CPU Comparison
AMD
AMD Ryzen 9 7945HX3D
CORE STATE
Dragon Range
CORE SPECS
16 Cores / 32 Threads
CLOCK SPEED
2.3 Base / 5.4 GHz Turbo
CACHE
128 MB (shared)
MAX TDP
55W
ARCHITECTURE
Zen 4
PROCESS
5 nm
LAUNCH DATE
2023
VS
AMD
Ryzen Threadripper PRO 5955WX
CORE STATE
Chagall PRO
CORE SPECS
16 Cores / 32 Threads
CLOCK SPEED
4 Base / 4.5 GHz Turbo
CACHE
64 MB
MAX TDP
280W
ARCHITECTURE
Zen 3
PROCESS
7 nm
LAUNCH DATE
2022
PERFORMANCE BENCHMARKS
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
geekbench_multicore
geekbench_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
9 7945HX3D
Threadripper PRO 5955WX
Core Specs
Cores
16
16
0.0%
Threads
32
32
0.0%
Base Clock (GHz)
2.3
4
+73.9%
Boost Clock (GHz)
5.4
4.5
-16.7%
Frequency (GHz)
2.3
4
+73.9%
Turbo Clock (GHz)
5.4
4.5
-16.7%
Multiplier
23
40
+73.9%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
128 MB (shared)
64 MB
3D V-Cache
1x 64MB Slice
ā
Power
TDP (W)
55
280
+409.1%
PPT
55-75 W
ā
Architecture
Architecture
Zen 4
Zen 3
Codename
Dragon Range
Chagall PRO
Generation
Ryzen 9
(Zen 4 (Dragon Range))
Ryzen Threadripper
(Zen 3 (Chagall))
Process Size
5 nm
7 nm
Transistors
17,840 million
16,600 million
Die Size
2x 71 mm²
4x 81 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR4
Memory Bus
Dual-channel
Eight-channel
Memory Bandwidth
83.2 GB/s
204.8 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket FL1
AMD Socket WRX8
PCIe
Gen 5, 28 Lanes(CPU only)
Gen 4, 128 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
14 nm
Graphics
Integrated Graphics
Radeon 610M
ā
Other
Market
Mobile
Server/Workstation
Production Status
Active
Active
Part Number
100-000001086
100-000000447
Package
µFC-BGAFL1
sWRX8
Tj Max
100°C
ā