CPU Comparison
AMD
AMD Ryzen Embedded 5950E
CORE STATE
Vermeer
CORE SPECS
16 Cores / 32 Threads
CLOCK SPEED
3.05 Base / 3.4 GHz Turbo
CACHE
64 MB (shared)
MAX TDP
105W
ARCHITECTURE
Zen 3
PROCESS
7 nm
LAUNCH DATE
2023
VS
INTEL
Core i7-13850HX
CORE STATE
Raptor Lake-HX
CORE SPECS
20 Cores / 28 Threads
CLOCK SPEED
2.1 Base / 5.3 GHz Turbo
CACHE
30 MB (shared)
MAX TDP
55W
ARCHITECTURE
Raptor Lake
PROCESS
10 nm
LAUNCH DATE
2023
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
Embedded 5950E
i7-13850HX
Core Specs
Cores
16
20
+25.0%
Threads
32
28
-12.5%
Base Clock (GHz)
3.05
2.1
-31.1%
Boost Clock (GHz)
3.4
5.3
+55.9%
Frequency (GHz)
3.05
2.1
-31.1%
Turbo Clock (GHz)
3.4
5.3
+55.9%
Multiplier
30.5
21
-31.1%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
2 MB (per core)
L3 Cache
64 MB (shared)
30 MB (shared)
Power
TDP (W)
105
55
-47.6%
PL1
โ
55 W
PL2
โ
157 W
Architecture
Architecture
Zen 3
Raptor Lake
Codename
Vermeer
Raptor Lake-HX
Generation
Ryzen Embedded
(Zen 3 (Vermeer))
Core i7
(Raptor Lake-HX)
Process Size
7 nm
10 nm
Transistors
8,300 million
โ
Die Size
2x 74 mmยฒ
257 mmยฒ
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
โ
ECC Memory
Yes
Yes
DDR4 Speed
โ
3200 MT/s
DDR5 Speed
โ
5600 MT/s
Platform
Socket
AMD Socket AM4
Intel BGA 1964
Chipsets
โ
WM790, HM770
PCIe
Gen 4, 24 Lanes(CPU only)
Gen 5, 20 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
โ
P-Cores: 8
E-Cores: 12
E-Core Frequency
โ
1500 MHz
up to 3.8 GHz
AMD Multi-Die
IO Process Size
12 nm
โ
Graphics
Integrated Graphics
โ
UHD Graphics 770
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
โ
$428
Part Number
100-000000730
SRMEA
Package
ยตOPGA-1331
FC-BGA16F
Tj Max
105ยฐC
100ยฐC