Intel Core 3 N355 vs Qualcomm Snapdragon X1P-42-100 Comparison

The Verdict

The database contains a complete benchmark profile for the Intel Core 3 N355, while the Qualcomm Snapdragon X1P-42-100 has no recorded benchmark scores, no average score, and no rival comparisons. The Intel part sits in the 68th percentile of all CPUs in the database, with an average benchmark score of 13492, placing it within 0.3% of the Intel Core i5-9500 and statistically tied with the Intel Core i3-12100F. The Snapdragon, by contrast, holds a 50th percentile ranking with a zero average score, which reflects the absence of measured data rather than a performance verdict. For any workload where a numeric comparison is required, only the Intel Core 3 N355 can be evaluated. The Snapdragon X1P-42-100 remains an unmeasured entry, so any selection between the two must be based on architectural specifications alone.

Architecture Differences

The Intel Core 3 N355 uses the Twin Lake architecture, built on Intel's 10 nm process at Intel's own foundry. It is classified under the Core 3 generation and carries the Alder Lake-N family designation. The chip integrates 8 cores and 8 threads, with a base clock of 1.90 GHz and a boost clock of 3.90 GHz. Its thermal design power is 15 W. The processor uses the Intel BGA 1264 socket. Cache is organized as 96 KB of L1 per core, 2 MB of shared L2, and 6 MB of shared L3. Memory support covers DDR4, DDR5, and LPDDR5, but the memory bus is single-channel, which caps memory bandwidth at 38.4 GB/s. PCIe connectivity is Gen 3 with 9 CPU-only lanes. The integrated graphics solution is the UHD Graphics 770. The chip does not support ECC memory and its multiplier is locked. It launched on 2025-01-06 and remains in active production. Its part number is SRPNT.

The Qualcomm Snapdragon X1P-42-100 uses the Oryon codename and belongs to the Snapdragon X (Plus) generation. It is fabricated on a 4 nm process at TSMC. It also has 8 cores and 8 threads, but its base clock is 3.40 GHz with no boost clock listed. The TDP is 30 W, double that of the Intel part. The socket is Qualcomm BGA 2073. Cache is far larger: 288 KB of L1 per core, 12 MB of L2 per module, and 6 MB of shared L3. Memory support is limited to LPDDR5X, but the bus is dual-channel, yielding 135.2 GB/s of memory bandwidth, roughly 3.5 times the Intel figure. PCIe is Gen 4 with 12 CPU-only lanes. The integrated GPU is the Adreno X1-45. ECC is not supported and the multiplier is locked. The release date is 2024-08-27, and production status is active. The part number is X1P42100.

The architectural contrast is sharp. Intel uses a 10 nm node, a single-channel memory interface, and a 15 W envelope. Qualcomm uses a 4 nm node, a dual-channel interface, and a 30 W envelope. The Snapdragon carries substantially more L1 and L2 cache per core or module, and it supports newer PCIe Gen 4 lanes. The Intel chip supports a wider variety of memory types, including DDR4 and DDR5, while the Snapdragon is restricted to LPDDR5X. The Intel part has a listed boost clock, the Snapdragon does not. The Intel chip's process node is older, but its power target is lower.

Where Each One Wins

The Intel Core 3 N355 wins in every category where measured data exists. Its benchmark suite covers Cinebench R15, R20, and R23 in both single-core and multi-core tests, plus a range of PassMark workloads including data compression, data encryption, extended instructions, prime number finding, floating point math, integer math, multithread, physics, random string sorting, and single-thread tests. The Snapdragon has no recorded results in any of these categories, so it cannot claim a single measured win.

The Snapdragon wins on specification-level attributes. It has a higher base clock (3.40 GHz versus 1.90 GHz), a larger L1 cache (288 KB per core versus 96 KB per core), a larger L2 cache (12 MB per module versus 2 MB shared), dual-channel memory versus single-channel, higher memory bandwidth (135.2 GB/s versus 38.4 GB/s), PCIe Gen 4 versus Gen 3, and more PCIe lanes (12 versus 9). It also uses a smaller process node (4 nm versus 10 nm) and a different foundry (TSMC versus Intel). These are architectural advantages, but they are not validated by any benchmark score in the database.

The Intel part wins on power efficiency as defined by TDP, at 15 W versus 30 W. It also wins on memory flexibility, supporting three memory types rather than one. The Intel part has a boost clock, which the Snapdragon lacks in the recorded data. For software compatibility and measured performance, the Intel chip is the only one with evidence. For raw memory throughput and cache capacity, the Snapdragon has the specification advantage.

FAQ

Q: Which processor has a higher average benchmark score?

A: The Intel Core 3 N355 has an average benchmark score of 13492. The Qualcomm Snapdragon X1P-42-100 has an average score of 0, meaning no benchmark data is recorded for it.

Q: How does the Intel Core 3 N355 compare to its nearest rivals?

A: It is statistically tied with the Intel Core i3-12100F at a delta of 0%, and it is 0.3% ahead of the Intel Core i5-9500. It trails the Intel Core 5 120UL by 0.8% and leads the Intel Core i7-1250U by 1.1%.

Q: What are the core and thread counts for both processors?

A: Both the Intel Core 3 N355 and the Qualcomm Snapdragon X1P-42-100 have 8 cores and 8 threads.

Q: Which processor supports higher memory bandwidth?

A: The Qualcomm Snapdragon X1P-42-100 supports 135.2 GB/s over a dual-channel LPDDR5X bus. The Intel Core 3 N355 supports 38.4 GB/s over a single-channel bus.

Q: What is the TDP difference between the two chips?

A: The Intel Core 3 N355 has a TDP of 15 W. The Qualcomm Snapdragon X1P-42-100 has a TDP of 30 W.

Q: Which processor has a larger L2 cache?

A: The Qualcomm Snapdragon X1P-42-100 has 12 MB of L2 per module, while the Intel Core 3 N355 has 2 MB of shared L2.

Head-to-Head Benchmarks

The database lists no head-to-head benchmark results between the Intel Core 3 N355 and the Qualcomm Snapdragon X1P-42-100. The wins count is zero for both sides, and the head-to-head benchmark array is empty. This means there are no direct comparison scores to walk through. However, the Intel part has a full standalone benchmark profile, and those numbers can be interpreted relative to the rivals listed in the database.

In Cinebench R23 multi-core, the Intel Core 3 N355 scores 5262. In single-core, it scores 1039. The R20 results are 3612 multi-core and 509 single-core. The R15 results are 822 multi-core and 168 single-core. These scores place the chip in the 68th percentile of all CPUs, with an average score of 13492. Against the Intel Core i3-12100F, the delta is 0%, meaning the N355 matches a desktop-oriented quad-core part from a different segment. Against the Intel Core i5-9500, the N355 is 0.3% ahead. Against the Intel Core 5 120UL, it is 0.8% behind. Against the Intel Core i7-1250U, it is 1.1% ahead.

In PassMark workloads, the Intel part shows clear strengths. Data compression scores 117435, which is far above the floating point math result of 22695 and integer math result of 33894. Extended instructions score 5968, while random string sorting scores 14706. The multithread score is 10174, and the single-thread score is 2153. Physics scores 625, data encryption scores 8121, and find prime numbers scores 27. These numbers indicate that the chip handles compression and sorting tasks far better than prime number calculation, which is a common pattern for low-power mobile parts.

Because the Snapdragon has no recorded benchmarks, its relative performance cannot be stated in numeric terms. The only quantifiable comparison is architectural: the Snapdragon offers 135.2 GB/s of memory bandwidth versus 38.4 GB/s, 12 MB of L2 per module versus 2 MB shared, and a 3.40 GHz base clock versus 1.90 GHz. The Intel part counters with a 3.90 GHz boost clock, a 15 W TDP, and a full suite of measured scores. For a benchmark-driven analysis, the Intel Core 3 N355 is the only processor in this pairing with performance data, and that data places it in the upper half of the database. The Snapdragon X1P-42-100 remains a specification sheet without empirical validation.