CPU Comparison

A

AMD

AMD

AMD Sempron 3400+

CORE STATE Roma

CORE SPECS 1 Cores / 1 Threads

CLOCK SPEED 2000 Base

CACHE —

MAX TDP 25W

ARCHITECTURE K8

nm

PROCESS 90 nm

LAUNCH DATE 2006

VS

i

Intel

INTEL

Core i5-540M

CORE STATE Arrandale

CORE SPECS 2 Cores / 4 Threads

CLOCK SPEED 2.53 Base / 3.07 GHz Turbo

CACHE 3 MB (shared)

MAX TDP 35W

ARCHITECTURE Westmere

nm

PROCESS 32 nm

LAUNCH DATE 2010

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

N/A

153

cinebench_cinebench_r20_multicore

N/A

640

cinebench_cinebench_r20_singlecore

N/A

90

cinebench_cinebench_r23_multicore

N/A

1,524

cinebench_cinebench_r23_singlecore

N/A

215

geekbench_multicore

N/A

781

geekbench_singlecore

N/A

404

DETAILED SPECIFICATIONS

SPECIFICATION

Sempron 3400+

i5-540M

Core Specs

Cores

1

2 +100.0%

Threads

1

4 +300.0%

Base Clock (GHz)

2,000

2.53 -99.9%

Boost Clock (GHz)

—

3.07

Frequency (GHz)

2,000

2.53 -99.9%

Turbo Clock (GHz)

—

3.07

Multiplier

10

19 +90.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

128 KB

64 KB (per core)

L2 Cache

256 KB

256 KB (per core)

L3 Cache

—

3 MB (shared)

Power

TDP (W)

25

35 +40.0%

Architecture

Architecture

K8

Westmere

Codename

Roma

Arrandale

Generation

Mobile Sempron (Roma)

Core i5 (Arrandale)

Process Size

90 nm

32 nm

Transistors

69 million

382 million

Die Size

—

81 mm²

Foundry

—

Intel

Memory

Memory Support

—

DDR3

Memory Bus

Single-channel

—

ECC Memory

No

No

Platform

Socket

AMD Socket 754

Intel Socket G1

PCIe

—

Gen 2

Graphics

Integrated Graphics

On certain motherboards (Chipset feature)

On certain motherboards (Chipset feature)

Other

Market

Mobile

Mobile

Production Status

End-of-life

End-of-life

Part Number

SMS3400BQX3LE

—

Package

µPGA

rPGA

View Sempron 3400+ Details View Core i5-540M Details