AMD Ryzen Embedded 8645HS vs Intel Arc G3 Comparison

AMD
AMD

AMD Ryzen Embedded 8645HS

CORE STATE Hawk Point
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 4.3 Base / 5 GHz Turbo
CACHE 16 MB (shared)
MAX TDP 45W
ARCHITECTURE Zen 4
nm
PROCESS 4 nm
LAUNCH DATE 2024
VS
Intel
INTEL

Arc G3

CORE STATE Panther Lake
CORE SPECS 14 Cores / 14 Threads
CLOCK SPEED 1.9 Base / 4.6 GHz Turbo
CACHE 18 MB (shared)
MAX TDP 25W
ARCHITECTURE Panther Lake
nm
PROCESS 3 nm
LAUNCH DATE 2026

Analysis: AMD Ryzen Embedded 8645HS vs Intel Arc G3

Head-to-Head Benchmarks

The recorded data for this comparison contains no direct head-to-head benchmark scores. Both processors show an empty benchmark array, an average benchmark score of zero, and zero recorded wins for either side. The absence of measured performance results means the database cannot provide a numeric victory margin for either the AMD Ryzen Embedded 8645HS or the Intel Arc G3 in any workload category. This is not a case of one chip outpacing the other by a narrow margin; it is a complete lack of comparative measurement data.

Given the empty benchmark fields, the only quantitative distinctions available come from the specification and architecture records. The Intel Arc G3 carries a broader core configuration with 14 cores and 14 threads, while the AMD Ryzen Embedded 8645HS uses 6 cores and 12 threads. That difference in core count suggests a potential advantage in highly parallel workloads, but without benchmark scores, the database cannot confirm any real-world performance delta. Similarly, the AMD part reaches a boost clock of 5.00 GHz against the Intel part's 4.60 GHz, which points toward a possible single-thread advantage, but again, no measured score exists to validate that inference.

The percentile ranking for both processors sits at 50, which places each exactly at the median of all CPUs tracked in the database. With an identical percentile and no nearest rivals listed, there is no reference point to gauge relative standing against other chips. The data shows two processors that occupy the same percentile tier, yet the absence of benchmark outcomes prevents any statement about which one delivers higher throughput, lower latency, or better efficiency under load. All head-to-head analysis must therefore rely on the documented hardware attributes rather than performance results.

FAQ

Q: Which processor has the higher core count?

A: The Intel Arc G3 has 14 cores and 14 threads, while the AMD Ryzen Embedded 8645HS has 6 cores and 12 threads. The Intel part leads by 8 cores, though the AMD part has 2 fewer threads than cores, indicating simultaneous multithreading support.

Q: What are the clock speed differences between the two?

A: The AMD Ryzen Embedded 8645HS has a base clock of 4.30 GHz and a boost clock of 5.00 GHz. The Intel Arc G3 has a base clock of 1.90 GHz and a boost clock of 4.60 GHz. The AMD chip runs at a higher frequency in both states.

Q: How does power consumption compare?

A: The AMD Ryzen Embedded 8645HS has a thermal design power (TDP) of 45 watts. The Intel Arc G3 has a TDP of 25 watts. The Intel part is rated for lower power draw, which may influence thermal and battery considerations in mobile designs.

Q: Do both processors support the same memory type?

A: No. The AMD Ryzen Embedded 8645HS supports DDR5 memory, while the Intel Arc G3 supports LPDDR5X. Both use dual-channel memory buses, but the memory bandwidth differs: the AMD part records 89.6 GB/s, and the Intel part records 136.5 GB/s.

Q: Which processor has larger cache allocations?

A: The Intel Arc G3 has a larger L1 cache at 192 KB per core, an L2 cache of 2.5 MB per core, and an L3 cache of 18 MB shared. The AMD Ryzen Embedded 8645HS has an L1 cache of 64 KB per core, an L2 cache of 1 MB per core, and an L3 cache of 16 MB shared. The Intel part leads in all three cache levels.

Q: What are the manufacturing process nodes for each chip?

A: The AMD Ryzen Embedded 8645HS uses a 4 nm process node fabricated by TSMC. The Intel Arc G3 uses a 3 nm process node fabricated by Intel. The Intel part is built on a smaller process node and uses Intel's own foundry.

The Verdict

The data indicates that the Intel Arc G3 is the stronger choice for workloads that scale with core count, cache size, and memory bandwidth. It provides 14 cores versus 6, an L3 cache of 18 MB versus 16 MB, and memory bandwidth of 136.5 GB/s versus 89.6 GB/s. These specifications favor the Intel part in multi-threaded scenarios, data-heavy tasks, and memory-intensive operations. The lower TDP of 25 watts versus 45 watts also makes the Intel chip more suited to power-constrained environments.

The AMD Ryzen Embedded 8645HS, however, holds the advantage in clock speed. Its base clock of 4.30 GHz and boost clock of 5.00 GHz exceed the Intel part's 1.90 GHz base and 4.60 GHz boost. For single-threaded workloads, latency-sensitive applications, or tasks that rely on raw frequency, the AMD processor presents a stronger profile. The AMD chip also supports ECC memory, a feature absent from the Intel part, which matters for data integrity in embedded or server-like roles.

Neither processor shows a performance win in the database, and both hold a 50th percentile ranking. The verdict must therefore rest on the documented hardware attributes. Users who prioritize parallel processing and memory throughput should select the Intel Arc G3. Users who prioritize clock speed and error-correcting memory should select the AMD Ryzen Embedded 8645HS. The database cannot declare an overall winner without benchmark scores.

Specification Differences

The two processors differ across nearly every recorded specification field. The AMD Ryzen Embedded 8645HS belongs to the 8000 series, while the Intel Arc G3 has no series designation. The AMD part uses AMD Socket FP8, the Intel part uses Intel BGA 2540. The AMD chip has 6 cores and 12 threads, the Intel chip has 14 cores and 14 threads. Base clocks are 4.30 GHz for AMD and 1.90 GHz for Intel. Boost clocks are 5.00 GHz for AMD and 4.60 GHz for Intel. TDP is 45 watts for AMD and 25 watts for Intel.

Memory support differs as well: DDR5 for AMD, LPDDR5X for Intel. Memory bandwidth is 89.6 GB/s for AMD and 136.5 GB/s for Intel. ECC memory support is present on the AMD part and absent on the Intel part. PCIe configuration shows Gen 4 with 20 lanes for AMD, versus Gen 5 with 4 lanes for Intel. Integrated graphics are Radeon 760M on the AMD side and Arc B370 on the Intel side. The AMD part has a release date of April 1, 2024, while the Intel part has a release date of May 27, 2026. The Intel part has a known part number of SA4QZ, while the AMD part number is unknown.

Architecture Differences

The AMD Ryzen Embedded 8645HS uses the Zen 4 architecture under the codename Hawk Point. The Intel Arc G3 uses the Panther Lake codename with the Arc G3 generation label. The AMD chip is built on a 4 nm process node at TSMC, with 25,000 million transistors and a die size of 178 mm². The Intel chip is built on a 3 nm process node at Intel, but the database records no transistor count or die size for it.

Cache architecture differs substantially. The AMD part provides 64 KB of L1 cache per core, 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The Intel part provides 192 KB of L1 cache per core, 2.5 MB of L2 cache per core, and 18 MB of shared L3 cache. The Intel part has larger allocations at every cache level. Neither processor uses 3D V-Cache, and neither has a recorded total L3 figure beyond the shared values already listed.

The AMD processor integrates Radeon 760M graphics, while the Intel processor integrates Arc B370 graphics. The AMD chip supports ECC memory, the Intel chip does not. The Intel part uses a Gen 5 PCIe interface with 4 lanes, whereas the AMD part uses Gen 4 with 20 lanes. The Intel part is fabricated in-house at Intel, while the AMD part is fabricated at TSMC. These architectural choices point toward different design priorities: AMD focuses on higher frequency and ECC support, Intel focuses on more cores, larger caches, and a smaller process node.

Where Each One Wins

The Intel Arc G3 wins in core count, cache capacity, memory bandwidth, and power efficiency. With 14 cores and 14 threads, it offers more than double the core count of the AMD part. Its L1 cache of 192 KB per core, L2 cache of 2.5 MB per core, and L3 cache of 18 MB all exceed the AMD allocations. Memory bandwidth of 136.5 GB/s surpasses the AMD figure of 89.6 GB/s by a wide margin. The 25-watt TDP also positions the Intel chip as the lower-power option, which suits fanless designs, compact systems, or battery-operated devices.

The AMD Ryzen Embedded 8645HS wins in clock speed, ECC support, and PCIe lane count. The boost clock of 5.00 GHz and base clock of 4.30 GHz are both higher than the Intel values. ECC memory support provides a data integrity feature that the Intel chip lacks, which is relevant for embedded controllers, edge computing, or storage applications. The 20 Gen 4 PCIe lanes offer more expansion connectivity than the Intel part's 4 Gen 5 lanes, though the Intel lanes operate at a newer standard.

In practical terms, the Intel Arc G3 appears better suited to multi-threaded server-like workloads, database processing, or memory-heavy applications where bandwidth and core count matter. The AMD Ryzen Embedded 8645HS appears better suited to single-threaded tasks, frequency-sensitive operations, or environments requiring ECC memory. The database records no benchmark wins for either chip, so these conclusions derive entirely from the hardware specifications. Users should weigh core count and bandwidth against clock speed and ECC support based on their specific workload requirements.

DETAILED SPECIFICATIONS

SPECIFICATION
Embedded 8645HS
G3
Core Specs
Cores
6
14 +133.3%
Threads
12
14 +16.7%
Base Clock (GHz)
4.3
1.9 -55.8%
Boost Clock (GHz)
5
4.6 -8.0%
Frequency (GHz)
4.3
1.9 -55.8%
Turbo Clock (GHz)
5
4.6 -8.0%
Multiplier
43
19 -55.8%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
192 KB (per core)
L2 Cache
1 MB (per core)
2.5 MB (per core)
L3 Cache
16 MB (shared)
18 MB (shared)
Power
TDP (W)
45
25 -44.4%
Configurable TDP
35-54 W
15-45 W
Architecture
Architecture
Zen 4
Codename
Hawk Point
Panther Lake
Generation
Ryzen Embedded (Zen 4 (Hawk Point))
Arc G3 (Panther Lake)
Process Size
4 nm
3 nm
Transistors
25,000 million
Die Size
178 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
136.5 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket FP8
Intel BGA 2540
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 5, 4 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 2 E-Cores: 12
E-Core Frequency
1500 MHz up to 3.3 GHz
LP E-Cores
4
AI/NPU
NPU
Yes / 16 TOPS
Yes / 46 TOPS
Graphics
Integrated Graphics
Radeon 760M
Arc B370
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
unknown
SA4QZ
Package
FP8, FP7, FP7r2
FC-BGA
Tj Max
100°C
100°C
View Ryzen Embedded 8645HS Details View Arc G3 Details