Intel Core 3 100UL vs Qualcomm Snapdragon X1P-64-100 Comparison

Intel
INTEL

Intel Core 3 100UL

CORE STATE Raptor Lake-PS
CORE SPECS 6 Cores / 8 Threads
CLOCK SPEED 1.2 Base / 4.5 GHz Turbo
CACHE 10 MB (shared)
MAX TDP 15W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024
VS
Unknown
CPU

Snapdragon X1P-64-100

CORE STATE Oryon
CORE SPECS 10 Cores / 10 Threads
CLOCK SPEED 3.4 Base
CACHE 6 MB (shared)
MAX TDP 35W
ARCHITECTURE Oryon
nm
PROCESS 4 nm
LAUNCH DATE 2024

Analysis: Intel Core 3 100UL vs Qualcomm Snapdragon X1P-64-100

Head-to-Head Benchmarks

The recorded database contains no direct head-to-head benchmark results for the Intel Core 3 100UL versus the Qualcomm Snapdragon X1P-64-100. The wins tally for each processor is zero, and the benchmark arrays are empty. Consequently, any performance comparison must be derived from the documented architectural and specification differences rather than from measured test scores.

Both processors hold a 50th percentile ranking against all CPUs in the database, which places them at the median of the distribution. This identical percentile indicates that, based on the aggregate of all recorded CPUs, neither part is positioned as an outlier in either direction. The absence of an average benchmark score for both units further confirms that no quantitative performance data has been captured for either chip.

The most significant observable difference lies in thread count and clock behavior. The Intel Core 3 100UL provides 6 cores and 8 threads, with a base clock of 1.20 GHz and a boost clock of 4.50 GHz. The Snapdragon X1P-64-100 provides 10 cores and 10 threads, with a base clock of 3.40 GHz and no listed boost clock. The Snapdragon starts from a much higher base frequency, but the Intel part can reach a substantially higher peak frequency when boosting.

Without benchmark scores, the relative impact of these clock differences cannot be quantified. The Intel processor has a thermal design power of 15 watts, while the Snapdragon has a thermal design power of 35 watts. This power envelope difference suggests that the Snapdragon may sustain higher continuous loads, but that claim is not supported by any measured performance data in the database.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X1P-64-100 has 10 cores, while the Intel Core 3 100UL has 6 cores. The Snapdragon also has 10 threads, whereas the Intel part has 8 threads.

Q: What are the base clock speeds of the two processors?

A: The Intel Core 3 100UL has a base clock of 1.20 GHz. The Qualcomm Snapdragon X1P-64-100 has a base clock of 3.40 GHz, which is 2.20 GHz higher.

Q: Does the Intel processor have a boost clock?

A: Yes, the Intel Core 3 100UL has a boost clock of 4.50 GHz. The Snapdragon X1P-64-100 has no boost clock listed in the database.

Q: What is the thermal design power for each processor?

A: The Intel Core 3 100UL has a thermal design power of 15 watts. The Qualcomm Snapdragon X1P-64-100 has a thermal design power of 35 watts.

Q: How do the cache configurations compare?

A: The Intel Core 3 100UL has 80 KB of L1 cache per core and 1.25 MB of L2 cache per core, with 10 MB of shared L3 cache. The Snapdragon X1P-64-100 has 288 KB of L1 cache per core and 12 MB of L2 cache per module, with 6 MB of shared L3 cache.

Q: What memory types do the two processors support?

A: The Intel Core 3 100UL supports DDR4 and DDR5 memory. The Qualcomm Snapdragon X1P-64-100 supports only LPDDR5X memory, with a recorded memory bandwidth of 135.2 GB/s.

Where Each One Wins

The Intel Core 3 100UL shows advantages in several structural areas. Its boost clock of 4.50 GHz is the highest frequency recorded for either processor, which may benefit workloads that depend on single-threaded peak performance. The Intel part also supports two memory types, DDR4 and DDR5, offering broader platform compatibility. Its thermal design power of 15 watts is substantially lower, which may indicate suitability for thermally constrained environments. The Intel processor uses the Intel Socket 1700 platform, and its integrated graphics are UHD Graphics 64EU.

The Qualcomm Snapdragon X1P-64-100 counters with a higher core count of 10 versus 6, and a higher base clock of 3.40 GHz versus 1.20 GHz. Its L1 cache per core is larger at 288 KB, and its L2 cache per module is larger at 12 MB. The Snapdragon has a higher thermal design power of 35 watts, and it supports a recorded memory bandwidth of 135.2 GB/s, a figure not listed for the Intel part. The Snapdragon also provides more PCIe lanes from the CPU, with 12 lanes versus 8 lanes, both at Gen 4. Its integrated graphics are Adreno X1-85, and it is built on a smaller process node.

The data does not include any benchmark results, so these wins are based entirely on specification differences. For multi-threaded workloads that scale with core count, the Snapdragon may hold an advantage. For workloads that rely on peak boost frequency, the Intel part may hold an advantage. Neither claim is confirmed by measured scores.

Specification Differences

The two processors differ across nearly every recorded specification field. The Intel Core 3 100UL has 6 cores and 8 threads; the Snapdragon X1P-64-100 has 10 cores and 10 threads. Base clocks differ significantly: 1.20 GHz for Intel versus 3.40 GHz for Qualcomm. The Intel part lists a boost clock of 4.50 GHz, while the Snapdragon lists none.

Thermal design power differs by 20 watts, with Intel at 15 watts and Qualcomm at 35 watts. The sockets are completely different: Intel Socket 1700 versus Qualcomm BGA 2073. The process nodes also differ: Intel uses a 10 nm process fabricated by Intel, while Qualcomm uses a 4 nm process fabricated by TSMC.

Cache layouts are distinct. Intel uses 80 KB of L1 per core, 1.25 MB of L2 per core, and 10 MB of shared L3. Qualcomm uses 288 KB of L1 per core, 12 MB of L2 per module, and 6 MB of shared L3. Memory support differs: Intel supports DDR4 and DDR5, while Qualcomm supports only LPDDR5X. Memory bandwidth is recorded only for Qualcomm at 135.2 GB/s; no bandwidth figure is listed for Intel.

PCIe configurations differ: Intel provides Gen 4 with 8 lanes from the CPU, while Qualcomm provides Gen 4 with 12 lanes from the CPU. Integrated graphics differ, with Intel using UHD Graphics 64EU and Qualcomm using Adreno X1-85. Market segments differ: Intel is classified as Desktop, Qualcomm as Mobile. Release dates are close, with Intel at 2024-04-07 and Qualcomm at 2024-04-23. Neither processor has a launch MSRP recorded. Neither has an unlocked multiplier. The Snapdragon has a part number of X1P64100, while the Intel part number is listed as unknown.

Architecture Differences

The Intel Core 3 100UL is based on the Raptor Lake architecture, with the codename Raptor Lake-PS. Its generation is listed as Core 3 (Raptor Lake-PS). The Qualcomm Snapdragon X1P-64-100 uses the Oryon codename, and its generation is listed as Snapdragon X (Plus). The Intel architecture is fabricated on a 10 nm node at Intel's foundry. The Qualcomm architecture is fabricated on a 4 nm node at TSMC.

The core count difference reflects a fundamental design divergence. Intel provides 6 cores with 8 threads, indicating support for simultaneous multithreading. Qualcomm provides 10 cores with 10 threads, indicating one thread per core. The Intel design has a lower base clock but a higher boost clock, while the Qualcomm design has a higher base clock and no boost clock listed.

Cache architecture also differs in structure. Intel allocates L1 and L2 per core, with a shared L3 pool of 10 MB. Qualcomm allocates L1 per core and L2 per module, with a smaller shared L3 pool of 6 MB. The L2 per module designation suggests a different clustering arrangement for the Oryon cores.

The memory architecture diverges as well. Intel supports dual-channel DDR4 and DDR5, while Qualcomm supports dual-channel LPDDR5X with a recorded bandwidth of 135.2 GB/s. The Intel part has no recorded memory bandwidth. PCIe connectivity differs in lane count, with Qualcomm offering 12 Gen 4 lanes from the CPU versus Intel's 8 Gen 4 lanes.

The integrated graphics solutions are entirely different in origin. Intel uses UHD Graphics 64EU, while Qualcomm uses Adreno X1-85. The market segment classification places Intel in the Desktop category and Qualcomm in the Mobile category. Both processors are listed as Active in production status, and both were released within the same month in 2024. Neither processor supports ECC memory, and neither has an unlocked multiplier.

DETAILED SPECIFICATIONS

SPECIFICATION
3 100UL
Snapdragon X1P-64-100
Core Specs
Cores
6
10 +66.7%
Threads
8
10 +25.0%
Base Clock (GHz)
1.2
3.4 +183.3%
Boost Clock (GHz)
4.5
—
Frequency (GHz)
1.2
3.4 +183.3%
Turbo Clock (GHz)
4.5
—
Multiplier
12
34 +183.3%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
1.25 MB (per core)
12 MB (per module)
L3 Cache
10 MB (shared)
6 MB (shared)
Power
TDP (W)
15
35 +133.3%
PL1
15 W
—
PL2
55 W
45 W
Architecture
Architecture
Raptor Lake
—
Codename
Raptor Lake-PS
Oryon
Generation
Core 3 (Raptor Lake-PS)
Snapdragon X (Plus)
Process Size
10 nm
4 nm
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
—
135.2 GB/s
ECC Memory
No
No
DDR4 Speed
3200 MT/s
—
DDR5 Speed
5200 MT/s
—
Platform
Socket
Intel Socket 1700
Qualcomm BGA 2073
PCIe
Gen 4, 8 Lanes(CPU only)
Gen 4, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 2 E-Cores: 4
—
E-Core Frequency
900 MHz up to 3.3 GHz
—
AI/NPU
NPU
—
Yes / 45 TOPS
Graphics
Integrated Graphics
UHD Graphics 64EU
Adreno X1-85
Other
Market
Desktop
Mobile
Production Status
Active
Active
Part Number
unknown
X1P64100
Package
FC-LGA16A
FC-BGA
Tj Max
100°C
—
View Core 3 100UL Details View Snapdragon X1P-64-100 Details