Intel Core 3 304 vs Qualcomm Snapdragon X1E-80-100 Comparison

Intel
INTEL

Intel Core 3 304

CORE STATE Wildcat Lake
CORE SPECS 5 Cores / 5 Threads
CLOCK SPEED 1.5 Base / 4.3 GHz Turbo
CACHE 6 MB (shared)
MAX TDP 15W
ARCHITECTURE Wildcat Lake
nm
PROCESS 3 nm
LAUNCH DATE 2026
VS
Unknown
CPU

Snapdragon X1E-80-100

CORE STATE Oryon
CORE SPECS 12 Cores / 12 Threads
CLOCK SPEED 3.4 Base / 4 GHz Turbo
CACHE 6 MB (shared)
MAX TDP 35W
ARCHITECTURE Oryon
nm
PROCESS 4 nm
LAUNCH DATE 2024

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
849
N/A
cinebench_cinebench_r15_singlecore
264
N/A
cinebench_cinebench_r20_multicore
4,160
N/A
cinebench_cinebench_r20_singlecore
587
N/A
cinebench_cinebench_r23_multicore
5,263
N/A
cinebench_cinebench_r23_singlecore
1,765
N/A
passmark_data_compression
114,775
N/A
passmark_data_encryption
8,501
N/A
passmark_extended_instructions
9,686
N/A
passmark_find_prime_numbers
68
N/A
passmark_floating_point_math
29,722
N/A
passmark_integer_math
24,640
N/A
passmark_multithread
11,625
N/A
passmark_physics
868
N/A
passmark_random_string_sorting
13,659
N/A
passmark_single_thread
3,614
N/A
passmark_singlethread
3,614
N/A

Analysis: Intel Core 3 304 vs Qualcomm Snapdragon X1E-80-100

Head-to-Head Benchmarks

The database contains no direct head-to-head benchmark results between the Intel Core 3 304 and the Qualcomm Snapdragon X1E-80-100. The head-to-head benchmark array is empty, and the win count for both processors is zero. Consequently, any comparison between these two parts must rely on the individual benchmark scores recorded for the Intel Core 3 304 and the architectural specifications of the Qualcomm Snapdragon X1E-80-100.

The Intel Core 3 304 has an extensive set of recorded measurements. In Cinebench R23, it scores 5263 in multicore and 1765 in single-core. In Cinebench R20, the scores are 4160 multicore and 587 single-core. Cinebench R15 results show 849 multicore and 264 single-core. PassMark results for the Intel part include a multithread score of 11625, a single-thread score of 3614, integer math at 24640, floating point math at 29722, extended instructions at 9686, data compression at 114775, data encryption at 8501, find prime numbers at 68, random string sorting at 13659, and physics at 868. The average benchmark score for the Intel Core 3 304 is 13745, placing it in the 68th percentile among all CPUs.

The Qualcomm Snapdragon X1E-80-100 has no benchmark scores recorded in the database. Its average benchmark score is 0, and it sits in the 50th percentile. With no measurements available for the Qualcomm part, the database cannot provide a numerical comparison of application performance between the two processors. The only quantitative performance context for the Intel part comes from its nearest rivals: the AMD Ryzen Threadripper PRO 3975WX (average score 13786, delta -0.3%), the Intel Core i7-8750H (average score 13868, delta -0.9%), the Intel Core 5 120UL (average score 13594, delta +1.1%), and the AMD EPYC 7443 (average score 13936, delta -1.4%). These deltas show the Intel Core 3 304 performing within roughly 1.4% of a wide range of desktop and mobile processors.

Architecture Differences

The two processors differ substantially in their core configurations and manufacturing details. The Intel Core 3 304 uses 5 cores and 5 threads, while the Qualcomm Snapdragon X1E-80-100 uses 12 cores and 12 threads. Neither part supports simultaneous multithreading, as thread counts equal core counts for both.

Clock speeds differ as well. The Intel part has a base clock of 1.50 GHz and a boost clock of 4.30 GHz. The Qualcomm part has a higher base clock of 3.40 GHz but a lower boost clock of 4.00 GHz. Thermal design power also differs: the Intel part is rated at 15 watts, while the Qualcomm part is rated at 35 watts.

The manufacturing process separates the two clearly. Intel fabricates the Core 3 304 on a 3 nm node at its own foundry. Qualcomm uses TSMC for the Snapdragon X1E-80-100, which is built on a 4 nm process. The Intel codename is Wildcat Lake, while the Qualcomm codename is Oryon.

Cache hierarchies show notable differences. The Intel Core 3 304 has 192 KB of L1 cache, 2.5 MB of L2 cache, and 6 MB of shared L3 cache. The Qualcomm Snapdragon X1E-80-100 has 288 KB of L1 cache per core, 12 MB of L2 cache per module, and 6 MB of shared L3 cache. The two parts share the same L3 capacity, but the Qualcomm part provides more L1 and L2 cache, with the L2 figure expressed per module rather than as a total.

Memory support diverges as well. The Intel part supports DDR5 and LPDDR5X memory over a single-channel bus, delivering 59.7 GB/s of memory bandwidth. The Qualcomm part supports only LPDDR5X memory but uses a dual-channel bus, delivering 135.2 GB/s. That is more than double the bandwidth of the Intel part.

PCIe connectivity differs. The Intel Core 3 304 provides Gen 4 with 6 CPU lanes, while the Qualcomm Snapdragon X1E-80-100 provides Gen 4 with 12 CPU lanes. Integrated graphics also differ: Intel uses Xe3 Graphics with 1 Xe unit, while Qualcomm uses the Adreno X1-85. Both parts are mobile segments, both are active in production, and neither has an unlocked multiplier or ECC memory support.

Where Each One Wins

The absence of benchmark data for the Qualcomm Snapdragon X1E-80-100 limits the analysis of specific workload advantages. The database records no scores for the Qualcomm part in any test category. Therefore, no measured win can be attributed to the Snapdragon for any workload.

For the Intel Core 3 304, the recorded data supports a profile of general-purpose performance. The PassMark multithread score of 11625 and the Cinebench R23 multicore score of 5263 indicate that the 5-core, 5-thread configuration handles parallel workloads at a moderate level. The single-thread score of 3614 in PassMark and 1765 in Cinebench R23 suggest that lightly threaded tasks perform adequately given the 4.30 GHz boost clock.

The Qualcomm part has structural advantages that would likely favor certain workloads, though no measurements confirm them. Its 12 cores, dual-channel memory with 135.2 GB/s bandwidth, and larger L2 cache configuration suggest an advantage in memory-intensive or highly parallel scenarios. Its 35-watt TDP and 4.00 GHz boost clock indicate a higher power ceiling than the Intel part. However, with no benchmark scores in the database, these remain architectural inferences rather than measured outcomes.

The Intel part, by contrast, has a lower TDP of 15 watts and a 3 nm process node, which suggests efficiency-focused operation. Its single-channel memory bus at 59.7 GB/s is a limiting factor for bandwidth-sensitive workloads. The database shows no wins recorded for either processor, so the practical interpretation is that the Intel part has verified performance data while the Qualcomm part does not.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X1E-80-100 has 12 cores and 12 threads. The Intel Core 3 304 has 5 cores and 5 threads.

Q: What are the boost clock speeds of each processor?

A: The Intel Core 3 304 has a boost clock of 4.30 GHz. The Qualcomm Snapdragon X1E-80-100 has a boost clock of 4.00 GHz.

Q: How much L3 cache does each processor have?

A: Both processors have 6 MB of shared L3 cache.

Q: Which processor has higher memory bandwidth?

A: The Qualcomm Snapdragon X1E-80-100 has a memory bandwidth of 135.2 GB/s over a dual-channel bus. The Intel Core 3 304 has 59.7 GB/s over a single-channel bus.

Q: Does the database contain any benchmark scores for the Qualcomm Snapdragon X1E-80-100?

A: No. The Qualcomm part has an empty benchmark array and an average benchmark score of 0. The Intel Core 3 304 has full benchmark results across Cinebench and PassMark tests.

Q: What is the process node difference between the two processors?

A: The Intel Core 3 304 is manufactured on a 3 nm process at Intel. The Qualcomm Snapdragon X1E-80-100 is manufactured on a 4 nm process at TSMC.

Specification Differences

| Specification | Intel Core 3 304 | Qualcomm Snapdragon X1E-80-100 |

| --- | --- | --- |

| Cores | 5 | 12 |

| Threads | 5 | 12 |

| Base clock | 1.50 GHz | 3.40 GHz |

| Boost clock | 4.30 GHz | 4.00 GHz |

| TDP | 15 watts | 35 watts |

| Socket | Intel BGA 1516 | Qualcomm BGA 2073 |

| Codename | Wildcat Lake | Oryon |

| Process node | 3 nm | 4 nm |

| Foundry | Intel | TSMC |

| L1 cache | 192 KB | 288 KB per core |

| L2 cache | 2.5 MB | 12 MB per module |

| L3 cache | 6 MB shared | 6 MB shared |

| Memory support | DDR5, LPDDR5X | LPDDR5X |

| Memory bus | Single-channel | Dual-channel |

| Memory bandwidth | 59.7 GB/s | 135.2 GB/s |

| PCIe | Gen 4, 6 lanes | Gen 4, 12 lanes |

| Integrated graphics | Intel Xe3 Graphics (1 Xe) | Adreno X1-85 |

| Launch MSRP | $309 | None recorded |

The Verdict

The database provides a complete performance record for the Intel Core 3 304 and no performance record for the Qualcomm Snapdragon X1E-80-100. The Intel part has an average benchmark score of 13745, placing it in the 68th percentile of all CPUs. Its nearest rivals, including the AMD Ryzen Threadripper PRO 3975WX and the Intel Core i7-8750H, sit within roughly 1.4% of its average score, indicating that the Intel part performs in line with established desktop and mobile processors despite its compact 5-core design.

The Qualcomm Snapdragon X1E-80-100 cannot be ranked on measured performance because no scores exist in the database. Its specifications, including 12 cores, a 4.00 GHz boost clock, and 135.2 GB/s of dual-channel memory bandwidth, describe a part with a different design intent. The 35-watt TDP and 4 nm TSMC process suggest a higher-power, higher-bandwidth architecture compared to the Intel part.

For users selecting based on recorded data, the Intel Core 3 304 is the only part with verified benchmark results. Its 68th percentile standing and competitive deltas against the nearest rivals provide a measurable baseline. The Qualcomm part remains unverified in this database, so any performance claim about it would lack supporting measurements. The Intel part also carries a launch MSRP of $309, while the Qualcomm part has no recorded launch price. The choice between the two depends entirely on whether verified benchmark data or architectural specifications take priority, as the database currently supports only the former for the Intel part and only the latter for the Qualcomm part.

DETAILED SPECIFICATIONS

SPECIFICATION
3 304
Snapdragon X1E-80-100
Core Specs
Cores
5
12 +140.0%
Threads
5
12 +140.0%
Base Clock (GHz)
1.5
3.4 +126.7%
Boost Clock (GHz)
4.3
4 -7.0%
Frequency (GHz)
1.5
3.4 +126.7%
Turbo Clock (GHz)
4.3
4 -7.0%
Multiplier
15
34 +126.7%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
192 KB
288 KB (per core)
L2 Cache
2.5 MB
12 MB (per module)
L3 Cache
6 MB (shared)
6 MB (shared)
Power
TDP (W)
15
35 +133.3%
PL2
80 W
Architecture
Codename
Wildcat Lake
Oryon
Generation
Core 3 (Wildcat Lake)
Snapdragon X (Elite)
Process Size
3 nm
4 nm
Foundry
Intel
TSMC
Memory
Memory Support
DDR5, LPDDR5X
LPDDR5X
Memory Bus
Single-channel
Dual-channel
Memory Bandwidth
59.7 GB/s
135.2 GB/s
ECC Memory
No
No
DDR5 Speed
6400 MT/s
Platform
Socket
Intel BGA 1516
Qualcomm BGA 2073
PCIe
Gen 4, 6 Lanes(CPU only)
Gen 4, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 1 E-Cores: 4
E-Core Frequency
1400 MHz up to 3.3 GHz
AI/NPU
NPU
Yes / 15 TOPS
Yes / 45 TOPS
Graphics
Integrated Graphics
Intel Xe3 Graphics (1 Xe)
Adreno X1-85
Other
Market
Mobile
Mobile
Production Status
Active
Active
Launch Price
$309
Part Number
SAE3K
X1E80100
Package
FC-BGA
FC-BGA
Tj Max
100°C
View Core 3 304 Details View Snapdragon X1E-80-100 Details