AMD Ryzen Embedded 8645HS vs Intel Core 3 201TE Comparison

Head-to-Head Benchmarks

The database contains no recorded head-to-head benchmark results for the AMD Ryzen Embedded 8645HS versus the Intel Core 3 201TE. Both processors share an identical percentile ranking against all CPUs in the database, with each sitting at the 50th percentile. Their average benchmark scores are also equal at zero, which reflects the absence of submitted test data rather than measured performance parity. Without direct comparative measurements, the recorded specifications provide the only basis for evaluating how these two parts differ in capability.

The AMD Ryzen Embedded 8645HS uses 6 cores and 12 threads, while the Intel Core 3 201TE uses 4 cores and 8 threads. The AMD part operates with a base clock of 4.30 GHz and a boost clock of 5.00 GHz. The Intel part operates with a base clock of 2.90 GHz and a boost clock of 4.60 GHz. These clock figures show the AMD processor holding a 1.40 GHz advantage at base frequency and a 0.40 GHz advantage at boost frequency. The core and thread counts reinforce that advantage, with the AMD design offering 50% more cores and 50% more threads than the Intel design.

Cache architecture differs substantially between the two. The AMD Ryzen Embedded 8645HS provides 64 KB of L1 cache per core, 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The Intel Core 3 201TE provides 80 KB of L1 cache per core, 1.25 MB of L2 cache per core, and 12 MB of shared L3 cache. The Intel part has a larger per-core L1 and L2 allocation, but the AMD part has 4 MB more shared L3 capacity. The AMD processor also uses a 4 nm process node from TSMC, while the Intel processor uses a 10 nm process node from Intel. The AMD die measures 178 mm² and contains 25,000 million transistors, whereas the Intel die measures 163 mm² with no transistor count recorded in the database.

Memory bandwidth favors the AMD processor. The Ryzen Embedded 8645HS supports DDR5 memory only, with dual-channel configuration and a recorded bandwidth of 89.6 GB/s. The Intel Core 3 201TE supports both DDR4 and DDR5 memory, also dual-channel, with a recorded bandwidth of 76.8 GB/s. The AMD part delivers 12.8 GB/s more memory bandwidth. Both processors support ECC memory, which places them in the same reliability category for embedded workloads.

The integrated graphics solutions also differ. The AMD part uses a Radeon 760M, while the Intel part uses UHD Graphics 730. No graphics benchmark scores exist in the database for either processor, so the comparison remains limited to naming the respective GPUs. PCIe connectivity differs as well: the AMD processor provides Gen 4 with 20 lanes from the CPU, while the Intel processor provides Gen 5 with 16 lanes from the CPU. The Intel part supports a newer PCIe generation, while the AMD part provides more total lanes.

Release timing separates the two parts. The AMD Ryzen Embedded 8645HS was released on 2024-04-01, and the Intel Core 3 201TE was released on 2025-01-12. The Intel part entered the market roughly nine months later. The AMD processor occupies the mobile market segment with an AMD Socket FP8, while the Intel processor occupies the desktop market segment with an Intel Socket 1700. Both parts carry a 45 W TDP and neither has an unlocked multiplier. The Intel part has a recorded launch MSRP of $134, while the AMD part has no launch MSRP recorded.

The Verdict

The data shows two processors aimed at different deployment scenarios despite their matching 45 W TDP. The AMD Ryzen Embedded 8645HS delivers a higher core count, higher thread count, higher clock speeds, more L3 cache, and greater memory bandwidth. The Intel Core 3 201TE offers a wider memory compatibility range with DDR4 and DDR5 support, a newer PCIe generation, and a larger per-core L1 and L2 cache allocation. The Intel part also has a recorded launch MSRP of $134, while the AMD part has no recorded price.

For workloads that scale with core count and thread count, the AMD processor holds a clear specification advantage. Six cores and 12 threads against 4 cores and 8 threads means the AMD part can process more simultaneous threads. The base clock advantage of 1.40 GHz and boost clock advantage of 0.40 GHz further strengthens the AMD position for single-threaded responsiveness and multi-threaded throughput alike. The 16 MB shared L3 cache versus 12 MB shared L3 cache gives the AMD part more on-die data capacity for working sets that exceed the Intel L3 allocation.

The Intel processor counters with per-core cache advantages. Its 80 KB L1 per core exceeds the AMD 64 KB per core, and its 1.25 MB L2 per core exceeds the AMD 1 MB per core. For workloads that repeatedly access a small working set confined to a single core, the Intel part may show lower latency. The Intel processor also supports DDR4 memory, which allows system builders to reuse existing DDR4 modules rather than requiring a full transition to DDR5. The PCIe Gen 5 interface, while providing only 16 lanes against the AMD 20 Gen 4 lanes, offers a newer signaling standard for compatible devices.

The database records no benchmark scores for either processor, so the verdict rests on specification comparison. The AMD Ryzen Embedded 8645HS appears better suited to multi-threaded embedded workloads, given its 6-core, 12-thread configuration and higher clocks. The Intel Core 3 201TE appears better suited to single-core-focused tasks and memory-flexible deployments, given its larger per-core caches and DDR4 compatibility.

Where Each One Wins

The AMD Ryzen Embedded 8645HS wins on multi-threaded performance potential. The 6-core, 12-thread design with a 5.00 GHz boost clock gives it a structural advantage in parallel workloads such as software compilation, media encoding, and virtualized environments. The 89.6 GB/s memory bandwidth, 12.8 GB/s higher than the Intel part, supports memory-intensive operations that scale with available bandwidth. The 16 MB shared L3 cache provides more shared capacity for data shared across cores. The 20 PCIe Gen 4 lanes enable more simultaneous device connections at Gen 4 speeds.

The Intel Core 3 201TE wins on per-core cache capacity. The 80 KB L1 and 1.25 MB L2 per core exceed the AMD per-core allocations, which can benefit latency-sensitive single-threaded workloads that fit within those caches. The 12 MB shared L3 remains smaller than the AMD L3, but the per-core hierarchy favors the Intel design for lightly threaded tasks. The DDR4 and DDR5 dual support gives the Intel part broader memory compatibility, which matters for embedded systems with existing DDR4 infrastructure. The PCIe Gen 5 interface supports newer high-bandwidth devices, despite the lower lane count of 16 versus the AMD 20. The 163 mm² die size is 15 mm² smaller than the AMD die, which may relate to physical integration constraints.

The AMD processor uses a 4 nm process node from TSMC, which is a more advanced manufacturing node than the Intel 10 nm process. The AMD part also carries 25,000 million transistors on a 178 mm² die. Both processors offer ECC memory support, so data integrity features do not differentiate them. Both processors have a 45 W TDP, placing them in the same power envelope for thermal design purposes. Neither processor has an unlocked multiplier, so overclocking flexibility is not a differentiator.

The AMD part is classified as a mobile processor on Socket FP8, while the Intel part is classified as a desktop processor on Socket 1700. This socket and segment division means system integration paths differ completely. The AMD part uses the Radeon 760M integrated graphics, and the Intel part uses the UHD Graphics 730 integrated graphics, with no benchmark data available to compare their output.

FAQ

Q: How many cores and threads does each processor have?

A: The AMD Ryzen Embedded 8645HS has 6 cores and 12 threads. The Intel Core 3 201TE has 4 cores and 8 threads.

Q: What are the clock speeds of the two processors?

A: The AMD Ryzen Embedded 8645HS has a base clock of 4.30 GHz and a boost clock of 5.00 GHz. The Intel Core 3 201TE has a base clock of 2.90 GHz and a boost clock of 4.60 GHz.

Q: Which processor supports DDR4 memory?

A: The Intel Core 3 201TE supports both DDR4 and DDR5 memory. The AMD Ryzen Embedded 8645HS supports DDR5 memory only.

Q: Do both processors support ECC memory?

A: Yes, both the AMD Ryzen Embedded 8645HS and the Intel Core 3 201TE have ECC memory support recorded in the database.

Q: What is the memory bandwidth of each processor?

A: The AMD Ryzen Embedded 8645HS has a memory bandwidth of 89.6 GB/s. The Intel Core 3 201TE has a memory bandwidth of 76.8 GB/s.

Q: What is the release date of each processor?

A: The AMD Ryzen Embedded 8645HS was released on 2024-04-01. The Intel Core 3 201TE was released on 2025-01-12.

Q: What PCIe generation does each processor use?

A: The AMD Ryzen Embedded 8645HS uses PCIe Gen 4 with 20 lanes from the CPU. The Intel Core 3 201TE uses PCIe Gen 5 with 16 lanes from the CPU.

Architecture Differences

The AMD Ryzen Embedded 8645HS belongs to the 8000 series and uses the Zen 4 architecture under the Hawk Point codename. Its generation is recorded as Ryzen Embedded with Zen 4 (Hawk Point). The Intel Core 3 201TE uses the Bartlett Lake codename with its generation recorded as Core 3 (Bartlett Lake). The AMD part is built on a 4 nm process node at TSMC, while the Intel part is built on a 10 nm process node at Intel. The AMD die measures 178 mm² and contains 25,000 million transistors. The Intel die measures 163 mm², and no transistor count is recorded.

The cache hierarchies differ in both capacity and distribution. The AMD processor allocates 64 KB of L1 and 1 MB of L2 per core, with 16 MB of shared L3. The Intel processor allocates 80 KB of L1 and 1.25 MB of L2 per core, with 12 MB of shared L3. The Intel per-core L1 and L2 are larger, but the AMD shared L3 is larger by 4 MB. Neither processor has a 3D V-Cache configuration recorded.

Memory controller differences are significant. The AMD processor supports DDR5 exclusively over a dual-channel bus with 89.6 GB/s bandwidth. The Intel processor supports DDR4 and DDR5 over a dual-channel bus with 76.8 GB/s bandwidth. Both support ECC memory, which is a shared feature in the embedded segment.

PCIe connectivity differs by generation and lane count. The AMD processor provides 20 Gen 4 lanes from the CPU. The Intel processor provides 16 Gen 5 lanes from the CPU. The Intel part supports a newer PCIe standard, while the AMD part offers more lanes at the older standard.

The integrated graphics solutions are distinct. The AMD processor uses a Radeon 760M, and the Intel processor uses UHD Graphics 730. Neither has recorded benchmark scores. The AMD processor uses AMD Socket FP8 and targets the mobile market segment. The Intel processor uses Intel Socket 1700 and targets the desktop market segment.

Both processors have a 45 W TDP and locked multipliers. The AMD part has no launch MSRP recorded, while the Intel part has a launch MSRP of $134. The AMD part was released on 2024-04-01, and the Intel part was released on 2025-01-12. The AMD part carries part number "unknown", while the Intel part carries part number SRPKDQ5CK. Both processors are listed as Active in production status.