CPU Comparison

A

AMD

AMD

AMD EPYC 74F3

CORE STATE Milan

CORE SPECS 24 Cores / 48 Threads

CLOCK SPEED 2.8 Base / 4 GHz Turbo

CACHE 256 MB (shared)

MAX TDP 240W

ARCHITECTURE Zen 3

nm

PROCESS 7 nm

LAUNCH DATE 2021

VS

A

AMD

AMD

Ryzen AI Max PRO 385

CORE STATE Strix Halo

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.6 Base / 5 GHz Turbo

CACHE 32 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

5,197

2,865

cinebench_cinebench_r15_singlecore

733

404

cinebench_cinebench_r20_multicore

21,657

11,938

cinebench_cinebench_r20_singlecore

3,057

1,685

cinebench_cinebench_r23_multicore

51,566

28,424

cinebench_cinebench_r23_singlecore

7,279

4,012

passmark_data_compression

N/A

399,839

passmark_data_encryption

N/A

19,947

passmark_extended_instructions

N/A

33,915

passmark_find_prime_numbers

N/A

169

passmark_floating_point_math

N/A

72,648

passmark_integer_math

N/A

108,717

passmark_multithread

N/A

33,441

passmark_physics

N/A

1,772

passmark_random_string_sorting

N/A

41,537

passmark_single_thread

N/A

4,052

passmark_singlethread

N/A

4,052

DETAILED SPECIFICATIONS

SPECIFICATION

EPYC 74F3

AI Max PRO 385

Core Specs

Cores

24

8 -66.7%

Threads

48

16 -66.7%

Base Clock (GHz)

2.8

3.6 +28.6%

Boost Clock (GHz)

4

5 +25.0%

Frequency (GHz)

2.8

3.6 +28.6%

Turbo Clock (GHz)

4

5 +25.0%

Multiplier

28

36 +28.6%

SMP CPUs

2

1 -50.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

256 MB (shared)

32 MB (shared)

Power

TDP (W)

240

55 -77.1%

Configurable TDP

225 W

45-120 W

Architecture

Architecture

Zen 3

Zen 5

Codename

Milan

Strix Halo

Generation

EPYC (Zen 3 (Milan))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

7 nm

4 nm

Transistors

33,200 million

—

Die Size

4x 81 mm²

—

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

LPDDR5X

Memory Bus

Eight-channel

Quad-channel

Memory Bandwidth

204.8 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket SP3

AMD Socket FP11

PCIe

Gen 4, 128 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

CCDs

8

—

Cores per CCD

3

—

IO Process Size

12 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8050S

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Launch Price

$2900

—

Part Number

100-000000317100-100000317WOF

100-000001422

Package

FCLGA-4094

FC-BGA

Tj Max

—

100°C

View EPYC 74F3 Details View Ryzen AI Max PRO 385 Details