Intel Core 3 N355 vs Qualcomm Snapdragon X1E-80-100 Comparison

Intel
INTEL

Intel Core 3 N355

CORE STATE Twin Lake
CORE SPECS 8 Cores / 8 Threads
CLOCK SPEED 1.9 Base / 3.9 GHz Turbo
CACHE 6 MB (shared)
MAX TDP 15W
ARCHITECTURE Twin Lake
nm
PROCESS 10 nm
LAUNCH DATE 2025
VS
Unknown
CPU

Snapdragon X1E-80-100

CORE STATE Oryon
CORE SPECS 12 Cores / 12 Threads
CLOCK SPEED 3.4 Base / 4 GHz Turbo
CACHE 6 MB (shared)
MAX TDP 35W
ARCHITECTURE Oryon
nm
PROCESS 4 nm
LAUNCH DATE 2024

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
822
N/A
cinebench_cinebench_r15_singlecore
168
N/A
cinebench_cinebench_r20_multicore
3,612
N/A
cinebench_cinebench_r20_singlecore
509
N/A
cinebench_cinebench_r23_multicore
5,262
N/A
cinebench_cinebench_r23_singlecore
1,039
N/A
passmark_data_compression
117,435
N/A
passmark_data_encryption
8,121
N/A
passmark_extended_instructions
5,968
N/A
passmark_find_prime_numbers
27
N/A
passmark_floating_point_math
22,695
N/A
passmark_integer_math
33,894
N/A
passmark_multithread
10,174
N/A
passmark_physics
625
N/A
passmark_random_string_sorting
14,706
N/A
passmark_single_thread
2,153
N/A
passmark_singlethread
2,153
N/A

Analysis: Intel Core 3 N355 vs Qualcomm Snapdragon X1E-80-100

Head-to-Head Benchmarks

The database contains no direct head-to-head benchmark entries for the Intel Core 3 N355 and the Qualcomm Snapdragon X1E-80-100. The Intel processor carries a full set of recorded scores across Cinebench and Passmark tests, while the Qualcomm part has no benchmark entries listed at all. This absence of direct comparison data means the analysis must rely on the Intel chip's measured performance against its own nearest rivals, and on the architectural and specification differences recorded for the two processors.

The Intel Core 3 N355 posts a multi-core score of 5262 in Cinebench R23, a single-core score of 1039 in the same test, and 3612 in Cinebench R20 multi-core. Its Passmark results include a multithread score of 10174, a single-thread score of 2153, and an integer math score of 33894. The floating point math score reaches 22695, while data compression hits 117435 and data encryption records 8121. Extended instructions score 5968, random string sorting records 14706, and physics processing lands at 625. The processor finds prime numbers at a score of 27.

Against its nearest rivals, the Intel Core 3 N355 shows an average benchmark score of 13492. The Intel Core i3-12100F sits at 13494 with a delta of 0 percent, meaning the two perform virtually identically on average. The Intel Core i5-9500 scores 13452, placing the N355 0.3 percent ahead. The Intel Core 5 120UL records 13594, putting the N355 0.8 percent behind that part. The Intel Core i7-1250U scores 13351, with the N355 leading by 1.1 percent. The N355 holds a percentile rank of 68 among all CPUs in the database.

The Qualcomm Snapdragon X1E-80-100 has no recorded benchmark scores, no average score, and no nearest rivals listed. Its percentile rank of 50 reflects the absence of measured performance data rather than any tested result. The data indicates the Intel part is fully characterized, while the Qualcomm part remains unmeasured in this database.

FAQ

Q: Which processor has more cores and threads?

A: The Qualcomm Snapdragon X1E-80-100 has 12 cores and 12 threads. The Intel Core 3 N355 has 8 cores and 8 threads.

Q: How do the clock speeds compare between the two processors?

A: The Qualcomm Snapdragon X1E-80-100 has a base clock of 3.40 GHz and a boost clock of 4.00 GHz. The Intel Core 3 N355 has a base clock of 1.90 GHz and a boost clock of 3.90 GHz.

Q: What memory types does each processor support?

A: The Intel Core 3 N355 supports DDR4, DDR5, and LPDDR5 memory. The Qualcomm Snapdragon X1E-80-100 supports LPDDR5X memory only.

Q: What is the memory bandwidth difference?

A: The Qualcomm Snapdragon X1E-80-100 records a memory bandwidth of 135.2 GB/s with a dual-channel memory bus. The Intel Core 3 N355 records 38.4 GB/s with a single-channel memory bus.

Q: Which processor has a smaller manufacturing process node?

A: The Qualcomm Snapdragon X1E-80-100 uses a 4 nm process node from TSMC. The Intel Core 3 N355 uses a 10 nm process node from Intel.

Q: What is the difference in TDP between the two?

A: The Qualcomm Snapdragon X1E-80-100 has a TDP of 35 watts. The Intel Core 3 N355 has a TDP of 15 watts.

Architecture Differences

The two processors come from fundamentally different design lineages. The Intel Core 3 N355 uses the Twin Lake architecture, listed under the Core 3 generation with the Alder Lake-N codename. It is built on a 10 nm process node at Intel's own foundry. The Qualcomm Snapdragon X1E-80-100 uses the Oryon codename, belongs to the Snapdragon X (Elite) generation, and is fabricated on a 4 nm process node at TSMC. The architecture field for the Qualcomm part is recorded as null, leaving the codename as the primary architectural identifier.

Cache layouts differ substantially. The Intel chip provides 96 KB of L1 cache per core, 2 MB of shared L2 cache, and 6 MB of shared L3 cache. The Qualcomm chip provides 288 KB of L1 cache per core, 12 MB of L2 cache per module, and 6 MB of shared L3 cache. The L3 cache sizes match at 6 MB, but the L1 and L2 allocations are significantly larger on the Qualcomm side. The L2 cache structure also differs in organization: Intel uses a shared pool, while Qualcomm assigns it per module.

The integrated graphics differ as well. Intel pairs the N355 with UHD Graphics 770. Qualcomm pairs the X1E-80-100 with Adreno X1-85. Both are mobile market segment parts with active production status. The Intel chip uses socket Intel BGA 1264, while the Qualcomm chip uses socket Qualcomm BGA 2073.

The PCIe configurations differ. Intel supports Gen 3 with 9 lanes (CPU only), while Qualcomm supports Gen 4 with 12 lanes (CPU only). The process node gap of 10 nm versus 4 nm suggests a significant generational difference in transistor density, though the database does not record transistor counts or die sizes for either part.

Specification Differences

The recorded specifications show clear divergences across nearly every category. Core count: 8 for Intel, 12 for Qualcomm. Thread count: 8 for Intel, 12 for Qualcomm. Base clock: 1.90 GHz for Intel, 3.40 GHz for Qualcomm. Boost clock: 3.90 GHz for Intel, 4.00 GHz for Qualcomm. TDP: 15 watts for Intel, 35 watts for Qualcomm. The Qualcomm part consumes more than double the thermal budget of the Intel part.

Memory support differs completely. Intel supports DDR4, DDR5, and LPDDR5. Qualcomm supports only LPDDR5X. Memory bus width: single-channel for Intel, dual-channel for Qualcomm. Memory bandwidth: 38.4 GB/s for Intel, 135.2 GB/s for Qualcomm, a difference of 96.8 GB/s in the Qualcomm's favor.

Cache specifications diverge at L1 and L2. Intel L1 is 96 KB per core, Qualcomm L1 is 288 KB per core. Intel L2 is 2 MB shared, Qualcomm L2 is 12 MB per module. L3 is identical at 6 MB shared. ECC memory support is false for both.

PCIe generation and lane count differ: Gen 3 with 9 lanes for Intel, Gen 4 with 12 lanes for Qualcomm. Integrated graphics: UHD Graphics 770 for Intel, Adreno X1-85 for Qualcomm. Release dates differ by roughly nine months: Intel released on 2025-01-06, Qualcomm on 2024-04-23. Both have locked multipliers. The Intel part number is SRPNT, the Qualcomm part number is X1E80100.

The Qualcomm chip has no benchmark data recorded, while the Intel chip has 17 benchmark entries. The Intel chip carries an average benchmark score of 13492 and a percentile rank of 68. The Qualcomm chip records an average score of 0 and a percentile rank of 50.

The Verdict

The data presents an unusual comparison because only one side has measured performance. The Intel Core 3 N355 has a complete benchmark profile and a percentile rank of 68 among all CPUs. Its average score of 13492 places it within 0.3 percent of the Intel Core i5-9500, exactly level with the Intel Core i3-12100F at a 0 percent delta, and 1.1 percent ahead of the Intel Core i7-1250U. The only rival it trails is the Intel Core 5 120UL, which leads by 0.8 percent.

The Qualcomm Snapdragon X1E-80-100 has no benchmark results in the database. Its percentile of 50 cannot be interpreted as a measured outcome, since the average benchmark score is listed as 0. The recorded specifications suggest a higher-tier part on paper: 12 cores versus 8, a 4.00 GHz boost clock versus 3.90 GHz, 12 MB of L2 per module versus 2 MB shared, dual-channel memory at 135.2 GB/s versus single-channel at 38.4 GB/s, and a 4 nm process versus 10 nm.

But the data cannot confirm whether the Qualcomm chip translates those specifications into actual performance advantages. The Intel chip is the only one with verified scores. Users selecting between these two based on database evidence would be choosing between a fully measured Intel part and an unmeasured Qualcomm part. The Intel chip offers confirmed performance data and a clear rivalry picture. The Qualcomm chip offers stronger paper specifications but no recorded benchmark evidence to validate them.

Where Each One Wins

The Intel Core 3 N355 wins in verified performance data availability. It has 17 benchmark entries across Cinebench R15, R20, R23, and Passmark tests, covering multi-core, single-core, integer math, floating point math, data compression, data encryption, extended instructions, physics, random string sorting, and prime number finding. Its average score of 13492 sits at the 68th percentile of all CPUs, with a rivalry cluster spanning from 13351 to 13594 in average scores.

The Qualcomm Snapdragon X1E-80-100 wins in raw specification counts. It records 12 cores and 12 threads, a 3.40 GHz base clock, a 4.00 GHz boost clock, 35 watts of TDP, 288 KB of L1 per core, 12 MB of L2 per module, dual-channel LPDDR5X memory at 135.2 GB/s, and Gen 4 PCIe with 12 lanes. The Intel chip counters with 8 cores, 8 threads, a 1.90 GHz base clock, a 3.90 GHz boost clock, 15 watts of TDP, 96 KB of L1 per core, 2 MB of shared L2, single-channel memory at 38.4 GB/s, and Gen 3 PCIe with 9 lanes.

The Intel chip also wins on release timing, having launched on 2025-01-06, while the Qualcomm chip launched on 2024-04-23. The Qualcomm chip wins on process node, using 4 nm at TSMC versus 10 nm at Intel. The Intel chip wins on memory flexibility, supporting DDR4, DDR5, and LPDDR5, while Qualcomm supports only LPDDR5X.

The data suggests the Qualcomm part is designed for higher bandwidth workloads, given its dual-channel memory and 135.2 GB/s throughput. The Intel part is designed for lower power operation, given its 15 watt TDP. The Intel chip's 6 MB of shared L3 matches the Qualcomm chip's 6 MB of shared L3, but the Qualcomm chip's larger L1 and L2 allocations indicate a different cache hierarchy philosophy. Without Qualcomm benchmark scores, the database cannot establish which processor wins in actual application performance. The Intel part holds the only measured performance claims, and those claims place it in a tight cluster with mid-range Intel desktop and mobile parts from previous generations.

DETAILED SPECIFICATIONS

SPECIFICATION
3 N355
Snapdragon X1E-80-100
Core Specs
Cores
8
12 +50.0%
Threads
8
12 +50.0%
Base Clock (GHz)
1.9
3.4 +78.9%
Boost Clock (GHz)
3.9
4 +2.6%
Frequency (GHz)
1.9
3.4 +78.9%
Turbo Clock (GHz)
3.9
4 +2.6%
Multiplier
1
34 +3300.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
96 KB (per core)
288 KB (per core)
L2 Cache
2 MB (shared)
12 MB (per module)
L3 Cache
6 MB (shared)
6 MB (shared)
Power
TDP (W)
15
35 +133.3%
PL2
—
80 W
Architecture
Architecture
Twin Lake
—
Codename
Twin Lake
Oryon
Generation
Core 3 (Alder Lake-N)
Snapdragon X (Elite)
Process Size
10 nm
4 nm
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5, LPDDR5
LPDDR5X
Memory Bus
Single-channel
Dual-channel
Memory Bandwidth
38.4 GB/s
135.2 GB/s
ECC Memory
No
No
DDR4 Speed
3200 MT/s
—
Platform
Socket
Intel BGA 1264
Qualcomm BGA 2073
PCIe
Gen 3, 9 Lanes(CPU only)
Gen 4, 12 Lanes(CPU only)
AI/NPU
NPU
—
Yes / 45 TOPS
Graphics
Integrated Graphics
UHD Graphics 770
Adreno X1-85
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
SRPNT
X1E80100
Package
FC-BGA16F
FC-BGA
Tj Max
105°C
—
View Core 3 N355 Details View Snapdragon X1E-80-100 Details