intel uses a desktop-oriented design with older process technology but broader memory compatibility and ECC support, while Qualcomm uses a mobile-oriented design with a more advanced 3 nm node and significantly higher memory bandwidth. The base clock on the Qualcomm part is 4.00 GHz, while the Intel part starts at 1.70 GHz. Boost clocks are closer: 4.80 GHz on Intel versus 4.70 GHz on Qualcomm. The Intel part has a TDP of 45 watts, while the Qualcomm part has no recorded TDP.

Head-to-Head Benchmarks

The database contains no head-to-head benchmark results between the Intel Core 5 211TE and the Qualcomm Snapdragon X2E-88-100. The Intel part has a full suite of benchmark scores across Cinebench and Passmark tests, while the Qualcomm part has no recorded benchmarks at all. The wins count for both processors is zero in direct comparison.

What the data does show is that the Intel Core 5 211TE has an average benchmark score of 15370, placing it at the 69th percentile among all CPUs. Its nearest rivals include the AMD EPYC 7543 with an average score of 15477 (0.7% higher), the AMD EPYC 7702P with an average score of 15130 (1.6% lower), the AMD Ryzen 3 7440U with an average score of 15682 (2% higher), and the Intel Core i3-1315U with an average score of 15022 (2.3% lower).

The Intel part's individual benchmark results are recorded. In Cinebench R23, it scores 12201 in multicore and 1722 in single-core. In Cinebench R20, the scores are 5124 multicore and 723 single-core. In Cinebench R15, it scores 1229 multicore and 173 single-core. Passmark results show a multithread score of 11685, a single-thread score of 1408, integer math at 33991, floating-point math at 26150, data compression at 133434, data encryption at 7231, extended instructions at 8615, find prime numbers at 72, physics at 1278, and random string sorting at 14838.

The Qualcomm Snapdragon X2E-88-100 has an average benchmark score of 0 and is at the 50th percentile, but this reflects the absence of recorded benchmark data rather than actual performance. Without direct head-to-head numbers, the comparison relies on architectural specifications and the Intel part's known benchmark behavior relative to its rivals.

Specification Differences

The two processors differ in nearly every measured field:

  • Cores: Intel has 10 cores, Qualcomm has 18 cores.
  • Threads: Intel has 16 threads, Qualcomm has 18 threads.
  • Base clock: Intel runs at 1.70 GHz, Qualcomm at 4.00 GHz.
  • Boost clock: Intel boosts to 4.80 GHz, Qualcomm to 4.70 GHz.
  • TDP: Intel is rated at 45 watts, Qualcomm has no recorded TDP.
  • Socket: Intel uses Intel Socket 1700, Qualcomm uses Qualcomm BGA 2343.
  • Codename: Intel is Bartlett Lake, Qualcomm is Glymur.
  • Process node: Intel is 10 nm, Qualcomm is 3 nm.
  • Foundry: Intel fabricates its own chip, Qualcomm uses TSMC.
  • Die size: Intel is 215 mm², Qualcomm is 220 mm².
  • L1 cache: Intel has 80 KB per core, Qualcomm has 288 KB per core.
  • L2 cache: Intel has 1.25 MB per core, Qualcomm has 16 MB per module.
  • L3 cache: Intel has 20 MB shared, Qualcomm has none listed.
  • Memory support: Intel supports DDR4 and DDR5, Qualcomm supports LPDDR5X only.
  • Memory bandwidth: Intel is 76.8 GB/s, Qualcomm is 152.4 GB/s.
  • ECC memory: Intel supports it, Qualcomm does not.
  • PCIe lanes: Intel has 16 lanes, Qualcomm has 12 lanes.
  • Integrated graphics: Intel uses UHD Graphics 730, Qualcomm uses Adreno X2-90.
  • Market segment: Intel is Desktop, Qualcomm is Mobile.
  • Release date: Intel launched January 12, 2025, Qualcomm launched April 5, 2026.
  • Launch MSRP: Intel is $221, Qualcomm has none recorded.
  • Part number: Intel is SRQDL, Qualcomm is X2E88100.

Both parts have locked multipliers, meaning neither supports overclocking. Both support Gen 5 PCIe. Both have dual-channel memory buses.

Where Each One Wins

The Intel Core 5 211TE wins in scenarios that require desktop integration and data integrity. Its support for ECC memory makes it suitable for workstation or entry-level server tasks where memory errors are unacceptable. The Intel part also supports both DDR4 and DDR5, providing flexibility in platform choices. The 16 PCIe Gen 5 lanes give it more direct CPU-attached expansion capacity than the Qualcomm chip's 12 lanes. The 45-watt TDP is a known quantity, which helps with cooling planning in desktop chassis. The part is already established in the database with a full set of benchmark results, and its 69th percentile ranking among all CPUs indicates it performs in the upper-middle range of the market. Its nearest rival data shows it is within 2.3% of the Intel Core i3-1315U and within 2% of the AMD Ryzen 3 7440U, meaning it competes closely with those parts in average benchmark score.

The Qualcomm Snapdragon X2E-88-100 wins in scenarios that prioritize power efficiency and memory throughput. The 3 nm process from TSMC is significantly more advanced than Intel's 10 nm node, which typically translates to better performance per watt, though no TDP is recorded to confirm this. The memory bandwidth of 152.4 GB/s is exactly double the Intel part's 76.8 GB/s, which matters for workloads that saturate memory, such as data compression or large in-memory datasets. The base clock of 4.00 GHz is much higher than the Intel part's 1.70 GHz, which gives the Qualcomm chip a strong starting point for sustained workloads. The 18 physical cores with 18 threads provide more parallel execution units than the Intel part's 10 cores and 16 threads. The L1 cache of 288 KB per core is over three times the Intel part's 80 KB per core, which helps with per-core performance in latency-sensitive tasks. The mobile market segment and BGA socket indicate this is designed for laptops or compact devices, where the higher memory bandwidth and advanced process node are advantageous.

The lack of benchmark data for the Qualcomm part means its actual performance cannot be verified from the database. The Intel part has verified scores that place it in a known range relative to its rivals.

The Verdict

The Intel Core 5 211TE is the choice for builders who need a desktop processor with ECC memory support, flexible memory options across DDR4 and DDR5, and more PCIe Gen 5 lanes. The recorded benchmark data shows it performs at the 69th percentile among all CPUs, with an average benchmark score of 15370. Its nearest rivals are all within 2.3% of its average score, indicating it sits in a competitive performance band. The 45-watt TDP is a known quantity for thermal design. The launch MSRP of $221 provides a fixed reference point for system planning.

The Qualcomm Snapdragon X2E-88-100 is the choice for mobile platforms that need a high base clock of 4.00 GHz, double the memory bandwidth at 152.4 GB/s, and a larger physical core count of 18. The 3 nm process from TSMC is the most advanced node among the two parts, and the 288 KB L1 cache per core is substantially larger. However, the database has no benchmark results for this part, so its real-world performance cannot be assessed. The 50th percentile ranking and average benchmark score of 0 reflect missing data, not measured performance.

For a user who needs verified performance and desktop features, the Intel Core 5 211TE has the data to back its capabilities. For a user who needs maximum memory bandwidth and core count in a mobile form factor, the Qualcomm Snapdragon X2E-88-100 offers those specifications, but without benchmark confirmation, its performance remains unverified in the database. The choice depends on whether verified benchmark data or raw architectural specifications matter more for the intended use case.

DETAILED SPECIFICATIONS

SPECIFICATION
5 211TE
Snapdragon X2E-88-100
Core Specs
Cores
10
18 +80.0%
Threads
16
18 +12.5%
Base Clock (GHz)
1.7
4 +135.3%
Boost Clock (GHz)
4.8
4.7 -2.1%
Frequency (GHz)
1.7
4 +135.3%
Turbo Clock (GHz)
4.8
4.7 -2.1%
Multiplier
17
40 +135.3%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
1.25 MB (per core)
16 MB (per module)
L3 Cache
20 MB (shared)
—
Power
TDP (W)
45
—
PL1
45 W
—
PL2
106 W
—
Architecture
Codename
Bartlett Lake
Glymur
Generation
Core 5 (Bartlett Lake)
Snapdragon X2 (Elite)
Process Size
10 nm
3 nm
Die Size
215 mm²
220 mm²
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
76.8 GB/s
152.4 GB/s
ECC Memory
Yes
No
DDR4 Speed
3200 MT/s
—
Platform
Socket
Intel Socket 1700
Qualcomm BGA 2343
Chipsets
W680, R680E, Q670e, Q670, H610E, H610
—
PCIe
Gen 5, 16 Lanes(CPU only)
Gen 5, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 6 E-Cores: 4
12 + 6
E-Core Frequency
1300 MHz up to 3.4 GHz
3.4 GHz
AI/NPU
NPU
—
Yes / 80 TOPS
Graphics
Integrated Graphics
UHD Graphics 730
Adreno X2-90
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$221
—
Part Number
SRQDL
X2E88100
Package
FC-LGA16A
FC-BGA
Tj Max
100°C
—
View Core 5 211TE Details View Snapdragon X2E-88-100 Details