CPU Comparison

AMD
AMD

AMD Ryzen 9 7945HX3D

CORE STATE Dragon Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.3 Base / 5.4 GHz Turbo
CACHE 128 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2023
VS
AMD
AMD

Ryzen AI Max+ 395

CORE STATE Strix Halo
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 3 Base / 5.1 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

3dmark_16_threads
12,459
N/A
3dmark_2_threads
2,095
N/A
3dmark_4_threads
3,937
N/A
3dmark_8_threads
7,330
N/A
3dmark_max_threads
12,936
N/A
3dmark_single_thread
1,071
N/A
cinebench_cinebench_r15_multicore
4,922
4,558
cinebench_cinebench_r15_singlecore
694
643
cinebench_cinebench_r20_multicore
20,510
18,995
cinebench_cinebench_r20_singlecore
2,895
2,681
cinebench_cinebench_r23_multicore
48,834
45,228
cinebench_cinebench_r23_singlecore
6,894
6,385
geekbench_multicore
16,758
N/A
geekbench_singlecore
2,769
N/A
passmark_data_compression
699,988
656,891
passmark_data_encryption
42,367
34,086
passmark_extended_instructions
52,310
52,958
passmark_find_prime_numbers
446
298
passmark_floating_point_math
121,619
123,833
passmark_integer_math
201,217
195,223
passmark_multithread
57,476
53,137
passmark_physics
4,321
3,448
passmark_random_string_sorting
83,919
72,894
passmark_single_thread
4,050
4,123
passmark_singlethread
4,050
4,123

DETAILED SPECIFICATIONS

SPECIFICATION
9 7945HX3D
AI Max+ 395
Core Specs
Cores
16
16 0.0%
Threads
32
32 0.0%
Base Clock (GHz)
2.3
3 +30.4%
Boost Clock (GHz)
5.4
5.1 -5.6%
Frequency (GHz)
2.3
3 +30.4%
Turbo Clock (GHz)
5.4
5.1 -5.6%
Multiplier
23
30 +30.4%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
128 MB (shared)
64 MB (shared)
3D V-Cache
1x 64MB Slice
—
Power
TDP (W)
55
55 0.0%
PPT
55-75 W
—
Configurable TDP
—
45-120 W
Architecture
Architecture
Zen 4
Zen 5
Codename
Dragon Range
Strix Halo
Generation
Ryzen 9 (Zen 4 (Dragon Range))
Ryzen AI Max (Zen 5 (Strix Halo))
Process Size
5 nm
4 nm
Transistors
17,840 million
—
Die Size
2x 71 mm²
2x 70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
LPDDR5X
Memory Bus
Dual-channel
Quad-channel
Memory Bandwidth
83.2 GB/s
256.0 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket FL1
AMD Socket FP11
PCIe
Gen 5, 28 Lanes(CPU only)
Gen 4, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
—
AI/NPU
NPU
—
Yes / 50 TOPS
Graphics
Integrated Graphics
Radeon 610M
Radeon 8060S
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
100-000001086
100-000001099
Package
µFC-BGAFL1
FC-BGA
Tj Max
100°C
100°C
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