AMD Ryzen Embedded 8645HS vs Qualcomm Snapdragon X1E-78-100 Comparison

FAQ

Q: How do the core counts differ between the AMD Ryzen Embedded 8645HS and the Qualcomm Snapdragon X1E-78-100?

A: The AMD processor has 6 cores and 12 threads, while the Qualcomm processor has 12 cores and 12 threads. Both CPUs support 12 threads, but the Snapdragon achieves this with twice as many physical cores, each lacking simultaneous multithreading.

Q: What are the base clock speeds of these two processors?

A: The AMD Ryzen Embedded 8645HS has a base clock of 4.30 GHz, which is higher than the Snapdragon X1E-78-100's base clock of 3.40 GHz. The AMD part also has a boost clock of 5.00 GHz, while the Qualcomm part has no listed boost clock in the database.

Q: Which processor supports ECC memory?

A: The AMD Ryzen Embedded 8645HS supports ECC memory, a feature commonly required in embedded and server environments. The Qualcomm Snapdragon X1E-78-100 does not support ECC memory.

Q: How does memory bandwidth compare between the two?

A: The Qualcomm Snapdragon X1E-78-100 supports LPDDR5X memory with a bandwidth of 135.2 GB/s, which is significantly higher than the AMD Ryzen Embedded 8645HS's DDR5 bandwidth of 89.6 GB/s. The Snapdragon's memory bandwidth is approximately 51% higher.

Q: What are the process nodes for both processors?

A: Both processors are manufactured on a 4 nm process node at TSMC. The AMD chip has a die size of 178 mm² and contains 25,000 million transistors, while the Qualcomm chip has no die size or transistor count recorded in the database.

Q: What integrated graphics do these processors use?

A: The AMD Ryzen Embedded 8645HS uses the Radeon 760M integrated graphics. The Qualcomm Snapdragon X1E-78-100 uses the Adreno X1-85 integrated graphics.

Architecture Differences

The AMD Ryzen Embedded 8645HS belongs to the 8000 series and uses the Zen 4 architecture under the Hawk Point codename. It is part of the Ryzen Embedded generation, specifically Zen 4 (Hawk Point). The Qualcomm Snapdragon X1E-78-100 uses the Oryon codename and belongs to the Snapdragon X (Elite) generation. The architectural lineage separates them fundamentally: Zen 4 is a high-frequency x86 design, while Oryon represents a different design approach with more physical cores at lower clocks.

The AMD processor is built on a 4 nm TSMC process with 25,000 million transistors on a 178 mm² die. The Qualcomm processor is also built on a 4 nm TSMC process, though its transistor count and die size are not recorded. Both use the same foundry and node, so process-level differences do not separate the two in this comparison.

Core organization differs substantially. The AMD chip has 6 cores with 12 threads, indicating simultaneous multithreading support. The Qualcomm chip has 12 cores with 12 threads, meaning each core handles a single thread without multithreading. This creates a direct trade-off: the Snapdragon has twice the physical core count, while the AMD part relies on higher clock speeds and multithreading to compete.

Cache hierarchies also differ. The AMD processor provides 64 KB of L1 cache per core, 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The Qualcomm processor provides 288 KB of L1 cache per core, 12 MB of L2 cache per module, and 6 MB of shared L3 cache. The L1 allocation per core is much larger on the Snapdragon, while the AMD design compensates with a larger shared L3 pool.

Memory architecture separates the two as well. The AMD chip uses dual-channel DDR5 with a bandwidth of 89.6 GB/s and supports ECC memory. The Qualcomm chip uses dual-channel LPDDR5X with a bandwidth of 135.2 GB/s but lacks ECC support. The Snapdragon's memory subsystem delivers 45.6 GB/s more bandwidth, a meaningful advantage for memory-intensive workloads.

PCIe connectivity differs: the AMD processor provides Gen 4 with 20 lanes from the CPU, while the Qualcomm processor provides Gen 4 with 12 lanes from the CPU. This gives the AMD part more expansion headroom for peripherals and storage.

The AMD processor uses AMD Socket FP8, while the Qualcomm processor uses Qualcomm BGA 2073. Both are mobile-segment parts with Active production status. The AMD chip was released on 2024-04-01, and the Qualcomm chip was released on 2024-04-23, a difference of about three weeks.

Head-to-Head Benchmarks

The database contains no recorded head-to-head benchmark results for these two processors, and neither processor has individual benchmark scores or nearest rival entries. Both parts share a percentile score of 50 against all CPUs, indicating that the database has not yet differentiated them through measured performance data. The wins tally is 0 for both the AMD Ryzen Embedded 8645HS and the Qualcomm Snapdragon X1E-78-100.

For multi-threaded workloads, the Qualcomm part holds a structural advantage based on its physical core count. With 12 physical cores versus 6 physical cores on the AMD chip, the Snapdragon X1E-78-100 can process more independent threads simultaneously. However, the AMD chip's 12 threads, achieved through simultaneous multithreading, match the Snapdragon's thread count. The recorded base clocks favor AMD at 4.30 GHz versus 3.40 GHz for Qualcomm, which suggests higher single-thread throughput potential for the AMD part, though no direct benchmark confirms this.

Memory bandwidth is a clear differentiator in the recorded data. The Qualcomm Snapdragon X1E-78-100 delivers 135.2 GB/s, which is 45.6 GB/s higher than the AMD Ryzen Embedded 8645HS's 89.6 GB/s. This represents a 50.9% advantage for the Snapdragon in raw memory bandwidth. Workloads that stream large datasets, such as data analytics or certain scientific computing tasks, would benefit from this margin.

The AMD part counters with a 5.00 GHz boost clock, which is not matched by any recorded boost specification for the Qualcomm processor. The AMD chip also offers 20 PCIe Gen 4 lanes versus 12 on the Snapdragon, giving it more bandwidth for attached devices and expansion.

ECC memory support is exclusive to the AMD Ryzen Embedded 8645HS. This feature is critical for error-sensitive embedded workloads, where data corruption is unacceptable. The Qualcomm Snapdragon X1E-78-100 lacks ECC support entirely.

Without measured benchmark scores, the comparison relies on the architectural and specification data recorded. The Qualcomm part leads in physical core count, memory bandwidth, and L1 cache per core. The AMD part leads in base clock, boost clock, PCIe lane count, and ECC support. Thread counts are equal at 12, and both use the same 4 nm TSMC process.

The Verdict

The recorded data favors the Qualcomm Snapdragon X1E-78-100 for workloads that scale with physical cores and memory bandwidth. Its 12 physical cores and 135.2 GB/s memory bandwidth give it a clear structural edge in parallel processing and data-heavy tasks. The 50.9% memory bandwidth advantage over the AMD part is the largest single measured gap in the specification comparison.

The AMD Ryzen Embedded 8645HS is the stronger choice for workloads that depend on high clock speeds and ECC memory. Its 5.00 GHz boost clock and 4.30 GHz base clock are the highest clock values recorded for either processor. The 20 PCIe Gen 4 lanes also provide more expansion capability than the Snapdragon's 12 lanes.

Both processors sit at the 50th percentile in the database, and neither has recorded benchmark scores. This means the verdict must be drawn from the specification table rather than measured performance. The Snapdragon's higher memory bandwidth and greater physical core count are balanced by the AMD part's higher clocks and ECC support.

For embedded applications requiring data integrity, the AMD Ryzen Embedded 8645HS is the only option of the two, since ECC memory support is exclusive to it. For applications that move large volumes of data and benefit from many physical cores, the Qualcomm Snapdragon X1E-78-100 has the recorded advantages.

The production status of both parts is Active, and both target the mobile segment. The AMD chip's release date of 2024-04-01 and the Qualcomm chip's release date of 2024-04-23 place them in the same launch window.

Specification Differences

| Specification | AMD Ryzen Embedded 8645HS | Qualcomm Snapdragon X1E-78-100 |

|---|---|---|

| Series | 8000 series | Not recorded |

| Manufacturer | AMD | Unknown |

| Cores | 6 | 12 |

| Threads | 12 | 12 |

| Base Clock | 4.30 GHz | 3.40 GHz |

| Boost Clock | 5.00 GHz | Not recorded |

| TDP | 45 W | 35 W |

| Socket | AMD Socket FP8 | Qualcomm BGA 2073 |

| Architecture | Zen 4 | Not recorded |

| Codename | Hawk Point | Oryon |

| Generation | Ryzen Embedded (Zen 4 (Hawk Point)) | Snapdragon X (Elite) |

| Transistors | 25,000 million | Not recorded |

| Die Size | 178 mm² | Not recorded |

| L1 Cache | 64 KB per core | 288 KB per core |

| L2 Cache | 1 MB per core | 12 MB per module |

| L3 Cache | 16 MB shared | 6 MB shared |

| Memory Support | DDR5 | LPDDR5X |

| Memory Bandwidth | 89.6 GB/s | 135.2 GB/s |

| ECC Memory | Yes | No |

| PCIe | Gen 4, 20 Lanes (CPU only) | Gen 4, 12 Lanes (CPU only) |

| Integrated Graphics | Radeon 760M | Adreno X1-85 |

| Part Number | Unknown | X1E78100 |

| Release Date | 2024-04-01 | 2024-04-23 |

The two processors also share several traits: both use a 4 nm TSMC process, both have dual-channel memory buses, both have locked multipliers, and both are listed as Active with a market segment of Mobile. The AMD part has a higher TDP of 45 W versus 35 W for the Snapdragon, which reflects its higher clock speeds. The Qualcomm part has no recorded boost clock, no recorded architecture field, and no recorded transistor or die size data.