AMD Ryzen Embedded 9900X3D vs Intel Core 7 150HL Comparison

AMD
AMD

AMD Ryzen Embedded 9900X3D

CORE STATE Granite Ridge
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 4.4 Base / 5.5 GHz Turbo
CACHE 128 MB
MAX TDP 120W
ARCHITECTURE Granite Ridge
nm
PROCESS 4 nm
LAUNCH DATE 2025
VS
Intel
INTEL

Core 7 150HL

CORE STATE Raptor Lake-PS
CORE SPECS 14 Cores / 20 Threads
CLOCK SPEED 2.4 Base / 5 GHz Turbo
CACHE 24 MB (shared)
MAX TDP 45W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024

Analysis: AMD Ryzen Embedded 9900X3D vs Intel Core 7 150HL

Where Each One Wins

The recorded data for these two desktop processors shows a clear split by workload type, though neither part has an outright victory in the provided benchmark set. The AMD Ryzen Embedded 9900X3D and the Intel Core 7 150HL both sit at the 50th percentile against all CPUs in the database, which suggests they occupy similar overall performance tiers despite very different internal designs.

The AMD Ryzen Embedded 9900X3D is built around 12 cores and 24 threads with a base clock of 4.40 GHz and a boost clock of 5.50 GHz. This combination favors workloads that scale across many threads, such as rendering, compilation, and heavy multitasking. The 128 MB of L3 cache, which is a defining feature of the X3D lineup, provides a substantial buffer for data reuse, which matters in gaming and certain database and scientific workloads. The higher boost clock of 5.50 GHz also gives the AMD part a single-thread advantage in the raw clock speed comparison.

The Intel Core 7 150HL counters with 14 cores and 20 threads, which is more physical cores but fewer threads overall. Its base clock of 2.40 GHz is significantly lower, and the boost clock of 5.00 GHz trails the AMD part by 500 MHz. However, the Intel chip uses a hybrid architecture that includes performance and efficiency cores, a detail that the database records as Raptor Lake architecture on a 10 nm process. This design allows the Intel part to handle mixed workloads with better power efficiency, as reflected in its 45 W TDP compared to the 120 W TDP of the AMD part.

In the absence of direct benchmark scores, the specification data indicates that the AMD Ryzen Embedded 9900X3D is better positioned for compute-heavy tasks that benefit from high thread counts and large cache. The Intel Core 7 150HL, with its lower TDP and hybrid core design, is better suited for environments where power draw is a constraint and where the workload mixes light and heavy threads.

Architecture Differences

The two processors come from different design philosophies and manufacturing processes. The AMD Ryzen Embedded 9900X3D uses the Granite Ridge codename and belongs to the Ryzen Embedded generation based on Zen 5 architecture. It is fabricated by TSMC on a 4 nm process node, with a transistor count of 16,630 million spread across a dual-chiplet design with a die size of 2x 70.6 mm². This modern process node allows for higher clock speeds and better transistor density compared to the Intel part.

The Intel Core 7 150HL uses Raptor Lake architecture with the Raptor Lake-PS codename. It is fabricated by Intel on a 10 nm process node, which is a generation behind the AMD part in process technology. The database does not record transistor count or die size for the Intel chip, so a direct comparison on those metrics is not possible from the available data.

Cache hierarchy differs substantially. The AMD part provides 80 KB of L1 cache per core, 1 MB of L2 cache per core, and 128 MB of L3 cache. The Intel part provides the same 80 KB of L1 cache per core, 2 MB of L2 cache per core, but only 24 MB of shared L3 cache. The AMD part has over five times the L3 cache capacity, which is significant for workloads that repeatedly access large datasets. The Intel part has double the L2 cache per core, which can help with more localized data access patterns.

Memory support also diverges. The AMD Ryzen Embedded 9900X3D supports DDR5 memory only, with a dual-channel memory bus and a recorded memory bandwidth of 89.6 GB/s. It also supports ECC memory, a feature that matters for reliability-sensitive applications. The Intel Core 7 150HL supports both DDR4 and DDR5 memory with a dual-channel memory bus, but the database does not record a memory bandwidth figure for it. The Intel part does not support ECC memory.

PCIe connectivity differs as well. The AMD part provides PCIe Gen 5 with 24 lanes from the CPU, while the Intel part provides PCIe Gen 4 with only 8 lanes from the CPU. This is a major difference for systems that rely on high-bandwidth expansion cards, storage devices, or GPUs. The AMD part supports the newer PCIe standard and triple the lane count.

The AMD part has an unlocked multiplier, which allows overclocking, while the Intel part is locked. The integrated graphics also differ: the AMD part uses Radeon Graphics, while the Intel part uses Iris Xe Graphics 96EU, which is a more capable integrated GPU for display and light graphics work. The AMD part uses AMD Socket AM5, while the Intel part uses Intel Socket 1700. The AMD part was released on October 6, 2025, while the Intel part was released on April 7, 2024.

The TDP difference is notable: the AMD part draws 120 W, while the Intel part draws 45 W. This makes the Intel part far more suitable for compact or passively cooled systems where heat dissipation is limited. The AMD part requires a more robust cooling solution given its higher power envelope.

The Verdict

The data indicates that the AMD Ryzen Embedded 9900X3D is the stronger choice for workloads that demand high multi-threaded throughput, large cache capacity, and modern platform features. Its 12 cores and 24 threads, combined with a 5.50 GHz boost clock and 128 MB of L3 cache, position it as the more capable compute processor. The PCIe Gen 5 support with 24 lanes also makes it the better option for systems that need fast storage and multiple expansion devices. The DDR5-only memory support and ECC capability further reinforce its suitability for server-like or professional workloads.

The Intel Core 7 150HL is the better choice for power-constrained environments. Its 45 W TDP, which is less than half of the AMD part's 120 W, makes it easier to cool and cheaper to run in always-on systems. The hybrid Raptor Lake architecture with 14 cores and 20 threads still provides solid multi-threading, and the dual memory support for DDR4 and DDR5 gives platform flexibility. The Iris Xe Graphics 96EU integrated GPU is more capable than the Radeon Graphics in the AMD part, which matters for systems that rely on integrated graphics for display output or light acceleration. The Intel part also has a longer production history, having launched in April 2024 versus October 2025 for the AMD part.

Neither processor has recorded benchmark scores in the database, so the percentile ranking of 50 for both parts reflects an absence of measured performance data rather than a verified tie. Buyers should select based on the specification alignment with their workload profile: the AMD part for maximum compute and cache, the Intel part for efficiency and flexibility.

FAQ

Q: Which processor has more cores?

A: The Intel Core 7 150HL has 14 cores, while the AMD Ryzen Embedded 9900X3D has 12 cores.

Q: Which processor has more threads?

A: The AMD Ryzen Embedded 9900X3D has 24 threads, while the Intel Core 7 150HL has 20 threads.

Q: What is the L3 cache difference between the two?

A: The AMD Ryzen Embedded 9900X3D has 128 MB of L3 cache, while the Intel Core 7 150HL has 24 MB of shared L3 cache. The AMD part has over five times the L3 capacity.

Q: Do both processors support DDR5 memory?

A: Yes, both support DDR5. However, the AMD Ryzen Embedded 9900X3D supports DDR5 only, while the Intel Core 7 150HL supports both DDR4 and DDR5.

Q: Which processor supports ECC memory?

A: Only the AMD Ryzen Embedded 9900X3D supports ECC memory. The Intel Core 7 150HL does not.

Q: What is the TDP of each processor?

A: The AMD Ryzen Embedded 9900X3D has a TDP of 120 W, while the Intel Core 7 150HL has a TDP of 45 W.

Q: Which processor has PCIe Gen 5 support?

A: The AMD Ryzen Embedded 9900X3D supports PCIe Gen 5 with 24 lanes from the CPU. The Intel Core 7 150HL supports PCIe Gen 4 with only 8 lanes from the CPU.

Q: Are both processors unlocked for overclocking?

A: No. The AMD Ryzen Embedded 9900X3D has an unlocked multiplier, while the Intel Core 7 150HL is locked.

Q: Which processor has a higher boost clock?

A: The AMD Ryzen Embedded 9900X3D has a boost clock of 5.50 GHz, while the Intel Core 7 150HL has a boost clock of 5.00 GHz.

Head-to-Head Benchmarks

The database contains no recorded head-to-head benchmark results for these two processors, and neither part has individual benchmark scores. The winsA and winsB fields are both zero, which confirms that no measured performance comparison exists in the current dataset. The percentileVsAllCpus value of 50 for both parts further indicates that neither has been positioned relative to other CPUs based on actual testing.

Given the absence of benchmark data, the comparison must rely on the specification differences that are recorded. The most significant performance-relevant differences are the clock speeds, cache sizes, and thread counts. The AMD Ryzen Embedded 9900X3D has a base clock of 4.40 GHz and a boost clock of 5.50 GHz, which are 2.00 GHz and 500 MHz higher respectively than the Intel Core 7 150HL's 2.40 GHz base and 5.00 GHz boost. Higher clocks translate directly to faster instruction execution per core, assuming the architectures are comparable in instructions per clock. The Zen 5 architecture in the AMD part is a newer design than the Raptor Lake architecture in the Intel part, and it is fabricated on a more advanced 4 nm process versus 10 nm, which typically yields better IPC and efficiency.

The thread count difference of 24 versus 20 gives the AMD part a 20% advantage in concurrent thread execution capacity. This matters for workloads that can saturate all available threads, such as video encoding, 3D rendering, and software compilation. The larger L3 cache of 128 MB versus 24 MB further amplifies the AMD part's advantage in data-intensive workloads, as more data can be held on-die and accessed at cache speed rather than fetching from memory. The memory bandwidth figure of 89.6 GB/s for the AMD part, while the Intel part has no recorded bandwidth, also suggests a higher ceiling for memory-bound operations.

The Intel part is not without advantages. Its 14 cores exceed the AMD part's 12 cores by two, which can help in scenarios where physical core count matters more than thread count, such as certain virtualization or containerized workloads. The 2 MB of L2 cache per core is double the AMD part's 1 MB per core, which can improve performance for workloads with strong local data reuse. The Iris Xe Graphics 96EU is a more capable integrated GPU than the Radeon Graphics in the AMD part, which makes the Intel part more suitable for systems that depend on integrated graphics for media playback, basic 3D acceleration, or multiple display outputs.

The power envelope difference is stark. The Intel part's 45 W TDP allows it to operate in systems with minimal cooling, including thin clients, industrial PCs, and fanless designs. The AMD part's 120 W TDP requires active cooling and a larger heatsink, which limits its use in compact form factors. The platform costs and cooling requirements are not recorded in the database, but the TDP figures alone indicate that the Intel part is the more flexible option for space-constrained deployments.

Specification Differences

The following fields differ between the AMD Ryzen Embedded 9900X3D and the Intel Core 7 150HL in the database:

  • Cores: 12 (AMD) versus 14 (Intel)
  • Threads: 24 (AMD) versus 20 (Intel)
  • Base clock: 4.40 GHz (AMD) versus 2.40 GHz (Intel)
  • Boost clock: 5.50 GHz (AMD) versus 5.00 GHz (Intel)
  • TDP: 120 W (AMD) versus 45 W (Intel)
  • Socket: AMD Socket AM5 (AMD) versus Intel Socket 1700 (Intel)
  • Codename: Granite Ridge (AMD) versus Raptor Lake-PS (Intel)
  • Generation: Ryzen Embedded (Zen 5, Granite Ridge) (AMD) versus Core 7 (Raptor Lake-PS) (Intel)
  • Process node: 4 nm (AMD) versus 10 nm (Intel)
  • Foundry: TSMC (AMD) versus Intel (Intel)
  • Transistors: 16,630 million (AMD) versus not recorded (Intel)
  • Die size: 2x 70.6 mm² (AMD) versus not recorded (Intel)
  • L2 cache: 1 MB per core (AMD) versus 2 MB per core (Intel)
  • L3 cache: 128 MB (AMD) versus 24 MB shared (Intel)
  • Memory support: DDR5 (AMD) versus DDR4, DDR5 (Intel)
  • Memory bandwidth: 89.6 GB/s (AMD) versus not recorded (Intel)
  • ECC memory: true (AMD) versus false (Intel)
  • PCIe: Gen 5, 24 lanes CPU only (AMD) versus Gen 4, 8 lanes CPU only (Intel)
  • Integrated graphics: Radeon Graphics (AMD) versus Iris Xe Graphics 96EU (Intel)
  • Release date: October 6, 2025 (AMD) versus April 7, 2024 (Intel)
  • Multiplier unlocked: true (AMD) versus false (Intel)
  • Part number: 100-000001368E (AMD) versus unknown (Intel)

Fields that are identical include the L1 cache of 80 KB per core, the dual-channel memory bus, and the desktop market segment. Both parts have an active production status. The launch MSRP is not recorded for either part, so no pricing comparison is possible from the data.

DETAILED SPECIFICATIONS

SPECIFICATION
Embedded 9900X3D
7 150HL
Core Specs
Cores
12
14 +16.7%
Threads
24
20 -16.7%
Base Clock (GHz)
4.4
2.4 -45.5%
Boost Clock (GHz)
5.5
5 -9.1%
Frequency (GHz)
4.4
2.4 -45.5%
Turbo Clock (GHz)
5.5
5 -9.1%
Multiplier
44
24 -45.5%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
2 MB (per core)
L3 Cache
128 MB
24 MB (shared)
Power
TDP (W)
120
45 -62.5%
PL1
45 W
PL2
115 W
PPT
230 W
Architecture
Architecture
Raptor Lake
Codename
Granite Ridge
Raptor Lake-PS
Generation
Ryzen Embedded (Zen 5 (Granite Ridge))
Core 7 (Raptor Lake-PS)
Process Size
4 nm
10 nm
Transistors
16,630 million
Die Size
2x 70.6 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
ECC Memory
Yes
No
DDR4 Speed
3200 MT/s
DDR5 Speed
5200 MT/s
Platform
Socket
AMD Socket AM5
Intel Socket 1700
Chipsets
X870E, X870, B850, B840, X670E, X670, B650E, B650, A620, X600¹
PCIe
Gen 5, 24 Lanes(CPU only)
Gen 4, 8 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 6 E-Cores: 8
E-Core Frequency
1800 MHz up to 3.7 GHz
AMD Multi-Die
IO Process Size
6 nm
Graphics
Integrated Graphics
Radeon Graphics
Iris Xe Graphics 96EU
Other
Market
Desktop
Desktop
Production Status
Active
Active
Part Number
100-000001368E
unknown
Package
FC-LGA1718
FC-LGA16A
Tj Max
95°C
100°C
Bundled Cooler
None
View Ryzen Embedded 9900X3D Details View Core 7 150HL Details