AMD Ryzen Embedded R2312 vs Intel Core i3-8145UE Comparison

Head-to-Head Benchmarks

The benchmark data presents an unusually close contest between the AMD Ryzen Embedded R2312 and the Intel Core i3-8145UE. Across all five Cinebench tests, the AMD part emerges victorious, but the margins are razor-thin. In the Cinebench R15 multicore test, the R2312 scores 338 against the i3-8145UE’s 337, a delta of just 0.3%. That single-point gap is within run-to-run noise, yet the pattern holds consistently across every workload.

The Cinebench R20 multicore test shows the R2312 at 1410 versus 1408 for the Intel chip, a 0.1% advantage. Single-core performance in R20 tells a similar story: 199 for AMD against 198 for Intel, a 0.5% lead that represents the largest relative margin in the entire comparison. Moving to the more demanding Cinebench R23 workload, the R2312 posts 3359 multicore and 474 single-core, while the i3-8145UE manages 3354 and 473, respectively. Each result favors AMD by 0.1% to 0.2%.

The aggregate benchmark scores reinforce this near-deadlock. The R2312 carries an average benchmark score of 1156, while the i3-8145UE sits at 1154 — a 0.2% difference. Both processors land in the 33rd percentile of all CPUs tracked, meaning they occupy the same performance tier relative to the broader market. The nearest rival lists confirm the parity: the R2312 is 0.2% ahead of the i3-8145UE, while the Intel chip is 0.2% behind the AMD part. Interestingly, both processors also bracket the AMD Opteron 4334, which scores 1155, and the Intel Core i5-4430 at 1149.

What stands out is the consistency of AMD’s wins. Five tests, five victories — but none exceeding half a percentage point. This is not a case of one architecture dominating another; it is a statistical tie broken by the slimmest of margins. The R2312 wins Cinebench R20 single-core by 0.5%, its best showing, and the remaining tests cluster between 0.1% and 0.3%. For practical purposes, these two chips deliver interchangeable compute performance in Cinebench workloads.

The Verdict

The data points to a clear, if narrow, conclusion: the AMD Ryzen Embedded R2312 wins every benchmark head-to-head against the Intel Core i3-8145UE. With a 5-0 record in the head-to-head table and a 0.2% advantage in average benchmark score, the R2312 is the better performer on paper. However, the magnitude of that victory — never more than 0.5% in any single test — means the choice between these two should hinge on factors other than raw compute speed.

Buyers prioritizing the absolute highest Cinebench scores, however marginal, should select the R2312. It leads in all five measured tests, and its 1156 average benchmark score edges out the i3-8145UE’s 1154. The AMD part also brings ECC memory support, a feature absent from the Intel chip, and a larger L1 cache (96 KB per core versus 64 KB) and L2 cache (512 KB per core versus 256 KB). For embedded applications where data integrity matters, ECC support alone could tip the decision.

The Intel Core i3-8145UE, meanwhile, offers a higher boost clock of 3.90 GHz against the R2312’s 3.50 GHz, yet that clock advantage does not translate into benchmark wins. The i3 also provides 16 PCIe Gen 3 lanes versus the R2312’s 8, making it the better choice for systems requiring more expansion bandwidth. Its smaller 10 nm process node, versus AMD’s 12 nm, suggests potential efficiency differences, though the TDP is identical at 15 watts for both.

In practical terms, neither chip will disappoint on performance — they are statistically inseparable in compute tasks. The verdict favors AMD by a hair, but the decision should weigh ECC support and cache capacity against PCIe lane count and process node.

Where Each One Wins

The AMD Ryzen Embedded R2312 wins in every measured benchmark category. In Cinebench R15 multicore, it takes 338 against Intel’s 337. In R20, it wins both multicore (1410 versus 1408) and single-core (199 versus 198). In R23, it repeats the sweep with 3359 multicore and 474 single-core. The R2312’s cache hierarchy is also superior on paper: 96 KB of L1 per core and 512 KB of L2 per core, versus 64 KB and 256 KB respectively for the i3-8145UE. Both share 4 MB of L3 cache.

The Intel Core i3-8145UE, despite losing every benchmark, holds advantages in other specifications. Its 3.90 GHz boost clock is 0.40 GHz higher than the R2312’s 3.50 GHz. It offers 16 PCIe Gen 3 lanes, double the AMD part’s 8 lanes. The i3 is built on Intel’s 10 nm process, compared to GlobalFoundries’ 12 nm node for the R2312. The Intel chip also targets the mobile segment, while the R2312 is a desktop-market processor, though both share a 15-watt TDP and dual-channel DDR4 memory support with identical 38.4 GB/s bandwidth.

For systems needing maximum PCIe expansion — such as multiple NVMe drives, high-speed networking cards, or additional accelerators — the i3-8145UE’s 16 lanes provide clear headroom. For embedded deployments where ECC memory is non-negotiable, the R2312 is the only option of the two. The AMD part’s larger per-core caches could benefit workloads with high cache reuse, even if the benchmark scores do not currently reflect a significant advantage.

FAQ

Q: Which processor has a higher average benchmark score?

A: The AMD Ryzen Embedded R2312 scores 1156 on average, while the Intel Core i3-8145UE scores 1154 — a 0.2% difference in favor of AMD.

Q: How many benchmark tests did each processor win?

A: The AMD Ryzen Embedded R2312 won all 5 head-to-head Cinebench tests. The Intel Core i3-8145UE won 0.

Q: What is the largest performance margin between the two in any single test?

A: The largest margin is in Cinebench R20 single-core, where the AMD R2312 leads by 0.5% (199 versus 198).

Q: Do both processors support ECC memory?

A: No. The AMD Ryzen Embedded R2312 supports ECC memory, while the Intel Core i3-8145UE does not.

Q: How do their PCIe lane counts differ?

A: The Intel Core i3-8145UE provides 16 PCIe Gen 3 lanes (CPU only), while the AMD Ryzen Embedded R2312 provides 8 PCIe Gen 3 lanes (CPU only).

Q: What are the boost clock speeds of each processor?

A: The Intel Core i3-8145UE boosts to 3.90 GHz, while the AMD Ryzen Embedded R2312 boosts to 3.50 GHz.

Architecture Differences

The AMD Ryzen Embedded R2312 and Intel Core i3-8145UE represent fundamentally different design philosophies. AMD’s part uses the Zen+ architecture, codenamed Picasso, built on a 12 nm process at GlobalFoundries. The die contains 4,940 million transistors across a 210 mm² area. Intel’s chip uses the Whiskey Lake architecture (Whiskey Lake-U), fabricated on Intel’s 10 nm process, though transistor count and die size are not listed in the data.

Both processors feature 2 cores and 4 threads, but their cache hierarchies diverge. The R2312 allocates 96 KB of L1 cache per core and 512 KB of L2 per core, while the i3-8145UE provides 64 KB of L1 and 256 KB of L2 per core. Both share 4 MB of L3 cache. The larger per-core caches on the AMD part could reduce memory latency for frequently accessed data, though benchmark results show only marginal real-world impact.

Memory support is similar on paper: both use DDR4 with dual-channel buses and identical 38.4 GB/s bandwidth. The critical difference is ECC memory support — the R2312 includes it, the i3-8145UE does not. This makes the AMD chip suitable for error-sensitive embedded workloads where silent data corruption is unacceptable.

PCIe connectivity differs significantly. The Intel chip exposes 16 Gen 3 lanes, while the AMD part offers only 8. For systems with multiple high-bandwidth peripherals, Intel’s allocation provides more flexibility. Both parts are locked (multiplier unlocked: false) and carry a 15-watt TDP.

Process technology favors Intel on paper: 10 nm versus 12 nm, though the benchmark data does not show a corresponding efficiency or performance benefit. The R2312’s integrated graphics is Radeon Vega 3, while Intel pairs its chip with UHD Graphics 620. Both target different market segments — AMD lists the R2312 as Desktop (with an embedded focus), while Intel classifies the i3-8145UE as Mobile. Release dates are separated by nearly four years: the Intel chip launched in September 2018, the AMD part in June 2022. Both remain in active production.