Intel Core 3 N355 vs Qualcomm Snapdragon X2E-88-100 Comparison

Head-to-Head Benchmarks

The Intel Core 3 N355 has a full set of recorded benchmark scores, while the Qualcomm Snapdragon X2E-88-100 has no recorded benchmark scores in the database. This makes a direct numeric comparison impossible. The Intel chip's average benchmark score is 13,492, placing it in the 68th percentile of all CPUs. Its nearest rivals include the Intel Core i3-12100F with an average score of 13,494 and a delta of 0%, the Intel Core i5-9500 at 13,452 with a delta of +0.3%, and the Intel Core 5 120UL at 13,594 with a delta of -0.8%. The Snapdragon X2E-88-100 shows an average benchmark score of 0 and sits in the 50th percentile, with no rivals listed.

Looking at the Intel chip's individual scores, the Cinebench R23 multi-core result is 5,262, while the single-core result is 1,039. In Cinebench R20, the multi-core score is 3,612 and single-core is 509. The Cinebench R15 numbers are 822 for multi-core and 168 for single-core. Passmark results show a multi-thread score of 10,174, a single-thread score of 2,153, integer math at 33,894, floating point math at 22,695, and data compression at 117,435. The data encryption score is 8,121, extended instructions score is 5,968, and find prime numbers score is 27. Random string sorting is 14,706 and physics is 625.

Since the Snapdragon has no benchmark data recorded, the head-to-head comparison relies on what the database does record: architecture, memory, and connectivity differences. The Intel chip's results indicate a balanced mobile processor that competes within a narrow band of scores, as shown by its rivals all being within roughly one percent of each other's average scores.

Architecture Differences

The Intel Core 3 N355 uses the Twin Lake architecture, a Core 3 generation built on the Alder Lake-N family. It is manufactured on Intel's 10 nm process node at Intel foundries. The chip has 8 cores and 8 threads, with a base clock of 1.90 GHz and a boost clock of 3.90 GHz. Its thermal design power (TDP) is 15 watts. The cache hierarchy includes 96 KB of L1 per core, 2 MB of shared L2, and 6 MB of shared L3. Memory support includes DDR4, DDR5, and LPDDR5, with a single-channel memory bus and 38.4 GB/s of memory bandwidth. It does not support ECC memory. The PCIe interface is Gen 3 with 9 lanes (CPU only). The integrated graphics are UHD Graphics 770. It uses the Intel BGA 1264 socket.

The Qualcomm Snapdragon X2E-88-100 is a fundamentally different design. It uses the Glymur codename and is part of the Snapdragon X2 (Elite) generation. The manufacturing process is 3 nm at TSMC, and the die size is 220 mm². The chip has 18 cores and 18 threads, with a base clock of 4.00 GHz and a boost clock of 4.70 GHz. The TDP is not recorded in the database. The cache layout differs substantially: 288 KB of L1 per core and 16 MB of L2 per module, with no L3 cache listed. Memory support is limited to LPDDR5X with a dual-channel memory bus and 152.4 GB/s of memory bandwidth. ECC memory is not supported. The PCIe interface is Gen 5 with 12 lanes (CPU only). The integrated graphics are Adreno X2-90. It uses the Qualcomm BGA 2343 socket.

The process node difference is significant: 10 nm versus 3 nm. The Snapdragon has more than double the core count, and its base clock is more than double the Intel chip's base clock. The memory bandwidth is nearly four times higher on the Snapdragon. The cache organization also differs, with the Intel chip using a shared L2 and L3 design while the Snapdragon uses per-module L2. The PCIe generation difference is Gen 3 versus Gen 5.

Where Each One Wins

The Intel Core 3 N355 wins in having measurable performance data. The database records 17 benchmark scores for this chip, covering Cinebench R15, R20, and R23 in both multi-core and single-core, plus a full Passmark suite. Its average benchmark score of 13,492 places it in the 68th percentile of all CPUs. The recorded scores show a processor that handles single-threaded workloads with a Passmark single-thread score of 2,153 and Cinebench R23 single-core of 1,039. Multi-threaded performance is represented by a Passmark multi-thread score of 10,174 and Cinebench R23 multi-core of 5,262.

The Snapdragon X2E-88-100 wins in specifications that indicate higher theoretical capability. It has 18 cores versus 8, a 4.00 GHz base clock versus 1.90 GHz, a 4.70 GHz boost clock versus 3.90 GHz, and a 3 nm process versus 10 nm. Its memory bandwidth of 152.4 GB/s is substantially higher than the Intel chip's 38.4 GB/s. The dual-channel memory bus versus single-channel also favors the Snapdragon. The PCIe Gen 5 interface with 12 lanes versus Gen 3 with 9 lanes indicates more modern connectivity. The 220 mm² die size on TSMC's 3 nm process suggests a large, complex silicon design.

The Intel chip's 15-watt TDP is recorded, while the Snapdragon's TDP is not listed. The Intel chip also has a known release date of January 6, 2025, while the Snapdragon's release date is April 5, 2026. The Intel chip is marked as Active production status, and the Snapdragon is also Active.

The Verdict

The data presents a clear split: the Intel Core 3 N355 is the only chip of the two with actual performance measurements, while the Qualcomm Snapdragon X2E-88-100 offers a specification sheet that suggests higher raw capability but no verified benchmark results. For anyone selecting a processor based on recorded data, the Intel chip is the only one with evidence of performance. Its 68th percentile ranking and average score of 13,492 place it in line with desktop-class chips like the Intel Core i3-12100F and Intel Core i5-9500, based on the nearest rival data.

For the Snapdragon, the lack of benchmarks means any performance assessment is speculative. The specifications indicate a processor designed for high-throughput workloads: 18 cores, high clocks, and wide memory bandwidth. The 3 nm process at TSMC suggests modern efficiency characteristics. The 152.4 GB/s memory bandwidth and dual-channel bus point toward memory-intensive applications as a strength. However, without scores, the database cannot confirm these advantages in practice.

The Intel chip's 15-watt TDP and single-channel memory indicate a low-power design suited for thin-and-light mobile systems. Its 68th percentile ranking among all CPUs shows it performs above the median. The Snapdragon's missing TDP and larger core count suggest it targets a different performance class, but the data cannot verify how it executes workloads.

Strictly from the database, the Intel Core 3 N355 is the only chip with demonstrated performance. The Snapdragon X2E-88-100 remains an unmeasured quantity. Buyers who require verified benchmark data should select the Intel chip. Those considering the Snapdragon must rely on its specification sheet alone, since no recorded scores exist.

FAQ

Q: Which processor has a higher average benchmark score?

A: The Intel Core 3 N355 has an average benchmark score of 13,492. The Qualcomm Snapdragon X2E-88-100 has an average benchmark score of 0 because no benchmarks are recorded for it.

Q: How many cores does each processor have?

A: The Intel Core 3 N355 has 8 cores and 8 threads. The Qualcomm Snapdragon X2E-88-100 has 18 cores and 18 threads.

Q: What is the process node for each chip?

A: The Intel Core 3 N355 is manufactured on a 10 nm process at Intel. The Qualcomm Snapdragon X2E-88-100 is manufactured on a 3 nm process at TSMC.

Q: What memory types does each processor support?

A: The Intel Core 3 N355 supports DDR4, DDR5, and LPDDR5 with a single-channel memory bus and 38.4 GB/s bandwidth. The Qualcomm Snapdragon X2E-88-100 supports LPDDR5X with a dual-channel memory bus and 152.4 GB/s bandwidth.

Q: What is the boost clock speed for each processor?

A: The Intel Core 3 N355 has a boost clock of 3.90 GHz. The Qualcomm Snapdragon X2E-88-100 has a boost clock of 4.70 GHz.

Q: Which chip has a higher percentile ranking among all CPUs?

A: The Intel Core 3 N355 ranks in the 68th percentile of all CPUs. The Qualcomm Snapdragon X2E-88-100 ranks in the 50th percentile.

Specification Differences

| Specification | Intel Core 3 N355 | Qualcomm Snapdragon X2E-88-100 |

|---|---|---|

| Cores | 8 | 18 |

| Threads | 8 | 18 |

| Base Clock | 1.90 GHz | 4.00 GHz |

| Boost Clock | 3.90 GHz | 4.70 GHz |

| TDP | 15 W | Not recorded |

| Socket | Intel BGA 1264 | Qualcomm BGA 2343 |

| Architecture | Twin Lake | Not recorded |

| Codename | Twin Lake | Glymur |

| Generation | Core 3 (Alder Lake-N) | Snapdragon X2 (Elite) |

| Process Node | 10 nm | 3 nm |

| Foundry | Intel | TSMC |

| Die Size | Not recorded | 220 mm² |

| L1 Cache | 96 KB (per core) | 288 KB (per core) |

| L2 Cache | 2 MB (shared) | 16 MB (per module) |

| L3 Cache | 6 MB (shared) | Not recorded |

| Memory Support | DDR4, DDR5, LPDDR5 | LPDDR5X |

| Memory Bus | Single-channel | Dual-channel |

| Memory Bandwidth | 38.4 GB/s | 152.4 GB/s |

| ECC Memory | No | No |

| PCIe | Gen 3, 9 Lanes (CPU only) | Gen 5, 12 Lanes (CPU only) |

| Integrated Graphics | UHD Graphics 770 | Adreno X2-90 |

| Release Date | 2025-01-06 | 2026-04-05 |

| Part Number | SRPNT | X2E88100 |

| Multiplier Unlocked | No | No |

| Production Status | Active | Active |