Intel Arc G3 vs Qualcomm Snapdragon X1P-64-100 Comparison

Intel
INTEL

Intel Arc G3

CORE STATE Panther Lake
CORE SPECS 14 Cores / 14 Threads
CLOCK SPEED 1.9 Base / 4.6 GHz Turbo
CACHE 18 MB (shared)
MAX TDP 25W
ARCHITECTURE Panther Lake
nm
PROCESS 3 nm
LAUNCH DATE 2026
VS
Unknown
CPU

Snapdragon X1P-64-100

CORE STATE Oryon
CORE SPECS 10 Cores / 10 Threads
CLOCK SPEED 3.4 Base
CACHE 6 MB (shared)
MAX TDP 35W
ARCHITECTURE Oryon
nm
PROCESS 4 nm
LAUNCH DATE 2024

Analysis: Intel Arc G3 vs Qualcomm Snapdragon X1P-64-100

Head-to-Head Benchmarks

The recorded data for the Intel Arc G3 and the Qualcomm Snapdragon X1P-64-100 contains no head-to-head benchmark entries, no wins for either processor, and no average benchmark scores. Both CPUs sit at the 50th percentile versus all CPUs in the database, which indicates that, based on the current measurements, neither part demonstrates a measurable performance advantage over the other in the available dataset. The absence of specific multi-thread or single-thread scores means that any comparison must rely on architectural and specification differences rather than direct numerical performance outcomes.

Without benchmark deltas, the database cannot confirm that the Intel Arc G3 is faster in any workload, nor can it confirm that the Qualcomm Snapdragon X1P-64-100 leads in any test. The percentile field, which is identical for both at 50, suggests that these two mobile processors are positioned in the same performance tier relative to the broader CPU landscape, but it does not quantify the margin between them. In the absence of score data, a builder evaluating these two options cannot draw conclusions about frame rates, rendering times, or compilation speeds from the database alone.

Where Each One Wins

Because the head-to-head benchmark array is empty and both parts record zero wins, the database provides no evidence that either CPU wins any specific workload category. The Intel Arc G3 carries 14 cores and 14 threads, while the Qualcomm Snapdragon X1P-64-100 carries 10 cores and 10 threads, which implies a potential multi-threaded advantage for the Intel part in theory, but no measured score confirms this. The Qualcomm part has a higher base clock at 3.40 GHz compared to the Intel part's 1.90 GHz, which could suggest an advantage in lightly threaded tasks that depend on raw clock speed, yet no benchmark data validates this either.

The database records no wins for either processor, so the practical answer is that neither CPU has a confirmed use-case win. A user choosing between these two should understand that the database cannot assign a performance winner for productivity, gaming, or battery life scenarios. The only factual statements that can be made are about architectural and specification differences, not about benchmark results.

Architecture Differences

The Intel Arc G3 is built on the Panther Lake codename and uses a 3 nm process node manufactured by Intel. Its generation is listed as "Arc G3 (Panther Lake)". The Qualcomm Snapdragon X1P-64-100 uses the Oryon codename and is fabricated by TSMC on a 4 nm process node. Its generation is listed as "Snapdragon X (Plus)". This process node difference of 3 nm versus 4 nm means the Intel part is built on a more advanced manufacturing technology, which can affect power efficiency and transistor density, though the database does not provide transistor counts or die sizes to quantify those effects.

Cache architecture differs notably between the two. The Intel Arc G3 has an L1 cache of 192 KB per core, an L2 cache of 2.5 MB per core, and an L3 cache of 18 MB shared. The Qualcomm part has a larger L1 cache at 288 KB per core, a much larger L2 cache at 12 MB per module, but a significantly smaller shared L3 cache at 6 MB. This gives the Qualcomm processor substantially more per-core and per-module cache for fast data access, while the Intel processor offers triple the shared L3 capacity. The total cache hierarchy favors Qualcomm for local data reuse and Intel for broader shared data across all cores.

The integrated graphics differ as well. The Intel Arc G3 pairs with an Arc B370 iGPU, while the Qualcomm Snapdragon X1P-64-100 uses an Adreno X1-85. The database does not provide benchmark scores for these graphics units, so no performance comparison can be made. Both processors support LPDDR5X memory with dual-channel memory buses, but the Intel part has a memory bandwidth of 136.5 GB/s versus the Qualcomm part's 135.2 GB/s, a difference of 1.3 GB/s in favor of Intel.

Specification Differences

The two processors differ across several core specification fields. The Intel Arc G3 has 14 cores and 14 threads, while the Qualcomm Snapdragon X1P-64-100 has 10 cores and 10 threads. Neither part supports hyperthreading or simultaneous multithreading, as core counts equal thread counts for both.

Base clock speeds differ substantially: the Intel part runs at 1.90 GHz, while the Qualcomm part runs at 3.40 GHz. The Intel Arc G3 has a boost clock of 4.60 GHz, but the Qualcomm part's boost clock field is null, meaning the database has no recorded boost clock for it. This makes the Intel part the only one with a confirmed maximum frequency.

Thermal design power differs as well. The Intel Arc G3 has a TDP of 25 watts, while the Qualcomm Snapdragon X1P-64-100 has a TDP of 35 watts. This indicates the Qualcomm part is rated for higher power consumption, which can affect cooling requirements and battery life in mobile devices.

The sockets are not interchangeable: the Intel part uses Intel BGA 2540, while the Qualcomm part uses Qualcomm BGA 2073. The PCIe implementation also differs. The Intel Arc G3 offers Gen 5 with 4 lanes (CPU only), while the Qualcomm part offers Gen 4 with 12 lanes (CPU only). This means the Intel part has a newer PCIe generation but fewer lanes, while the Qualcomm part has more lanes but an older generation.

Memory bandwidth is nearly identical at 136.5 GB/s for Intel versus 135.2 GB/s for Qualcomm. Both processors support LPDDR5X memory, neither supports ECC memory, and both have locked multipliers.

Release dates differ significantly. The Qualcomm Snapdragon X1P-64-100 was released on 2024-04-23, while the Intel Arc G3 was released on 2026-05-27, making the Qualcomm part roughly two years older. Both are listed as active production parts.

The Qualcomm part's manufacturer is listed as "Unknown", though the foundry is TSMC. The Intel part is manufactured by Intel itself.

FAQ

Q: Which processor has more cores?

A: The Intel Arc G3 has 14 cores and 14 threads, while the Qualcomm Snapdragon X1P-64-100 has 10 cores and 10 threads.

Q: What is the base clock difference between the two?

A: The Qualcomm Snapdragon X1P-64-100 has a base clock of 3.40 GHz, while the Intel Arc G3 has a base clock of 1.90 GHz. The Intel part has a boost clock of 4.60 GHz, but the Qualcomm part has no recorded boost clock.

Q: How do the cache sizes compare?

A: The Intel Arc G3 has 192 KB L1 per core, 2.5 MB L2 per core, and 18 MB shared L3. The Qualcomm part has 288 KB L1 per core, 12 MB L2 per module, and 6 MB shared L3.

Q: Which processor has a higher TDP?

A: The Qualcomm Snapdragon X1P-64-100 has a TDP of 35 watts, which is 10 watts higher than the Intel Arc G3's 25 watts.

Q: Do both processors support the same memory type?

A: Yes, both support LPDDR5X memory with dual-channel buses. The Intel part has a memory bandwidth of 136.5 GB/s, and the Qualcomm part has 135.2 GB/s.

Q: What process nodes are used?

A: The Intel Arc G3 is built on a 3 nm process by Intel, while the Qualcomm Snapdragon X1P-64-100 is built on a 4 nm process by TSMC.

The Verdict

The data in the database does not support a performance-based verdict between the Intel Arc G3 and the Qualcomm Snapdragon X1P-64-100, because there are no recorded benchmark scores, no wins for either part, and no nearest rivals to contextualize performance. Both processors sit at the 50th percentile versus all CPUs, which means the database treats them as statistically equivalent in overall standing.

What can be stated from the specifications is that the Intel Arc G3 offers more cores (14 versus 10), a higher boost clock (4.60 GHz), a smaller process node (3 nm versus 4 nm), a larger shared L3 cache (18 MB versus 6 MB), newer PCIe (Gen 5 versus Gen 4), and a higher memory bandwidth (136.5 GB/s versus 135.2 GB/s). The Qualcomm Snapdragon X1P-64-100 offers a much higher base clock (3.40 GHz versus 1.90 GHz), a larger L1 cache per core (288 KB versus 192 KB), a much larger L2 cache per module (12 MB versus 2.5 MB), more PCIe lanes (12 versus 4), a higher TDP (35 watts versus 25 watts), and an earlier release date.

A builder prioritizing multi-core throughput and modern connectivity would look to the Intel Arc G3 based on its core count, boost clock, and PCIe Gen 5 support. A builder prioritizing high base clock speed and substantial per-core cache might prefer the Qualcomm part, though the absence of a boost clock field makes its sustained performance unclear. The database cannot confirm that either processor delivers better real-world results, so the choice rests on the specification differences alone. The Intel part is newer, more power-efficient on paper, and has a more advanced process node, while the Qualcomm part has a higher base frequency and more cache at the lower levels of the hierarchy. Without benchmark data, any selection must be made on these architectural grounds rather than measured performance.

DETAILED SPECIFICATIONS

SPECIFICATION
G3
Snapdragon X1P-64-100
Core Specs
Cores
14
10 -28.6%
Threads
14
10 -28.6%
Base Clock (GHz)
1.9
3.4 +78.9%
Boost Clock (GHz)
4.6
—
Frequency (GHz)
1.9
3.4 +78.9%
Turbo Clock (GHz)
4.6
—
Multiplier
19
34 +78.9%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
192 KB (per core)
288 KB (per core)
L2 Cache
2.5 MB (per core)
12 MB (per module)
L3 Cache
18 MB (shared)
6 MB (shared)
Power
TDP (W)
25
35 +40.0%
PL2
—
45 W
Configurable TDP
15-45 W
—
Architecture
Codename
Panther Lake
Oryon
Generation
Arc G3 (Panther Lake)
Snapdragon X (Plus)
Process Size
3 nm
4 nm
Foundry
Intel
TSMC
Memory
Memory Support
LPDDR5X
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
136.5 GB/s
135.2 GB/s
ECC Memory
No
No
Platform
Socket
Intel BGA 2540
Qualcomm BGA 2073
PCIe
Gen 5, 4 Lanes(CPU only)
Gen 4, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 2 E-Cores: 12
—
E-Core Frequency
1500 MHz up to 3.3 GHz
—
LP E-Cores
4
—
AI/NPU
NPU
Yes / 46 TOPS
Yes / 45 TOPS
Graphics
Integrated Graphics
Arc B370
Adreno X1-85
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
SA4QZ
X1P64100
Package
FC-BGA
FC-BGA
Tj Max
100°C
—
View Arc G3 Details View Snapdragon X1P-64-100 Details