CPU Comparison

A

AMD

AMD

AMD Ryzen AI Max+ 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

A

AMD

AMD

Ryzen Threadripper PRO 3995WX

CORE STATE Castle Peak

CORE SPECS 64 Cores / 128 Threads

CLOCK SPEED 2.7 Base / 4.2 GHz Turbo

CACHE 256 MB

MAX TDP 280W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2020

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

4,558

7,190

cinebench_cinebench_r15_singlecore

643

1,014

cinebench_cinebench_r20_multicore

18,995

29,961

cinebench_cinebench_r20_singlecore

2,681

4,229

cinebench_cinebench_r23_multicore

45,228

71,338

cinebench_cinebench_r23_singlecore

6,385

10,071

passmark_data_compression

656,891

1,841,292

passmark_data_encryption

34,086

124,433

passmark_extended_instructions

52,958

106,423

passmark_find_prime_numbers

298

566

passmark_floating_point_math

123,833

277,715

passmark_integer_math

195,223

490,116

passmark_multithread

53,137

83,928

passmark_physics

3,448

5,498

passmark_random_string_sorting

72,894

188,574

passmark_single_thread

4,123

2,595

passmark_singlethread

4,123

2,595

geekbench_multicore

N/A

14,092

geekbench_singlecore

N/A

1,577

DETAILED SPECIFICATIONS

SPECIFICATION

AI Max+ 395

Threadripper PRO 3995WX

Core Specs

Cores

16

64 +300.0%

Threads

32

128 +300.0%

Base Clock (GHz)

3

2.7 -10.0%

Boost Clock (GHz)

5.1

4.2 -17.6%

Frequency (GHz)

3

2.7 -10.0%

Turbo Clock (GHz)

5.1

4.2 -17.6%

Multiplier

30

27 -10.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

80 KB (per core)

64 KB (per core)

L2 Cache

1 MB (per core)

512 KB (per core)

L3 Cache

64 MB (shared)

256 MB

Power

TDP (W)

55

280 +409.1%

Configurable TDP

45-120 W

—

Architecture

Architecture

Zen 5

Zen 2

Codename

Strix Halo

Castle Peak

Generation

Ryzen AI Max (Zen 5 (Strix Halo))

Ryzen Threadripper (Zen 2 (Castle Peak))

Process Size

4 nm

7 nm

Transistors

—

30,400 million

Die Size

2x 70.6 mm²

8x 74 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

LPDDR5X

DDR4

Memory Bus

Quad-channel

Eight-channel

Memory Bandwidth

256.0 GB/s

204.8 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket FP11

AMD Socket WRX8

PCIe

Gen 4, 16 Lanes(CPU only)

Gen 4, 128 Lanes(CPU only)

AMD Multi-Die

IO Process Size

—

14 nm

AI/NPU

NPU

Yes / 50 TOPS

—

Graphics

Integrated Graphics

Radeon 8060S

—

Other

Market

Mobile

Desktop

Production Status

Active

Active

Launch Price

—

$5489

Part Number

100-000001099

100-000000087100-100000087WOF

Package

FC-BGA

sWRX8

Tj Max

100°C

—

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