AMD Ryzen Embedded 9900X3D vs Intel Processor 300T Comparison

Head-to-Head Benchmarks

The database contains no recorded head-to-head benchmark results for the AMD Ryzen Embedded 9900X3D and the Intel Processor 300T. Both processors show an average benchmark score of 0 and a percentile rank of 50 among all CPUs in the database. Without measured performance data, a direct numerical comparison of their compute capabilities is not possible from the recorded information.

However, the specification data reveals differences that strongly indicate the expected performance relationship. The AMD Ryzen Embedded 9900X3D has 12 cores and 24 threads, while the Intel Processor 300T has 2 cores and 4 threads. The AMD part operates with a base clock of 4.40 GHz and boosts to 5.50 GHz. The Intel part runs at a base clock of 3.40 GHz and has no recorded boost clock. The AMD part also carries 128 MB of L3 cache, while the Intel part carries 6 MB of shared L3 cache. These are substantial gaps in core count, thread count, clock speeds, and cache capacity.

The AMD Ryzen Embedded 9900X3D also supports DDR5 memory with a recorded memory bandwidth of 89.6 GB/s. The Intel Processor 300T supports both DDR4 and DDR5 memory, but the database does not record a memory bandwidth figure for it. The AMD part uses PCIe Gen 5 with 24 CPU lanes. The Intel part uses PCIe Gen 5 with 16 CPU lanes. The AMD part includes Radeon Graphics as integrated graphics. The Intel part includes UHD Graphics 710.

Where Each One Wins

The AMD Ryzen Embedded 9900X3D wins clearly in multi-threaded workloads based on the recorded specifications. With 12 cores and 24 threads versus 2 cores and 4 threads, the AMD part has 6 times the core count and 6 times the thread count. Applications that scale across cores, such as video encoding, 3D rendering, compilation, and scientific computing, will show a decisive advantage for the AMD part. The higher base clock of 4.40 GHz versus 3.40 GHz also benefits single-threaded tasks, and the 5.50 GHz boost clock provides additional headroom for burst workloads.

The Intel Processor 300T wins in power efficiency per core. Its TDP is 35 watts, while the AMD Ryzen Embedded 9900X3D has a TDP of 120 watts. For workloads that are lightly threaded and run on one or two cores, the Intel part consumes far less power. The Intel part also supports DDR4 memory, which can be a practical advantage in systems where DDR4 modules are already available or cheaper to source. The database does not record a memory bandwidth figure for the Intel part, but DDR4 support broadens its compatibility with existing platforms.

The Intel Processor 300T has a launch MSRP of $82. The AMD Ryzen Embedded 9900X3D has no recorded launch MSRP. The Intel part also uses the Intel Socket 1700, while the AMD part uses AMD Socket AM5. These platform differences matter for system builders who already own a motherboard for one socket or the other.

Architecture Differences

The AMD Ryzen Embedded 9900X3D belongs to the 9000 series and uses the Granite Ridge codename. It is built on the Zen 5 (Granite Ridge) architecture. The process node is 4 nm, and the foundry is TSMC. The transistor count is recorded as 16,630 million. The die size is recorded as 2x 70.6 mm². The AMD part has an L1 cache of 80 KB per core and an L2 cache of 1 MB per core. The L3 cache is 128 MB.

The Intel Processor 300T belongs to the Raptor Lake architecture with the Raptor Lake-S codename. It is built on a 10 nm process node, and the foundry is Intel. The die size is 163 mm². The Intel part has an L1 cache of 80 KB per core and an L2 cache of 1.25 MB per core. The L3 cache is 6 MB shared.

The AMD part uses a chiplet design, as indicated by the 2x 70.6 mm² die size. The Intel part uses a monolithic design with a single 163 mm² die. The AMD part supports ECC memory, while the Intel part does not. The AMD part has an unlocked multiplier, while the Intel part does not. The AMD part was released on 2025-10-06, while the Intel part was released on 2024-01-07.

The AMD Ryzen Embedded 9900X3D uses 4 nm TSMC manufacturing, which is a more advanced node than the 10 nm Intel process used for the Intel Processor 300T. This node advantage contributes to the AMD part's higher clock speeds and lower power per transistor, though the AMD part's overall TDP is higher due to its larger core count. The 128 MB L3 cache on the AMD part is 21 times larger than the 6 MB L3 cache on the Intel part. This cache advantage benefits workloads that repeatedly access large datasets.

FAQ

Q: Which processor has more cores and threads?

A: The AMD Ryzen Embedded 9900X3D has 12 cores and 24 threads. The Intel Processor 300T has 2 cores and 4 threads.

Q: What are the clock speeds of each processor?

A: The AMD Ryzen Embedded 9900X3D has a base clock of 4.40 GHz and a boost clock of 5.50 GHz. The Intel Processor 300T has a base clock of 3.40 GHz and no recorded boost clock.

Q: Which processor supports ECC memory?

A: The AMD Ryzen Embedded 9900X3D supports ECC memory. The Intel Processor 300T does not support ECC memory.

Q: What memory types does each processor support?

A: The AMD Ryzen Embedded 9900X3D supports DDR5 memory. The Intel Processor 300T supports both DDR4 and DDR5 memory.

Q: What are the TDP ratings for each processor?

A: The AMD Ryzen Embedded 9900X3D has a TDP of 120 watts. The Intel Processor 300T has a TDP of 35 watts.

Q: Which processor has an unlocked multiplier?

A: The AMD Ryzen Embedded 9900X3D has an unlocked multiplier. The Intel Processor 300T does not have an unlocked multiplier.

The Verdict

The data indicates that the AMD Ryzen Embedded 9900X3D is the stronger processor for multi-threaded and high-performance workloads. Its 12-core, 24-thread configuration, 5.50 GHz boost clock, 128 MB L3 cache, and 89.6 GB/s memory bandwidth position it as a high-end desktop part. The Intel Processor 300T, with 2 cores, 4 threads, a 3.40 GHz base clock, and a 35-watt TDP, is suited for low-power, lightly threaded tasks.

The AMD part also offers ECC memory support, which is relevant for systems that require data integrity, such as entry-level servers or workstations. The Intel part lacks ECC support. The AMD part includes Radeon Graphics, while the Intel part includes UHD Graphics 710. Both provide integrated graphics, but the database does not record performance figures for either.

The Intel Processor 300T has a launch MSRP of $82. The AMD Ryzen Embedded 9900X3D has no recorded launch MSRP. The Intel part uses the Intel Socket 1700, while the AMD part uses AMD Socket AM5. System builders with an existing AM5 motherboard will find the AMD part easier to integrate, while those with an LGA 1700 motherboard will favor the Intel part.

The Intel part supports DDR4 and DDR5 memory, which gives it flexibility in memory selection. The AMD part supports only DDR5. The Intel part has 16 PCIe Gen 5 lanes, while the AMD part has 24 PCIe Gen 5 lanes. The AMD part provides more PCIe bandwidth for expansion cards, NVMe storage, or other peripherals.

The AMD Ryzen Embedded 9900X3D was released on 2025-10-06. The Intel Processor 300T was released on 2024-01-07. Both processors are listed as active in production status.

For users who prioritize raw compute throughput, multi-core scaling, and large cache capacity, the AMD Ryzen Embedded 9900X3D is the clear choice based on the recorded data. For users who prioritize low power consumption, dual-channel DDR4 compatibility, and a low launch price, the Intel Processor 300T is the appropriate option. The database does not include benchmark scores for either part, so the performance conclusions here are drawn entirely from the specification differences.

Specification Differences

| Field | AMD Ryzen Embedded 9900X3D | Intel Processor 300T |

|-------|---------------------------|----------------------|

| Cores | 12 | 2 |

| Threads | 24 | 4 |

| Base Clock | 4.40 GHz | 3.40 GHz |

| Boost Clock | 5.50 GHz | None recorded |

| TDP | 120 W | 35 W |

| Socket | AMD Socket AM5 | Intel Socket 1700 |

| Codename | Granite Ridge | Raptor Lake-S |

| Architecture | Zen 5 (Granite Ridge) | Raptor Lake |

| Process Node | 4 nm | 10 nm |

| Foundry | TSMC | Intel |

| Transistors | 16,630 million | None recorded |

| Die Size | 2x 70.6 mm² | 163 mm² |

| L1 Cache | 80 KB (per core) | 80 KB (per core) |

| L2 Cache | 1 MB (per core) | 1.25 MB (per core) |

| L3 Cache | 128 MB | 6 MB (shared) |

| Memory Support | DDR5 | DDR4, DDR5 |

| Memory Bandwidth | 89.6 GB/s | None recorded |

| ECC Memory | Yes | No |

| PCIe | Gen 5, 24 Lanes (CPU only) | Gen 5, 16 Lanes (CPU only) |

| Integrated Graphics | Radeon Graphics | UHD Graphics 710 |

| Multiplier Unlocked | Yes | No |

| Release Date | 2025-10-06 | 2024-01-07 |

| Launch MSRP | None recorded | $82 |

| Part Number | 100-000001368E | SRN3K |