CPU Comparison

AMD
AMD

AMD EPYC 7J13

CORE STATE Milan
CORE SPECS 64 Cores / 128 Threads
CLOCK SPEED 2.55 Base / 3.5 GHz Turbo
CACHE 256 MB (shared)
MAX TDP 280W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE
VS
AMD
AMD

Ryzen AI Max PRO 385

CORE STATE Strix Halo
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.6 Base / 5 GHz Turbo
CACHE 32 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
7,264
2,865
cinebench_cinebench_r15_singlecore
1,025
404
cinebench_cinebench_r20_multicore
30,268
11,938
cinebench_cinebench_r20_singlecore
4,273
1,685
cinebench_cinebench_r23_multicore
72,068
28,424
cinebench_cinebench_r23_singlecore
10,174
4,012
passmark_data_compression
N/A
399,839
passmark_data_encryption
N/A
19,947
passmark_extended_instructions
N/A
33,915
passmark_find_prime_numbers
N/A
169
passmark_floating_point_math
N/A
72,648
passmark_integer_math
N/A
108,717
passmark_multithread
N/A
33,441
passmark_physics
N/A
1,772
passmark_random_string_sorting
N/A
41,537
passmark_single_thread
N/A
4,052
passmark_singlethread
N/A
4,052

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 7J13
AI Max PRO 385
Core Specs
Cores
64
8 -87.5%
Threads
128
16 -87.5%
Base Clock (GHz)
2.55
3.6 +41.2%
Boost Clock (GHz)
3.5
5 +42.9%
Frequency (GHz)
2.55
3.6 +41.2%
Turbo Clock (GHz)
3.5
5 +42.9%
Multiplier
25.5
36 +41.2%
SMP CPUs
2
1 -50.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
256 MB (shared)
32 MB (shared)
Power
TDP (W)
280
55 -80.4%
Configurable TDP
45-120 W
Architecture
Architecture
Zen 3
Zen 5
Codename
Milan
Strix Halo
Generation
EPYC (Zen 3 (Milan))
Ryzen AI Max (Zen 5 (Strix Halo))
Process Size
7 nm
4 nm
Transistors
33,200 million
Die Size
8x 81 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
LPDDR5X
Memory Bus
Eight-channel
Quad-channel
Memory Bandwidth
204.8 GB/s
256.0 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket SP3
AMD Socket FP11
PCIe
Gen 4, 128 Lanes(CPU only)
Gen 4, 16 Lanes(CPU only)
AMD Multi-Die
CCDs
8
Cores per CCD
8
IO Process Size
12 nm
AI/NPU
NPU
Yes / 50 TOPS
Graphics
Integrated Graphics
Radeon 8050S
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Part Number
100-000000346
100-000001422
Package
FCLGA-4094
FC-BGA
Tj Max
100°C
View EPYC 7J13 Details View Ryzen AI Max PRO 385 Details