CPU Comparison

A

AMD

AMD

AMD Ryzen 7 PRO 7745

CORE STATE Raphael

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.8 Base / 5.3 GHz Turbo

CACHE 32 MB (shared)

MAX TDP 65W

ARCHITECTURE Zen 4

nm

PROCESS 5 nm

LAUNCH DATE 2023

VS

A

AMD

AMD

Ryzen AI Max+ 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,809

4,558

cinebench_cinebench_r15_singlecore

396

643

cinebench_cinebench_r20_multicore

11,708

18,995

cinebench_cinebench_r20_singlecore

1,652

2,681

cinebench_cinebench_r23_multicore

27,877

45,228

cinebench_cinebench_r23_singlecore

3,935

6,385

passmark_data_compression

386,829

656,891

passmark_data_encryption

22,821

34,086

passmark_extended_instructions

29,216

52,958

passmark_find_prime_numbers

166

298

passmark_floating_point_math

63,332

123,833

passmark_integer_math

103,330

195,223

passmark_multithread

32,733

53,137

passmark_physics

1,699

3,448

passmark_random_string_sorting

46,759

72,894

passmark_single_thread

3,849

4,123

passmark_singlethread

3,849

4,123

DETAILED SPECIFICATIONS

SPECIFICATION

7 PRO 7745

AI Max+ 395

Core Specs

Cores

8

16 +100.0%

Threads

16

32 +100.0%

Base Clock (GHz)

3.8

3 -21.1%

Boost Clock (GHz)

5.3

5.1 -3.8%

Frequency (GHz)

3.8

3 -21.1%

Turbo Clock (GHz)

5.3

5.1 -3.8%

Multiplier

38

30 -21.1%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

32 MB (shared)

64 MB (shared)

Power

TDP (W)

65

55 -15.4%

PPT

88 W

—

Configurable TDP

—

45-120 W

Architecture

Architecture

Zen 4

Zen 5

Codename

Raphael

Strix Halo

Generation

Ryzen 7 (Zen 4 (Raphael))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

5 nm

4 nm

Transistors

6,570 million

—

Die Size

71 mm²

2x 70.6 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

LPDDR5X

Memory Bus

Dual-channel

Quad-channel

Memory Bandwidth

83.2 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket AM5

AMD Socket FP11

Chipsets

X670E, X670, B650E, B650, A620

—

PCIe

Gen 5, 24 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

Radeon Graphics

Radeon 8060S

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Part Number

100-000000599

100-000001099

Package

FC-LGA1718

FC-BGA

Tj Max

95°C

100°C

Bundled Cooler

Wraith Spire

—

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