CPU Comparison

A

AMD

AMD

AMD Ryzen AI Max+ 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

i

Intel

INTEL

Xeon Gold 5318H

CORE STATE Cooper Lake-SP

CORE SPECS 18 Cores / 36 Threads

CLOCK SPEED 2.5 Base / 3.8 GHz Turbo

CACHE 24.75 MB (shared)

MAX TDP 150W

ARCHITECTURE Cooper Lake

nm

PROCESS 14 nm

LAUNCH DATE 2021

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

4,558

2,510

cinebench_cinebench_r15_singlecore

643

354

cinebench_cinebench_r20_multicore

18,995

10,460

cinebench_cinebench_r20_singlecore

2,681

1,476

cinebench_cinebench_r23_multicore

45,228

24,905

cinebench_cinebench_r23_singlecore

6,385

3,516

passmark_data_compression

656,891

470,916

passmark_data_encryption

34,086

10,743

passmark_extended_instructions

52,958

33,730

passmark_find_prime_numbers

298

141

passmark_floating_point_math

123,833

66,610

passmark_integer_math

195,223

107,603

passmark_multithread

53,137

29,301

passmark_physics

3,448

2,309

passmark_random_string_sorting

72,894

58,841

passmark_single_thread

4,123

2,225

passmark_singlethread

4,123

2,225

DETAILED SPECIFICATIONS

SPECIFICATION

AI Max+ 395

Gold 5318H

Core Specs

Cores

16

18 +12.5%

Threads

32

36 +12.5%

Base Clock (GHz)

3

2.5 -16.7%

Boost Clock (GHz)

5.1

3.8 -25.5%

Frequency (GHz)

3

2.5 -16.7%

Turbo Clock (GHz)

5.1

3.8 -25.5%

Multiplier

30

25 -16.7%

SMP CPUs

1

4 +300.0%

Cache

L1 Cache

80 KB (per core)

64 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

64 MB (shared)

24.75 MB (shared)

Power

TDP (W)

55

150 +172.7%

Configurable TDP

45-120 W

—

Architecture

Architecture

Zen 5

Cooper Lake

Codename

Strix Halo

Cooper Lake-SP

Generation

Ryzen AI Max (Zen 5 (Strix Halo))

Xeon Gold (Cooper Lake-SP)

Process Size

4 nm

14 nm

Die Size

2x 70.6 mm²

—

Foundry

TSMC

Intel

Memory

Memory Support

LPDDR5X

DDR4

Memory Bus

Quad-channel

Six-channel

Memory Bandwidth

256.0 GB/s

128.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket FP11

Intel Socket 4189

PCIe

Gen 4, 16 Lanes(CPU only)

Gen 3, 48 Lanes(CPU only)

AI/NPU

NPU

Yes / 50 TOPS

—

Graphics

Integrated Graphics

Radeon 8060S

—

Other

Market

Mobile

Server/Workstation

Production Status

Active

Active

Part Number

100-000001099

SRJY3CD8070604481600

Package

FC-BGA

FC-LGA4189

Tj Max

100°C

—

View Ryzen AI Max+ 395 Details View Xeon Gold 5318H Details