AMD Ryzen Embedded 8645HS vs Qualcomm Snapdragon X1E-84-100 Comparison

AMD
AMD

AMD Ryzen Embedded 8645HS

CORE STATE Hawk Point
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 4.3 Base / 5 GHz Turbo
CACHE 16 MB (shared)
MAX TDP 45W
ARCHITECTURE Zen 4
nm
PROCESS 4 nm
LAUNCH DATE 2024
VS
Unknown
CPU

Snapdragon X1E-84-100

CORE STATE Oryon
CORE SPECS 12 Cores / 12 Threads
CLOCK SPEED 3.8 Base / 4.2 GHz Turbo
CACHE 6 MB (shared)
MAX TDP 35W
ARCHITECTURE Oryon
nm
PROCESS 4 nm
LAUNCH DATE 2024

Analysis: AMD Ryzen Embedded 8645HS vs Qualcomm Snapdragon X1E-84-100

The Verdict

The data places the AMD Ryzen Embedded 8645HS and the Qualcomm Snapdragon X1E-84-100 in the 50th percentile of all CPUs, indicating they deliver comparable overall performance in the database. The AMD part is the more conventional choice, using 6 cores and 12 threads with a Zen 4 architecture and a 45 W TDP. The Qualcomm part, however, is a 12-core, 12-thread design with an Oryon architecture running at a 35 W TDP. The recorded specifications show AMD delivers a higher boost clock at 5.00 GHz versus 4.20 GHz, while Qualcomm offers substantially more memory bandwidth at 135.2 GB/s compared to 89.6 GB/s. Users prioritizing raw single-thread speed and lower power draw from a traditional x86 perspective may find the AMD chip appealing, while those needing massive multi-core throughput and faster memory access would lean toward the Qualcomm design.

Architecture Differences

The AMD Ryzen Embedded 8645HS is built on the Zen 4 architecture, codenamed Hawk Point, and belongs to the 8000 series. It uses a 4 nm process from TSMC and integrates 25,000 million transistors on a 178 mm² die. The Qualcomm Snapdragon X1E-84-100 uses the Oryon codename and belongs to the Snapdragon X (Elite) generation. It also relies on a 4 nm TSMC process, though the database does not list a transistor count or die size for this part. Both CPUs target the mobile segment and are currently listed as Active in production.

Cache hierarchies differ sharply between the two. AMD allocates 64 KB of L1 cache per core, 1 MB of L2 per core, and 16 MB of shared L3 cache. Qualcomm, by contrast, provides 288 KB of L1 per core, 12 MB of L2 per module, and only 6 MB of shared L3. The higher L3 capacity on the AMD chip may help in workloads that repeatedly access a large working set, while Qualcomm’s larger per-core L1 and per-module L2 design suggests a different approach to feeding its 12 cores.

Memory support also diverges. The AMD processor uses DDR5 memory on a dual-channel bus with 89.6 GB/s of bandwidth and supports ECC memory. The Qualcomm processor uses LPDDR5X on a dual-channel bus with a higher 135.2 GB/s of bandwidth but does not support ECC. For systems that require error-correcting memory, the AMD part is the only option between the two.

PCIe connectivity favors AMD as well. The Ryzen Embedded 8645HS provides Gen 4 with 20 CPU-only lanes, while the Snapdragon X1E-84-100 provides Gen 4 with 12 CPU-only lanes. Integrated graphics differ: AMD pairs its CPU with a Radeon 760M, while Qualcomm uses an Adreno X1-85. Neither part has an unlocked multiplier, so overclocking is not a supported path for either.

The AMD chip fits an AMD Socket FP8, while the Qualcomm chip uses Qualcomm BGA 2073. Release dates are close, with the AMD part dated 2024-04-01 and the Qualcomm part dated 2024-04-23. The Qualcomm part number is listed as X1E84100.

Where Each One Wins

The AMD Ryzen Embedded 8645HS shows a clear advantage in clock speed. Its base clock of 4.30 GHz and boost clock of 5.00 GHz exceed the Qualcomm part’s 3.80 GHz base and 4.20 GHz boost. For lightly threaded tasks that depend on a single core’s maximum frequency, the higher boost clock on the AMD chip should deliver faster response times. The AMD part also wins on L3 cache capacity with 16 MB versus 6 MB, which can benefit workloads with large shared data sets. ECC memory support gives AMD an edge in reliability-sensitive environments. The 20-lane Gen 4 PCIe interface provides more expansion headroom for peripherals and storage than the 12-lane interface on the Qualcomm chip.

The Qualcomm Snapdragon X1E-84-100 counters with a core count advantage: 12 cores versus 6 cores. Even with no hyper-threading, the Qualcomm part has 12 threads, matching the AMD part’s 12 threads, but with twice the physical cores. This configuration can improve throughput in heavily parallel workloads where the scheduler can distribute work across separate cores. The memory bandwidth advantage is substantial: 135.2 GB/s versus 89.6 GB/s, a gain of roughly 51% in theoretical bandwidth. The LPDDR5X memory support may also provide better energy characteristics for sustained loads, given the 35 W TDP versus 45 W TDP. The larger L1 cache per core and L2 per module could reduce memory latency for per-core working sets.

The database does not list head-to-head benchmark wins for either part, so the analysis rests on the architectural specifications. The AMD part appears better suited to single-threaded and latency-sensitive tasks, ECC-required deployments, and systems needing more PCIe lanes. The Qualcomm part appears better suited to parallel compute, memory-bandwidth-hungry applications, and lower-power mobile designs.

FAQ

Q: Which processor has a higher boost clock?

A: The AMD Ryzen Embedded 8645HS boosts to 5.00 GHz, while the Qualcomm Snapdragon X1E-84-100 boosts to 4.20 GHz.

Q: How many cores and threads does each processor have?

A: The AMD part has 6 cores and 12 threads. The Qualcomm part has 12 cores and 12 threads.

Q: Does either processor support ECC memory?

A: Yes, the AMD Ryzen Embedded 8645HS supports ECC memory. The Qualcomm Snapdragon X1E-84-100 does not support ECC.

Q: Which processor has higher memory bandwidth?

A: The Qualcomm Snapdragon X1E-84-100 reaches 135.2 GB/s, compared to 89.6 GB/s on the AMD Ryzen Embedded 8645HS.

Q: What process node do both processors use?

A: Both the AMD Ryzen Embedded 8645HS and the Qualcomm Snapdragon X1E-84-100 are manufactured on a 4 nm process by TSMC.

Q: Which processor has more PCIe lanes?

A: The AMD Ryzen Embedded 8645HS provides 20 CPU-only Gen 4 lanes, while the Qualcomm Snapdragon X1E-84-100 provides 12 CPU-only Gen 4 lanes.

Head-to-Head Benchmarks

The database lists no direct head-to-head benchmark results between the AMD Ryzen Embedded 8645HS and the Qualcomm Snapdragon X1E-84-100, and neither part has recorded individual benchmark scores. The comparison must therefore rely on the specification deltas recorded in the database.

The largest single-core-related gap is the boost clock. The AMD chip’s 5.00 GHz boost is 19% higher than the Qualcomm chip’s 4.20 GHz boost. For software that scales with peak frequency on one or two threads, this margin can translate to noticeably shorter completion times. The base clock gap is smaller but still meaningful: 4.30 GHz on AMD versus 3.80 GHz on Qualcomm, a 13% advantage for AMD at idle-to-light loads.

Memory bandwidth is the biggest win for Qualcomm. The 135.2 GB/s figure represents a 51% increase over AMD’s 89.6 GB/s. Applications that stream large arrays, process video frames, or move data between GPU and CPU could feel this difference directly. LPDDR5X on the Qualcomm part also implies a different memory controller design, though the database does not provide latency numbers.

Core count favors Qualcomm by a factor of two: 12 physical cores versus 6 physical cores. Thread counts are equal at 12, but the Qualcomm part does not rely on simultaneous multithreading. In workloads that avoid contention on shared execution resources, the additional physical cores on the Qualcomm chip may deliver steadier throughput. The AMD part’s 12 threads on 6 cores depend on SMT efficiency, which varies by application.

Cache allocation shows a split. AMD offers 16 MB of shared L3, which is 2.67 times the 6 MB on the Qualcomm part. Qualcomm offers 288 KB of L1 per core, which is 4.5 times the 64 KB per core on AMD, and 12 MB of L2 per module versus 1 MB per core on AMD. For workloads that fit into L1 or L2, Qualcomm may reduce memory traffic; for workloads that rely on a large shared L3, AMD may have the edge.

Power envelopes differ by 10 W, with AMD at 45 W and Qualcomm at 35 W. The lower TDP on the Qualcomm part, combined with more cores and higher memory bandwidth, suggests a design focused on efficiency per watt, though the database does not provide measured power or efficiency scores. The AMD part’s higher TDP aligns with its higher clock speeds and larger L3 cache.

Both parts sit at the 50th percentile in the database, which indicates that their aggregate performance scores land at the midpoint of all recorded CPUs. This means the architectural differences do not currently produce a dominant overall winner in the database’s ranking. The AMD Ryzen Embedded 8645HS and Qualcomm Snapdragon X1E-84-100 occupy the same performance tier, with the choice depending on workload-specific needs such as single-thread frequency, memory bandwidth, ECC support, and PCIe lane count. The AMD chip offers higher clocks, ECC, more L3, and more PCIe lanes. The Qualcomm chip offers double the physical cores, higher memory bandwidth, larger per-core caches, and a lower TDP.

DETAILED SPECIFICATIONS

SPECIFICATION
Embedded 8645HS
Snapdragon X1E-84-100
Core Specs
Cores
6
12 +100.0%
Threads
12
12 0.0%
Base Clock (GHz)
4.3
3.8 -11.6%
Boost Clock (GHz)
5
4.2 -16.0%
Frequency (GHz)
4.3
3.8 -11.6%
Turbo Clock (GHz)
5
4.2 -16.0%
Multiplier
43
38 -11.6%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
288 KB (per core)
L2 Cache
1 MB (per core)
12 MB (per module)
L3 Cache
16 MB (shared)
6 MB (shared)
Power
TDP (W)
45
35 -22.2%
PL2
—
80 W
Configurable TDP
35-54 W
—
Architecture
Architecture
Zen 4
—
Codename
Hawk Point
Oryon
Generation
Ryzen Embedded (Zen 4 (Hawk Point))
Snapdragon X (Elite)
Process Size
4 nm
4 nm
Transistors
25,000 million
—
Die Size
178 mm²
—
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
135.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket FP8
Qualcomm BGA 2073
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 4, 12 Lanes(CPU only)
AI/NPU
NPU
Yes / 16 TOPS
Yes / 45 TOPS
Graphics
Integrated Graphics
Radeon 760M
Adreno X1-85
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
unknown
X1E84100
Package
FP8, FP7, FP7r2
FC-BGA
Tj Max
100°C
—
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