AMD Ryzen Embedded 9900X3D vs Intel Core 3 N350 Comparison

Head-to-Head Benchmarks

The recorded data shows a decisive performance gap between the AMD Ryzen Embedded 9900X3D and the Intel Core 3 N350, though direct benchmark scores are only available for the Intel part. The AMD chip has no benchmark entries in the database, so the comparison relies on architectural specifications and the Intel Core 3 N350's measured results.

The Intel Core 3 N350 delivers a Cinebench R23 multi-core score of 6274 and a single-core score of 885. In Cinebench R20, it scores 2635 multi-core and 371 single-core, while Cinebench R15 shows 632 multi-core and 89 single-core. PassMark tests reveal a multi-thread score of 7382, a single-thread score of 1974, and an average benchmark score of 9903. The Intel chip sits at the 66th percentile among all CPUs, placing it above the majority of processors tracked in the database.

The AMD Ryzen Embedded 9900X3D, by contrast, carries a 12-core, 24-thread configuration with a base clock of 4.40 GHz and a boost clock of 5.50 GHz. The Intel Core 3 N350 uses 8 cores and 8 threads, with a base clock of 0.10 GHz and a boost clock of 3.90 GHz. The core count differential alone suggests a substantial multi-threaded advantage for the AMD part, though no direct benchmark scores exist to quantify it.

Looking at the Intel chip's nearest rivals in the database, the Core 3 N350 scores 2% above the Intel Core i7-3770, which has an average score of 9706. It also sits 2.3% ahead of the Intel Core i5-1035G1 at 9684. The AMD EPYC 7F52, with an average score of 10159, beats the Core 3 N350 by 2.5%, and the Intel Xeon Platinum 8280 at 10230 leads by 3.2%. These deltas are narrow, indicating the Core 3 N350 clusters tightly with older desktop and server parts in terms of overall average performance.

The AMD part's 12 cores and 24 threads, combined with a 5.50 GHz boost clock, place it in a different performance tier entirely. The Intel part's 8 cores lack simultaneous multi-threading, as its thread count equals its core count. This means the AMD chip processes twice as many threads and operates at a significantly higher clock ceiling. The available data makes the performance hierarchy clear, even without direct head-to-head benchmark entries.

Where Each One Wins

The Intel Core 3 N350 wins in scenarios where low power consumption and compact integration matter. Its thermal design power is 7 watts, a figure that allows for fanless or minimal cooling solutions in embedded and mobile applications. The AMD Ryzen Embedded 9900X3D draws 120 watts, which is substantially higher and requires more robust thermal management. The Intel chip also supports DDR4, DDR5, and LPDDR5 memory, giving system designers flexibility across different memory ecosystems. Its single-channel memory bus with 38.4 GB/s bandwidth suits lighter workloads where memory throughput is not the bottleneck.

The AMD Ryzen Embedded 9900X3D wins in compute-heavy tasks. Its 12 cores and 24 threads deliver parallel processing capability that the Intel chip cannot match. The 128 MB of L3 cache, combined with 1 MB of L2 cache per core and 80 KB of L1 cache per core, provides a large data footprint for workloads that benefit from cache residency. The AMD chip's PCIe Gen 5 interface with 24 lanes offers high-bandwidth connectivity for accelerators, storage, and networking, while the Intel part's PCIe Gen 3 with 9 lanes limits expansion options. ECC memory support on the AMD chip makes it suitable for error-sensitive computing environments, whereas the Intel part lacks ECC capability.

For single-threaded responsiveness, the AMD chip's 5.50 GHz boost clock gives it a strong advantage over the Intel chip's 3.90 GHz boost. The Intel chip's base clock of 0.10 GHz is exceptionally low, indicating aggressive power-saving behavior at idle, but this does not translate to peak performance. The AMD chip's 4.40 GHz base clock ensures consistent performance under sustained load.

In the database, the Intel Core 3 N350's average benchmark score of 9903 places it at the 66th percentile, which indicates it outperforms most CPUs in the database. However, the AMD part has no recorded benchmark scores and a 50th percentile ranking, which reflects the absence of measurement data rather than an actual performance level. The architectural specifications strongly favor the AMD chip in raw compute, memory bandwidth, cache capacity, and I/O throughput.

Architecture Differences

The AMD Ryzen Embedded 9900X3D belongs to the 9000 series and uses the Granite Ridge codename, built on Zen 5 architecture. It is manufactured on a 4 nm process by TSMC and contains 16,630 million transistors across a die size of 2x 70.6 mm². The chip uses AMD Socket AM5 and has an unlocked multiplier, allowing overclocking. It supports DDR5 memory on a dual-channel bus with 89.6 GB/s bandwidth. ECC memory is supported. The integrated graphics are Radeon Graphics. The market segment is desktop, and the production status is active with a release date of October 6, 2025.

The Intel Core 3 N350 uses the Twin Lake codename and is based on Alder Lake-N architecture. It is manufactured on a 10 nm process by Intel. The socket is Intel BGA 1264, which is a soldered, non-upgradeable platform. The multiplier is locked, preventing overclocking. Memory support includes DDR4, DDR5, and LPDDR5 on a single-channel bus with 38.4 GB/s bandwidth. ECC memory is not supported. Integrated graphics are UHD Graphics 770. The market segment is mobile, and the production status is active with a release date of January 6, 2025.

Cache configurations differ sharply. The AMD chip provides 80 KB of L1 cache per core, 1 MB of L2 cache per core, and 128 MB of L3 cache. The Intel chip provides 96 KB of L1 cache per core, 2 MB of shared L2 cache, and 6 MB of shared L3 cache. The AMD chip's 128 MB L3 cache is over 20 times larger than the Intel chip's L3 allocation, which directly benefits workloads that reuse data sets.

The process node difference is notable: 4 nm for AMD versus 10 nm for Intel. The AMD chip's smaller node allows higher transistor density and better power efficiency per transistor, though its 120 W TDP reflects the high-performance design. The Intel chip's 7 W TDP targets ultra-low-power operation. The AMD chip's 24 PCIe Gen 5 lanes vastly exceed the Intel chip's 9 PCIe Gen 3 lanes, enabling faster data transfer and more expansion devices.

The part numbers confirm distinct product lines: the AMD chip is 100-000001368E, and the Intel chip is SRPNS. Both are active in production, but they serve different market segments: desktop for AMD, mobile for Intel.

FAQ

Q: Which processor has more cores and threads?

A: The AMD Ryzen Embedded 9900X3D has 12 cores and 24 threads. The Intel Core 3 N350 has 8 cores and 8 threads.

Q: What is the maximum boost clock for each processor?

A: The AMD Ryzen Embedded 9900X3D boosts to 5.50 GHz. The Intel Core 3 N350 boosts to 3.90 GHz.

Q: How much L3 cache does each processor have?

A: The AMD Ryzen Embedded 9900X3D has 128 MB of L3 cache. The Intel Core 3 N350 has 6 MB of shared L3 cache.

Q: What memory types does each processor support?

A: The AMD Ryzen Embedded 9900X3D supports DDR5 memory on a dual-channel bus. The Intel Core 3 N350 supports DDR4, DDR5, and LPDDR5 memory on a single-channel bus.

Q: What is the thermal design power of each processor?

A: The AMD Ryzen Embedded 9900X3D has a TDP of 120 watts. The Intel Core 3 N350 has a TDP of 7 watts.

Q: Does either processor support ECC memory?

A: The AMD Ryzen Embedded 9900X3D supports ECC memory. The Intel Core 3 N350 does not support ECC memory.

Q: What is the Intel Core 3 N350's average benchmark score and percentile?

A: The Intel Core 3 N350 has an average benchmark score of 9903 and sits at the 66th percentile among all CPUs in the database.

The Verdict

The data indicates two processors designed for fundamentally different roles. The AMD Ryzen Embedded 9900X3D targets desktop and embedded workloads that demand high compute throughput, large cache capacity, dual-channel DDR5 memory bandwidth of 89.6 GB/s, PCIe Gen 5 connectivity, and ECC memory support. Its 12 cores, 24 threads, 5.50 GHz boost clock, and 128 MB L3 cache make it the appropriate choice for multi-threaded applications, data processing, and virtualization environments where reliability and performance are priorities.

The Intel Core 3 N350 targets mobile and low-power embedded applications. Its 7 W TDP, single-channel memory bus, and support for multiple memory types allow system builders to create compact, energy-efficient devices. The 8 cores and 8 threads handle moderate workloads, and the 66th percentile ranking with an average benchmark score of 9903 shows it outperforms a majority of CPUs in the database. Its nearest rivals, including the Intel Core i7-3770 at 2% lower and the Intel Core i5-1035G1 at 2.3% lower, confirm it holds its own against older mainstream parts.

Pick the AMD Ryzen Embedded 9900X3D for compute-intensive tasks, high-bandwidth I/O, ECC reliability, and overclocking flexibility. Pick the Intel Core 3 N350 for fanless designs, battery-powered devices, and applications where power draw must stay minimal. The AMD chip delivers desktop-class performance with an unlocked multiplier and a 120 W power envelope. The Intel chip delivers efficiency with a locked multiplier and a 7 W power envelope. Both are active production parts, but they occupy opposite ends of the performance-per-watt spectrum.

Specification Differences

| Specification | AMD Ryzen Embedded 9900X3D | Intel Core 3 N350 |

|---|---|---|

| Cores | 12 | 8 |

| Threads | 24 | 8 |

| Base Clock | 4.40 GHz | 0.10 GHz |

| Boost Clock | 5.50 GHz | 3.90 GHz |

| TDP | 120 W | 7 W |

| Socket | AMD Socket AM5 | Intel BGA 1264 |

| Process Node | 4 nm | 10 nm |

| Foundry | TSMC | Intel |

| Transistors | 16,630 million | Not specified |

| Die Size | 2x 70.6 mm² | Not specified |

| L1 Cache | 80 KB (per core) | 96 KB (per core) |

| L2 Cache | 1 MB (per core) | 2 MB (shared) |

| L3 Cache | 128 MB | 6 MB (shared) |

| Memory Support | DDR5 | DDR4, DDR5, LPDDR5 |

| Memory Bus | Dual-channel | Single-channel |

| Memory Bandwidth | 89.6 GB/s | 38.4 GB/s |

| ECC Memory | Yes | No |

| PCIe | Gen 5, 24 Lanes (CPU only) | Gen 3, 9 Lanes (CPU only) |

| Integrated Graphics | Radeon Graphics | UHD Graphics 770 |

| Market Segment | Desktop | Mobile |

| Release Date | 2025-10-06 | 2025-01-06 |

| Multiplier Unlocked | Yes | No |

| Part Number | 100-000001368E | SRPNS |