CPU Comparison

A

AMD

AMD

AMD Ryzen AI Max+ 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

i

Intel

INTEL

Xeon Platinum 8260M

CORE STATE Cascade Lake-SP

CORE SPECS 24 Cores / 48 Threads

CLOCK SPEED 2.4 Base / 3.9 GHz Turbo

CACHE 35.75 MB (shared)

MAX TDP 165W

ARCHITECTURE Cascade Lake

nm

PROCESS 14 nm

LAUNCH DATE 2018

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

4,558

2,963

cinebench_cinebench_r15_singlecore

643

418

cinebench_cinebench_r20_multicore

18,995

12,349

cinebench_cinebench_r20_singlecore

2,681

1,743

cinebench_cinebench_r23_multicore

45,228

29,403

cinebench_cinebench_r23_singlecore

6,385

4,151

passmark_data_compression

656,891

573,896

passmark_data_encryption

34,086

17,625

passmark_extended_instructions

52,958

35,529

passmark_find_prime_numbers

298

141

passmark_floating_point_math

123,833

73,514

passmark_integer_math

195,223

129,213

passmark_multithread

53,137

34,592

passmark_physics

3,448

2,080

passmark_random_string_sorting

72,894

69,236

passmark_single_thread

4,123

2,320

passmark_singlethread

4,123

2,320

DETAILED SPECIFICATIONS

SPECIFICATION

AI Max+ 395

Platinum 8260M

Core Specs

Cores

16

24 +50.0%

Threads

32

48 +50.0%

Base Clock (GHz)

3

2.4 -20.0%

Boost Clock (GHz)

5.1

3.9 -23.5%

Frequency (GHz)

3

2.4 -20.0%

Turbo Clock (GHz)

5.1

3.9 -23.5%

Multiplier

30

24 -20.0%

SMP CPUs

1

8 +700.0%

Cache

L1 Cache

80 KB (per core)

64 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

64 MB (shared)

35.75 MB (shared)

Power

TDP (W)

55

165 +200.0%

Configurable TDP

45-120 W

—

Architecture

Architecture

Zen 5

Cascade Lake

Codename

Strix Halo

Cascade Lake-SP

Generation

Ryzen AI Max (Zen 5 (Strix Halo))

Xeon Platinum (Cascade Lake-SP)

Process Size

4 nm

14 nm

Transistors

—

8,000 million

Die Size

2x 70.6 mm²

—

Foundry

TSMC

Intel

Memory

Memory Support

LPDDR5X

DDR4

Memory Bus

Quad-channel

—

Memory Bandwidth

256.0 GB/s

—

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket FP11

Intel Socket 3647

PCIe

Gen 4, 16 Lanes(CPU only)

—

AI/NPU

NPU

Yes / 50 TOPS

—

Graphics

Integrated Graphics

Radeon 8060S

—

Other

Market

Mobile

Server/Workstation

Production Status

Active

—

Part Number

100-000001099

SRF9JCD8069504201201

Package

FC-BGA

FC-LGA3647

Tj Max

100°C

—

View Ryzen AI Max+ 395 Details View Xeon Platinum 8260M Details