CPU Comparison

A

AMD

AMD

AMD Ryzen AI Max+ 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

i

Intel

INTEL

Core i9-13900HK

CORE STATE Raptor Lake-H

CORE SPECS 14 Cores / 20 Threads

CLOCK SPEED 2.6 Base / 5.4 GHz Turbo

CACHE 24 MB (shared)

MAX TDP 45W

ARCHITECTURE Raptor Lake

nm

PROCESS 10 nm

LAUNCH DATE 2023

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

4,558

2,412

cinebench_cinebench_r15_singlecore

643

340

cinebench_cinebench_r20_multicore

18,995

10,050

cinebench_cinebench_r20_singlecore

2,681

1,418

cinebench_cinebench_r23_multicore

45,228

23,929

cinebench_cinebench_r23_singlecore

6,385

3,378

passmark_data_compression

656,891

329,454

passmark_data_encryption

34,086

19,198

passmark_extended_instructions

52,958

19,534

passmark_find_prime_numbers

298

110

passmark_floating_point_math

123,833

68,020

passmark_integer_math

195,223

94,120

passmark_multithread

53,137

28,194

passmark_physics

3,448

1,896

passmark_random_string_sorting

72,894

36,662

passmark_single_thread

4,123

3,810

passmark_singlethread

4,123

3,810

DETAILED SPECIFICATIONS

SPECIFICATION

AI Max+ 395

i9-13900HK

Core Specs

Cores

16

14 -12.5%

Threads

32

20 -37.5%

Base Clock (GHz)

3

2.6 -13.3%

Boost Clock (GHz)

5.1

5.4 +5.9%

Frequency (GHz)

3

2.6 -13.3%

Turbo Clock (GHz)

5.1

5.4 +5.9%

Multiplier

30

26 -13.3%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

80 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

2 MB (per core)

L3 Cache

64 MB (shared)

24 MB (shared)

Power

TDP (W)

55

45 -18.2%

PL1

—

45 W

PL2

—

115 W

Configurable TDP

45-120 W

—

Architecture

Architecture

Zen 5

Raptor Lake

Codename

Strix Halo

Raptor Lake-H

Generation

Ryzen AI Max (Zen 5 (Strix Halo))

Core i9 (Raptor Lake-H)

Process Size

4 nm

10 nm

Die Size

2x 70.6 mm²

257 mm²

Foundry

TSMC

Intel

Memory

Memory Support

LPDDR5X

DDR4, DDR5

Memory Bus

Quad-channel

Dual-channel

Memory Bandwidth

256.0 GB/s

—

ECC Memory

Yes

No

DDR4 Speed

—

3200 MT/s

DDR5 Speed

—

5200 MT/s

Platform

Socket

AMD Socket FP11

Intel BGA 1744

Chipsets

—

WM790, HM770

PCIe

Gen 4, 16 Lanes(CPU only)

Gen 5, 8 Lanes(CPU only)

Intel Hybrid

Hybrid Cores

—

P-Cores: 6 E-Cores: 8

E-Core Frequency

—

1900 MHz up to 4.1 GHz

AI/NPU

NPU

Yes / 50 TOPS

—

Graphics

Integrated Graphics

Radeon 8060S

Iris Xe Graphics 96EU

Other

Market

Mobile

Mobile

Production Status

Active

Active

Launch Price

—

$697

Part Number

100-000001099

SRMJ3

Package

FC-BGA

FC-BGA16F

Tj Max

100°C

100°C

View Ryzen AI Max+ 395 Details View Core i9-13900HK Details