AMD Ryzen Embedded V3C48 vs Intel Xeon W-2150B Comparison

AMD
AMD

AMD Ryzen Embedded V3C48

CORE STATE Rembrandt
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.3 Base / 3.8 GHz Turbo
CACHE 16 MB (shared)
MAX TDP 45W
ARCHITECTURE Zen 3+
nm
PROCESS 6 nm
LAUNCH DATE 2022
VS
Intel
INTEL

Xeon W-2150B

CORE STATE Skylake-W
CORE SPECS 10 Cores / 20 Threads
CLOCK SPEED 3 Base / 4.5 GHz Turbo
CACHE 13.75 MB (shared)
MAX TDP 120W
ARCHITECTURE Skylake
nm
PROCESS 14 nm
LAUNCH DATE 2017

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,730
1,750
cinebench_cinebench_r15_singlecore
244
246
cinebench_cinebench_r20_multicore
7,212
7,294
cinebench_cinebench_r20_singlecore
1,018
1,029
cinebench_cinebench_r23_multicore
17,172
17,368
cinebench_cinebench_r23_singlecore
2,424
2,452
geekbench_multicore
N/A
8,481
geekbench_singlecore
N/A
1,314

Analysis: AMD Ryzen Embedded V3C48 vs Intel Xeon W-2150B

The Intel Xeon W-2150B and AMD Ryzen Embedded V3C48 are two very different processors that land in nearly the same performance bracket. The Xeon W-2150B is a 2017-era workstation chip built on Intel’s 14 nm Skylake-W architecture, while the V3C48 is a 2022 embedded processor from AMD based on the 6 nm Zen 3+ Rembrandt design. Despite a five-year gap in release dates and fundamentally different design goals, their average benchmark scores are separated by less than 1%, making this a comparison of platform trade-offs rather than raw compute dominance.

Head-to-Head Benchmarks

The benchmark data is remarkably one-sided, with the Intel Xeon W-2150B winning all six head-to-head comparisons. The margins, however, are extremely narrow. In Cinebench R15 multi-core, the Xeon scores 1750 against the AMD’s 1730, a 1.2% advantage. Single-core R15 is closer still: 246 versus 244, a 0.8% lead for Intel. Moving to Cinebench R20, the pattern holds — Intel wins multi-core 7294 to 7212 (1.1%) and single-core 1029 to 1018 (also 1.1%). The latest Cinebench R23 results repeat the same story: Intel leads multi-core 17368 to 17172 (1.1%) and single-core 2452 to 2424 (1.2%). The largest margin anywhere is just 1.2%, meaning these two chips are effectively inseparable in everyday threaded workloads.

What is more telling is how each chip’s average benchmark score compares to its nearest rivals. The Xeon W-2150B averages 4992, sitting right next to the Intel Core i3-12300HE (4995, -0.1%) and the AMD Ryzen 5 PRO 5650G (5002, -0.2%). The Ryzen Embedded V3C48 averages 4967, with its closest competitor being the Intel Core i5-12600HE (4980, -0.3%) and the AMD Ryzen 7 4700G (4949, 0.4%). Interestingly, the two chips in this comparison are also listed as rivals to each other: the V3C48’s rival list includes the Xeon W-2150B at 4992, a -0.5% delta. Both processors sit at the 59th percentile of all CPUs, reinforcing that they deliver nearly identical performance for their respective platforms.

The only benchmark where the AMD chip is not present is Geekbench, which lists scores only for the Intel processor (multi-core 8481, single-core 1314). The absence of Geekbench data for the V3C48 means the head-to-head comparison relies entirely on Cinebench results, where Intel edges ahead across the board. For any task that scales with Cinebench scores — rendering, encoding, or general multi-threaded compute — the Xeon W-2150B is technically faster, but the difference is within the noise of run-to-run variation.

Architecture Differences

The architectural gap between these two chips is substantial. The Intel Xeon W-2150B uses the Skylake-W design on a 14 nm process fabricated by Intel, with a die size of 484 mm². It packs 10 cores and 20 threads, with a base clock of 3.00 GHz and a boost clock of 4.50 GHz. Cache is organized as 64 KB L1 per core, 1 MB L2 per core, and 13.75 MB of shared L3. Memory support is DDR4 over a quad-channel bus, yielding 85.3 GB/s of bandwidth. PCIe connectivity is Gen 3 with 48 lanes from the CPU. This is a server/workstation part, now end-of-life, released in December 2017.

The AMD Ryzen Embedded V3C48, by contrast, uses the Zen 3+ (Rembrandt) architecture on a 6 nm process from TSMC. It has 8 cores and 16 threads, with a base clock of 3.30 GHz and a boost clock of 3.80 GHz. Cache is 64 KB L1 per core, 512 KB L2 per core, and 16 MB of shared L3. Memory support is DDR5 on a dual-channel bus, providing 76.8 GB/s of bandwidth. PCIe is Gen 4 with 20 lanes from the CPU. This is a desktop-class embedded part, still in active production, released in September 2022.

The process node difference is stark: 14 nm versus 6 nm, which explains why the AMD chip draws only 45 W TDP compared to the Intel’s 120 W. The Intel part compensates with a much higher boost clock (4.50 GHz vs 3.80 GHz) and more cores (10 vs 8). The L3 cache is larger on AMD (16 MB vs 13.75 MB), but Intel has more L2 per core (1 MB vs 512 KB). Memory bandwidth favors Intel on paper (85.3 GB/s vs 76.8 GB/s), but the AMD chip runs newer DDR5 memory. Both support ECC memory, a key feature for reliability-focused workloads. Neither has integrated graphics, and both are multiplier-locked. Sockets are entirely different: Intel Socket 2066 versus AMD Socket FP7.

The Verdict

The data shows a clear but marginal winner in raw performance: the Intel Xeon W-2150B takes every benchmark by roughly 1%. If you are building a system where Cinebench scores are the deciding factor, the Intel part is technically faster, but the margins are so thin that real-world differences will be imperceptible. The Xeon’s advantages are its extra two cores, higher boost clock, and quad-channel memory bandwidth. Its disadvantages are a 120 W TDP, older DDR4 memory, and an end-of-life status.

The AMD Ryzen Embedded V3C48 is the better choice for a different set of priorities. It delivers 96–99% of the Intel chip’s performance at 37.5% of the TDP (45 W vs 120 W). It is built on a far more modern 6 nm process, supports DDR5 and PCIe Gen 4, and remains in active production. For embedded or small-form-factor designs where power draw and thermals are critical, the V3C48 is the practical pick despite losing every benchmark. For a workstation where CPU socket longevity, memory bandwidth, and raw core count matter more than efficiency, the Xeon W-2150B is the data-backed choice, provided you can accept its higher power envelope and obsolete platform.

FAQ

Q: Which processor is faster in multi-core workloads?

A: The Intel Xeon W-2150B wins all multi-core tests. In Cinebench R23 multi-core, it scores 17368 versus the AMD’s 17172, a 1.1% lead. The margin is consistent across R15 (1750 vs 1730) and R20 (7294 vs 7212).

Q: Is the AMD Ryzen Embedded V3C48 significantly slower in single-core performance?

A: No. The Intel chip leads single-core tests by 0.8% to 1.2%. In Cinebench R23 single-core, the Xeon scores 2452 against the AMD’s 2424, a difference of just 28 points.

Q: What are the core and thread counts for each CPU?

A: The Intel Xeon W-2150B has 10 cores and 20 threads. The AMD Ryzen Embedded V3C48 has 8 cores and 16 threads.

Q: Which processor supports DDR5 memory?

A: Only the AMD Ryzen Embedded V3C48 supports DDR5, with a dual-channel bus. The Intel Xeon W-2150B supports DDR4 over a quad-channel bus.

Q: How do their TDP ratings compare?

A: The Intel Xeon W-2150B has a TDP of 120 W. The AMD Ryzen Embedded V3C48 has a TDP of 45 W, which is 75 W lower.

Q: Are both processors still in production?

A: No. The Intel Xeon W-2150B is end-of-life, while the AMD Ryzen Embedded V3C48 is active and currently produced.

Where Each One Wins

The Intel Xeon W-2150B wins every benchmark in this comparison, so it is the pick for pure compute performance. Its 10 cores and 20 threads give it a structural advantage over the AMD’s 8 cores and 16 threads, and its 4.50 GHz boost clock helps it edge ahead in single-threaded tasks. The quad-channel DDR4 memory bus delivers 85.3 GB/s of bandwidth, which is 8.5 GB/s higher than the AMD part. For workloads that are heavily multi-threaded — such as Cinebench-style rendering or server-side processing — the Intel chip is the data-backed winner, even if the margin is only around 1%. It also offers more PCIe lanes (48 Gen 3 lanes versus 20 Gen 4 lanes), which may matter for expansion-heavy workstation builds.

The AMD Ryzen Embedded V3C48 wins on efficiency and platform modernity. Its 45 W TDP is a fraction of the Intel’s 120 W, making it the logical choice for thermally constrained or power-sensitive embedded systems. It supports DDR5 memory and PCIe Gen 4, both of which are newer standards than the Intel’s DDR4 and Gen 3. The 6 nm process node versus Intel’s 14 nm means the AMD chip generates far less heat and requires a smaller cooling solution. Its 16 MB of shared L3 cache is larger than the Intel’s 13.75 MB, which can help in certain cache-sensitive workloads. For a system where uptime, low power draw, and a current socket (AMD Socket FP7) are more important than a few extra Cinebench points, the V3C48 is the better fit.

Specification Differences

The two processors differ in nearly every major specification category. The Intel Xeon W-2150B has 10 cores and 20 threads, while the AMD Ryzen Embedded V3C48 has 8 cores and 16 threads. Base clocks are 3.00 GHz for Intel and 3.30 GHz for AMD, but boost clocks are reversed: Intel reaches 4.50 GHz, AMD only 3.80 GHz. TDP is 120 W for Intel versus 45 W for AMD. Sockets are incompatible: Intel Socket 2066 versus AMD Socket FP7. Architecture is Skylake-W on 14 nm for Intel, versus Zen 3+ (Rembrandt) on 6 nm for AMD. The Intel chip uses a 484 mm² die, while the AMD die size is not listed. L2 cache differs per core: 1 MB for Intel, 512 KB for AMD. Shared L3 is 13.75 MB for Intel, 16 MB for AMD. Memory support is DDR4 quad-channel for Intel, DDR5 dual-channel for AMD, with bandwidth of 85.3 GB/s versus 76.8 GB/s. PCIe is Gen 3 with 48 lanes for Intel, Gen 4 with 20 lanes for AMD. Both support ECC memory and have no integrated graphics. Production status is end-of-life for Intel, active for AMD. Release dates are December 2017 for Intel and September 2022 for AMD.

DETAILED SPECIFICATIONS

SPECIFICATION
Embedded V3C48
W-2150B
Core Specs
Cores
8
10 +25.0%
Threads
16
20 +25.0%
Base Clock (GHz)
3.3
3 -9.1%
Boost Clock (GHz)
3.8
4.5 +18.4%
Frequency (GHz)
3.3
3 -9.1%
Turbo Clock (GHz)
3.8
4.5 +18.4%
Multiplier
33
30 -9.1%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
16 MB (shared)
13.75 MB (shared)
Power
TDP (W)
45
120 +166.7%
Configurable TDP
35-54W
Architecture
Architecture
Zen 3+
Skylake
Codename
Rembrandt
Skylake-W
Generation
Ryzen Embedded (Zen 3+ (Rembrandt))
Xeon W (Skylake-W)
Process Size
6 nm
14 nm
Die Size
484 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4
Memory Bus
Dual-channel
Quad-channel
Memory Bandwidth
76.8 GB/s
85.3 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket FP7
Intel Socket 2066
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 3, 48 Lanes(CPU only)
Other
Market
Desktop
Server/Workstation
Production Status
Active
End-of-life
Part Number
100-000000817
SR3LS
Package
FP7r2
FC-LGA2066
Tj Max
105°C
View Ryzen Embedded V3C48 Details View Xeon W-2150B Details