AMD Ryzen Embedded 8640U vs Qualcomm Snapdragon X1E-84-100 Comparison

AMD
AMD

AMD Ryzen Embedded 8640U

CORE STATE Hawk Point
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 3.5 Base / 4.9 GHz Turbo
CACHE 16 MB (shared)
MAX TDP 28W
ARCHITECTURE Zen 4
nm
PROCESS 4 nm
LAUNCH DATE 2024
VS
Unknown
CPU

Snapdragon X1E-84-100

CORE STATE Oryon
CORE SPECS 12 Cores / 12 Threads
CLOCK SPEED 3.8 Base / 4.2 GHz Turbo
CACHE 6 MB (shared)
MAX TDP 35W
ARCHITECTURE Oryon
nm
PROCESS 4 nm
LAUNCH DATE 2024

Analysis: AMD Ryzen Embedded 8640U vs Qualcomm Snapdragon X1E-84-100

Head-to-Head Benchmarks

The recorded data shows no head-to-head benchmark results between the AMD Ryzen Embedded 8640U and the Qualcomm Snapdragon X1E-84-100. Neither processor has a populated benchmark score in the database, and the win counts for each side stand at zero. This absence of measured performance data means any direct comparison must rely entirely on architectural specifications rather than empirical test outcomes. The database contains no multi-core scores, no single-core results, and no application-level tests for either part. Both processors sit at the 50th percentile against all CPUs in the database, though this percentile is computed without any actual benchmark submissions, so it reflects a default placement rather than a measured ranking. Without benchmark deltas, there is no way to state which processor is faster in any specific workload. The analysis that follows therefore examines the specification differences that would influence performance, but the data does not support any claim of a measured victory for either side.

Architecture Differences

The AMD Ryzen Embedded 8640U and Qualcomm Snapdragon X1E-84-100 diverge sharply in their core designs and cache hierarchies. The AMD part uses the Zen 4 architecture under the Hawk Point codename, belonging to the 8000 series and the Ryzen Embedded generation. It implements 6 physical cores with 12 threads, relying on simultaneous multithreading to double its thread count. The Qualcomm part uses the Oryon codename under the Snapdragon X Elite generation, with 12 physical cores and 12 threads, meaning it has no multithreading capability per core. This is a fundamental design difference: the AMD processor offers fewer physical cores but gains additional threads, while the Qualcomm processor offers twice the physical cores at the same thread count.

Clock speeds also differ substantially. The AMD chip has a base clock of 3.50 GHz and a boost clock of 4.90 GHz, giving it a 1.40 GHz boost headroom. The Qualcomm chip has a higher base clock of 3.80 GHz but a lower boost clock of 4.20 GHz, providing only 0.40 GHz of boost headroom. The AMD part therefore reaches a significantly higher maximum frequency, while the Qualcomm part maintains a higher sustained frequency at its base. Both are built on a 4 nm process node at TSMC, so the manufacturing technology is identical, but the transistor counts and die sizes differ: the AMD processor contains 25,000 million transistors on a 178 mm² die, while the Qualcomm processor does not have these figures recorded in the database.

Cache configurations reveal another major architectural split. The AMD processor uses 64 KB of L1 cache per core, 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The Qualcomm processor uses 288 KB of L1 cache per core, 12 MB of L2 cache per module, and 6 MB of shared L3 cache. The Qualcomm L1 cache is 4.5 times larger per core, and its L2 cache is allocated per module rather than per core, which reflects a different design philosophy aimed at feeding its 12 cores. However, the AMD processor has more than double the shared L3 cache (16 MB versus 6 MB), which helps with inter-core communication and frequently accessed data. Neither processor has 3D V-Cache.

Memory support follows the same divergence. The AMD processor uses DDR5 memory on a dual-channel bus with a bandwidth of 89.6 GB/s, and it supports ECC memory. The Qualcomm processor uses LPDDR5X memory on a dual-channel bus with a bandwidth of 135.2 GB/s, and it does not support ECC memory. The Qualcomm memory bandwidth is 50.9% higher, which is a substantial advantage for memory-intensive workloads. The AMD ECC support is relevant for embedded and reliability-focused use cases, while the Qualcomm part trades that for faster standard memory.

PCIe connectivity also differs. The AMD processor offers Gen 4 with 20 lanes from the CPU, while the Qualcomm processor offers Gen 4 with 12 lanes from the CPU. The AMD part provides 8 additional PCIe lanes, which matters for systems needing more expansion slots or high-speed peripherals. Integrated graphics differ as well: the AMD processor uses the Radeon 760M, while the Qualcomm processor uses the Adreno X1-85. No graphics benchmark data exists in the database, so the performance of these iGPUs cannot be compared numerically.

The socket and packaging differ completely. The AMD processor fits AMD Socket FP8, while the Qualcomm processor fits Qualcomm BGA 2073. The AMD part is a 28 W TDP design, whereas the Qualcomm part is a 35 W TDP design, a 7 W difference. The release dates are close: the AMD processor was released on 2024-04-01, and the Qualcomm processor on 2024-04-23, a span of 22 days. Both are marked as Active in production status, and neither has an unlocked multiplier. The Qualcomm part has a recorded part number of X1E84100, while the AMD part number is listed as unknown.

Where Each One Wins

Based purely on specifications, the AMD Ryzen Embedded 8640U holds advantages in several areas. Its boost clock of 4.90 GHz is 0.70 GHz higher than the Qualcomm boost clock of 4.20 GHz, which should give it an edge in lightly threaded workloads that scale with single-core frequency. Its 16 MB of shared L3 cache exceeds the Qualcomm 6 MB by 10 MB, which can reduce memory latency for frequently accessed data. Its 20 PCIe Gen 4 lanes outnumber the Qualcomm 12 lanes by 8, allowing more expansion devices. Its ECC memory support is a feature the Qualcomm part lacks entirely, which is often a requirement in embedded, industrial, and server-adjacent applications. Its 28 W TDP is lower than the Qualcomm 35 W TDP, suggesting better power efficiency for thermally constrained systems. Its 12 threads match the Qualcomm 12 threads despite having only 6 physical cores, which means thread-heavy workloads see the same thread count.

The Qualcomm Snapdragon X1E-84-100 holds advantages in other areas. Its 12 physical cores double the AMD physical core count, which benefits workloads that are highly parallel and do not benefit from SMT. Its base clock of 3.80 GHz is 0.30 GHz higher than the AMD base clock, which could translate to better sustained all-core performance. Its memory bandwidth of 135.2 GB/s exceeds the AMD 89.6 GB/s by 45.6 GB/s, a 50.9% advantage that matters for data streaming, large datasets, and memory-bound applications. Its L1 cache of 288 KB per core is substantially larger than the AMD 64 KB per core, and its L2 cache of 12 MB per module provides a different cache topology that may reduce latency for its 12 cores. Its LPDDR5X memory support is a different memory type that typically offers lower power consumption alongside higher bandwidth.

The data does not indicate any measured wins because no benchmarks exist. However, the specification split suggests that the AMD part is better suited to workloads requiring high single-thread frequency, large L3 cache, expansion capability, ECC reliability, and lower power draw. The Qualcomm part is better suited to workloads requiring many physical cores, high sustained base frequency, and high memory bandwidth. The absence of benchmark scores means these are inferred advantages, not measured ones.

FAQ

Q: Which processor has more physical cores?

A: The Qualcomm Snapdragon X1E-84-100 has 12 physical cores, while the AMD Ryzen Embedded 8640U has 6 physical cores. However, the AMD part reaches 12 threads through simultaneous multithreading, so the thread count is identical at 12 for both.

Q: Which processor has a higher boost clock?

A: The AMD Ryzen Embedded 8640U has a boost clock of 4.90 GHz, which is 0.70 GHz higher than the Qualcomm Snapdragon X1E-84-100 boost clock of 4.20 GHz. The Qualcomm part has a higher base clock at 3.80 GHz versus 3.50 GHz for the AMD part.

Q: Which processor supports ECC memory?

A: Only the AMD Ryzen Embedded 8640U supports ECC memory. The Qualcomm Snapdragon X1E-84-100 does not support ECC memory. The AMD part supports DDR5 memory, while the Qualcomm part supports LPDDR5X memory.

Q: What is the difference in memory bandwidth?

A: The Qualcomm Snapdragon X1E-84-100 has a memory bandwidth of 135.2 GB/s, while the AMD Ryzen Embedded 8640U has a memory bandwidth of 89.6 GB/s. The Qualcomm part provides 45.6 GB/s more bandwidth, which is a 50.9% advantage.

Q: Which processor has more PCIe lanes?

A: The AMD Ryzen Embedded 8640U has 20 PCIe Gen 4 lanes from the CPU, while the Qualcomm Snapdragon X1E-84-100 has 12 PCIe Gen 4 lanes from the CPU. The AMD part offers 8 additional lanes.

Q: Are there any benchmark scores available for these processors?

A: No. The database contains no benchmark scores for either processor. Both have an average benchmark score of 0, and both are placed at the 50th percentile against all CPUs, but this percentile is not based on any measured performance data.

Specification Differences

The two processors differ in every major specification category recorded in the database.

| Specification | AMD Ryzen Embedded 8640U | Qualcomm Snapdragon X1E-84-100 |

|---|---|---|

| Cores | 6 | 12 |

| Threads | 12 | 12 |

| Base clock | 3.50 GHz | 3.80 GHz |

| Boost clock | 4.90 GHz | 4.20 GHz |

| TDP | 28 W | 35 W |

| Socket | AMD Socket FP8 | Qualcomm BGA 2073 |

| Architecture | Zen 4 | Not recorded |

| Codename | Hawk Point | Oryon |

| Generation | Ryzen Embedded (Zen 4, Hawk Point) | Snapdragon X (Elite) |

| Process node | 4 nm | 4 nm |

| Foundry | TSMC | TSMC |

| Transistors | 25,000 million | Not recorded |

| Die size | 178 mm² | Not recorded |

| L1 cache | 64 KB per core | 288 KB per core |

| L2 cache | 1 MB per core | 12 MB per module |

| L3 cache | 16 MB shared | 6 MB shared |

| Memory support | DDR5 | LPDDR5X |

| Memory bus | Dual-channel | Dual-channel |

| Memory bandwidth | 89.6 GB/s | 135.2 GB/s |

| ECC memory | Yes | No |

| PCIe | Gen 4, 20 lanes (CPU only) | Gen 4, 12 lanes (CPU only) |

| Integrated graphics | Radeon 760M | Adreno X1-85 |

| Market segment | Mobile | Mobile |

| Production status | Active | Active |

| Release date | 2024-04-01 | 2024-04-23 |

| Multiplier unlocked | No | No |

| Part number | Unknown | X1E84100 |

The AMD part uses a smaller process node advantage is moot since both use 4 nm TSMC. The AMD transistor count of 25,000 million and die size of 178 mm² have no counterpart for the Qualcomm part, as those fields are not recorded. The AMD cache structure places L2 per core, while the Qualcomm L2 is per module, and the AMD L3 is larger by 10 MB. The Qualcomm L1 cache is larger per core by 224 KB, and its L2 per module is larger than the AMD L2 per core by 11 MB, though the comparison is not direct due to different allocation schemes. The memory bandwidth difference favors the Qualcomm part by 45.6 GB/s. The PCIe lane difference favors the AMD part by 8 lanes. The TDP difference favors the AMD part by 7 W. The release date difference is 22 days, with the AMD part earlier. The Qualcomm part has a recorded part number, while the AMD part does not. No other specification fields differ in the database, and neither processor has a launch MSRP recorded.

DETAILED SPECIFICATIONS

SPECIFICATION
Embedded 8640U
Snapdragon X1E-84-100
Core Specs
Cores
6
12 +100.0%
Threads
12
12 0.0%
Base Clock (GHz)
3.5
3.8 +8.6%
Boost Clock (GHz)
4.9
4.2 -14.3%
Frequency (GHz)
3.5
3.8 +8.6%
Turbo Clock (GHz)
4.9
4.2 -14.3%
Multiplier
35
38 +8.6%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
288 KB (per core)
L2 Cache
1 MB (per core)
12 MB (per module)
L3 Cache
16 MB (shared)
6 MB (shared)
Power
TDP (W)
28
35 +25.0%
PL2
—
80 W
Configurable TDP
15-30 W
—
Architecture
Architecture
Zen 4
—
Codename
Hawk Point
Oryon
Generation
Ryzen Embedded (Zen 4 (Hawk Point))
Snapdragon X (Elite)
Process Size
4 nm
4 nm
Transistors
25,000 million
—
Die Size
178 mm²
—
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
135.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket FP8
Qualcomm BGA 2073
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 4, 12 Lanes(CPU only)
AI/NPU
NPU
Yes / 16 TOPS
Yes / 45 TOPS
Graphics
Integrated Graphics
Radeon 760M
Adreno X1-85
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
unknown
X1E84100
Package
FP8, FP7, FP7r2
FC-BGA
Tj Max
100°C
—
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