CPU Comparison

A

AMD

AMD

AMD Ryzen 7 PRO 5845

CORE STATE Vermeer

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.4 Base / 4.6 GHz Turbo

CACHE 32 MB (shared)

MAX TDP 65W

ARCHITECTURE Zen 3

nm

PROCESS 7 nm

LAUNCH DATE 2022

VS

A

AMD

AMD

Ryzen AI Max PRO 390

CORE STATE Strix Halo

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.2 Base / 5 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,232

3,700

cinebench_cinebench_r15_singlecore

314

522

cinebench_cinebench_r20_multicore

9,300

15,418

cinebench_cinebench_r20_singlecore

1,312

2,176

cinebench_cinebench_r23_multicore

22,145

36,710

cinebench_cinebench_r23_singlecore

3,126

5,182

passmark_data_compression

314,363

505,322

passmark_data_encryption

19,815

26,115

passmark_extended_instructions

21,117

40,687

passmark_find_prime_numbers

115

333

passmark_floating_point_math

52,105

96,002

passmark_integer_math

94,884

150,375

passmark_multithread

26,054

43,189

passmark_physics

1,109

2,769

passmark_random_string_sorting

33,754

55,663

passmark_single_thread

3,442

3,997

passmark_singlethread

3,442

3,997

DETAILED SPECIFICATIONS

SPECIFICATION

7 PRO 5845

AI Max PRO 390

Core Specs

Cores

8

12 +50.0%

Threads

16

24 +50.0%

Base Clock (GHz)

3.4

3.2 -5.9%

Boost Clock (GHz)

4.6

5 +8.7%

Frequency (GHz)

3.4

3.2 -5.9%

Turbo Clock (GHz)

4.6

5 +8.7%

Multiplier

34

32 -5.9%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

32 MB (shared)

64 MB (shared)

Power

TDP (W)

65

55 -15.4%

PPT

88 W

—

Configurable TDP

—

45-120 W

Architecture

Architecture

Zen 3

Zen 5

Codename

Vermeer

Strix Halo

Generation

Ryzen 7 (Zen 3 (Vermeer))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

7 nm

4 nm

Transistors

4,150 million

—

Die Size

74 mm²

—

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

LPDDR5X

Memory Bus

Dual-channel

Quad-channel

Memory Bandwidth

51.2 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket AM4

AMD Socket FP11

Chipsets

AMD 300 Series*, AMD 400 Series, AMD 500 Series

—

PCIe

Gen 4, 20 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

12 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8050S

Other

Market

Desktop

Mobile

Production Status

Active

Active

Part Number

100-000000832

100-000001421

Package

µOPGA-1331

FC-BGA

Tj Max

—

100°C

Bundled Cooler

None

—

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