AMD Ryzen Embedded 9900X3D vs Intel Core 3 201TE Comparison

AMD
AMD

AMD Ryzen Embedded 9900X3D

CORE STATE Granite Ridge
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 4.4 Base / 5.5 GHz Turbo
CACHE 128 MB
MAX TDP 120W
ARCHITECTURE Granite Ridge
nm
PROCESS 4 nm
LAUNCH DATE 2025
VS
Intel
INTEL

Core 3 201TE

CORE STATE Bartlett Lake
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 2.9 Base / 4.6 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 45W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2025

Analysis: AMD Ryzen Embedded 9900X3D vs Intel Core 3 201TE

FAQ

Q: How do the core and thread counts compare between the AMD Ryzen Embedded 9900X3D and the Intel Core 3 201TE?

A: The AMD Ryzen Embedded 9900X3D has 12 cores and 24 threads. The Intel Core 3 201TE has 4 cores and 8 threads, which is one-third of the core count and one-third of the thread count of the AMD part.

Q: What are the clock speed differences between the two processors?

A: The AMD Ryzen Embedded 9900X3D has a base clock of 4.40 GHz and a boost clock of 5.50 GHz. The Intel Core 3 201TE has a base clock of 2.90 GHz and a boost clock of 4.60 GHz. The AMD part is faster in both metrics.

Q: Which processor supports more PCIe lanes?

A: The AMD Ryzen Embedded 9900X3D supports Gen 5 with 24 lanes (CPU only), while the Intel Core 3 201TE supports Gen 5 with 16 lanes (CPU only). Both use PCIe Gen 5, but the AMD part offers 8 additional CPU lanes.

Q: What is the thermal design power (TDP) for each processor?

A: The AMD Ryzen Embedded 9900X3D has a TDP of 120 watts. The Intel Core 3 201TE has a TDP of 45 watts, which is significantly lower.

Q: What memory types does each processor support?

A: The AMD Ryzen Embedded 9900X3D supports DDR5 memory only. The Intel Core 3 201TE supports both DDR4 and DDR5 memory, giving it broader compatibility with existing platforms.

Q: What is the L3 cache size on each processor?

A: The AMD Ryzen Embedded 9900X3D has 128 MB of L3 cache. The Intel Core 3 201TE has 12 MB of shared L3 cache. The AMD part has over ten times the L3 cache capacity.

The Verdict

The data shows a clear performance hierarchy between these two desktop processors. The AMD Ryzen Embedded 9900X3D is the dominant part in virtually every raw compute category, with 3 times the core count, 3 times the thread count, higher base and boost clocks, and a substantially larger L3 cache. For workloads that scale with parallel execution, sustained multi-core throughput, or large cache residency, the AMD processor is the definitive choice.

The Intel Core 3 201TE occupies a different position entirely. Its 45 watt TDP, compared to 120 watts for the AMD part, indicates a power-conscious design. It also supports both DDR4 and DDR5 memory, which can be an advantage on platforms where DDR4 modules are already available. The Intel part is the pick for systems where energy draw, heat output, or memory flexibility matter more than absolute performance.

Benchmark results are not available in the database for either processor, so the verdict relies on the recorded specification data. The percentile vs all CPUs for both parts is 50, but this is a default value in the database, not a calculated rank from actual test scores. The average benchmark score for both is 0, meaning no measured results have been logged yet.

The AMD Ryzen Embedded 9900X3D targets workloads that demand maximum compute density: content creation, compilation, scientific computing, and server-like multi-threaded tasks. The Intel Core 3 201TE targets lower-power embedded and entry-level desktop roles where its 45 watt TDP and dual memory support provide practical advantages.

Head-to-Head Benchmarks

No head-to-head benchmark data exists in the database for this pairing. The head-to-head benchmark array is empty, and neither processor has logged individual benchmark scores. The wins counter for both parts is 0.

Without measured scores, the comparison must be drawn from the specification deltas recorded in the database. The AMD processor's 4.40 GHz base clock is 1.50 GHz higher than the Intel part's 2.90 GHz base clock. The boost clock difference is 0.90 GHz in favor of AMD, with 5.50 GHz versus 4.60 GHz.

The core count difference is the most consequential. With 12 cores versus 4, the AMD part has 200% more physical cores. In multi-threaded workloads that scale linearly, this alone implies a potential throughput advantage far beyond the clock speed gap. The 24 threads versus 8 threads further reinforces this.

Cache capacity heavily favors AMD. The 128 MB L3 cache versus 12 MB is a 10.7 times difference. Large L3 caches reduce memory latency for frequently accessed data sets, which matters for database workloads, scientific simulations, and certain rendering tasks.

Memory bandwidth also favors AMD. The 89.6 GB/s rated bandwidth is 12.8 GB/s higher than Intel's 76.8 GB/s. This is a 17% advantage in theoretical memory throughput.

The Intel part's advantage lies in its power envelope and memory compatibility. Its 45 watt TDP is 75 watts lower than the AMD part's 120 watt TDP. It also supports DDR4 alongside DDR5, while the AMD part is DDR5-only.

Specification Differences

The AMD Ryzen Embedded 9900X3D uses 12 cores and 24 threads, while the Intel Core 3 201TE uses 4 cores and 8 threads. The AMD base clock is 4.40 GHz versus 2.90 GHz. The AMD boost clock is 5.50 GHz versus 4.60 GHz. The AMD TDP is 120 watts versus 45 watts.

The AMD processor uses AMD Socket AM5, while the Intel processor uses Intel Socket 1700. The AMD part has an unlocked multiplier, while the Intel part is locked. The AMD part number is 100-000001368E, and the Intel part number is SRPKDQ5CK.

The AMD processor has a launch MSRP of none recorded in the database. The Intel Core 3 201TE has a launch MSRP of $134.

The AMD processor integrates Radeon Graphics, while the Intel processor integrates UHD Graphics 730. Both support ECC memory. Both use dual-channel memory buses. The AMD memory bandwidth is 89.6 GB/s, and the Intel bandwidth is 76.8 GB/s.

The AMD processor offers PCIe Gen 5 with 24 lanes (CPU only), while the Intel processor offers PCIe Gen 5 with 16 lanes (CPU only).

Architecture Differences

The AMD Ryzen Embedded 9900X3D belongs to the 9000 series and uses the Granite Ridge codename. Its generation is listed as Ryzen Embedded (Zen 5 (Granite Ridge)). It is fabricated on a 4 nm process at TSMC, with 16,630 million transistors and a die size of 2x 70.6 mm². The Intel Core 3 201TE uses the Bartlett Lake codename, with a generation of Core 3 (Bartlett Lake). It is fabricated on a 10 nm process at Intel, with a die size of 163 mm². The database does not list a transistor count for the Intel part.

Cache architectures differ significantly. The AMD part has 80 KB of L1 cache per core and 1 MB of L2 cache per core, matching the Intel part's per-core L1 allocation. The Intel part, however, has 1.25 MB of L2 cache per core, which is 0.25 MB more per core. The decisive difference is L3 cache: the AMD part has 128 MB, while the Intel part has 12 MB shared.

The manufacturing process difference is substantial. The AMD part uses TSMC's 4 nm node, while the Intel part uses Intel's 10 nm node. The AMD processor also uses a multi-die design with two 70.6 mm² dies, whereas the Intel processor uses a single 163 mm² die.

Memory support differs in scope. The AMD processor supports DDR5 only, while the Intel processor supports both DDR4 and DDR5. Both have ECC support and dual-channel memory buses.

The AMD processor has an unlocked multiplier, a feature absent from the Intel part. The AMD processor also has more PCIe lanes at 24 versus 16, both at Gen 5.

Where Each One Wins

The AMD Ryzen Embedded 9900X3D wins in all raw compute categories recorded in the database. Its 12 cores and 24 threads give it the highest multi-threaded ceiling. Its 5.50 GHz boost clock provides a strong single-thread advantage over the Intel part's 4.60 GHz boost clock. The 128 MB L3 cache offers a massive residency advantage for workloads that repeatedly access large data sets. The 89.6 GB/s memory bandwidth is higher than the Intel part's 76.8 GB/s. The 4 nm TSMC process node is denser than Intel's 10 nm node, and the 16,630 million transistor count indicates a far more complex design.

The AMD part also wins on PCIe expansion, with 24 Gen 5 lanes versus 16 Gen 5 lanes. This supports more add-in cards or storage devices at full bandwidth. The unlocked multiplier allows overclocking, a capability the locked Intel part does not have.

The Intel Core 3 201TE wins in power efficiency. Its 45 watt TDP is less than half of the AMD part's 120 watt TDP, making it appropriate for thermally constrained chassis or always-on systems where heat dissipation is limited. The Intel part also wins on memory flexibility, supporting both DDR4 and DDR5. Platforms with existing DDR4 modules can adopt the Intel processor without a memory upgrade. Its socket, Intel Socket 1700, matches a widely deployed platform ecosystem.

The Intel part's smaller core count and lower TDP make it suitable for embedded controllers, basic office workloads, or low-cost servers where the compute demands are modest. The AMD processor is preferable for compute-heavy applications that can exploit its core count, cache size, and memory bandwidth. The recorded data does not include measured benchmark scores, so these conclusions derive from the specification deltas in the database.

DETAILED SPECIFICATIONS

SPECIFICATION
Embedded 9900X3D
3 201TE
Core Specs
Cores
12
4 -66.7%
Threads
24
8 -66.7%
Base Clock (GHz)
4.4
2.9 -34.1%
Boost Clock (GHz)
5.5
4.6 -16.4%
Frequency (GHz)
4.4
2.9 -34.1%
Turbo Clock (GHz)
5.5
4.6 -16.4%
Multiplier
44
29 -34.1%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1.25 MB (per core)
L3 Cache
128 MB
12 MB (shared)
Power
TDP (W)
120
45 -62.5%
PL1
45 W
PL2
106 W
PPT
230 W
Architecture
Codename
Granite Ridge
Bartlett Lake
Generation
Ryzen Embedded (Zen 5 (Granite Ridge))
Core 3 (Bartlett Lake)
Process Size
4 nm
10 nm
Transistors
16,630 million
Die Size
2x 70.6 mm²
163 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
76.8 GB/s
ECC Memory
Yes
Yes
DDR4 Speed
3200 MT/s
Platform
Socket
AMD Socket AM5
Intel Socket 1700
Chipsets
X870E, X870, B850, B840, X670E, X670, B650E, B650, A620, X600¹
W680, R680E, Q670e, Q670, H610E, H610
PCIe
Gen 5, 24 Lanes(CPU only)
Gen 5, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
Graphics
Integrated Graphics
Radeon Graphics
UHD Graphics 730
Other
Market
Desktop
Desktop
Production Status
Active
Active
Launch Price
$134
Part Number
100-000001368E
SRPKDQ5CK
Package
FC-LGA1718
FC-LGA16A
Tj Max
95°C
100°C
Bundled Cooler
None
View Ryzen Embedded 9900X3D Details View Core 3 201TE Details