CPU Comparison

A

AMD

AMD

AMD Ryzen 5 2600X

CORE STATE Zen

CORE SPECS 6 Cores / 12 Threads

CLOCK SPEED 3.6 Base / 4.25 GHz Turbo

CACHE 16 MB (shared)

MAX TDP 95W

ARCHITECTURE Zen

nm

PROCESS 12 nm

LAUNCH DATE 2018

VS

A

AMD

AMD

Ryzen AI Max+ 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

1,190

4,558

cinebench_cinebench_r15_singlecore

168

643

cinebench_cinebench_r20_multicore

4,959

18,995

cinebench_cinebench_r20_singlecore

700

2,681

cinebench_cinebench_r23_multicore

11,808

45,228

cinebench_cinebench_r23_singlecore

1,667

6,385

geekbench_multicore

5,257

N/A

geekbench_singlecore

1,243

N/A

passmark_data_compression

198,785

656,891

passmark_data_encryption

13,133

34,086

passmark_extended_instructions

7,581

52,958

passmark_find_prime_numbers

38

298

passmark_floating_point_math

24,270

123,833

passmark_integer_math

47,377

195,223

passmark_multithread

13,893

53,137

passmark_physics

695

3,448

passmark_random_string_sorting

22,911

72,894

passmark_single_thread

2,381

4,123

passmark_singlethread

2,381

4,123

DETAILED SPECIFICATIONS

SPECIFICATION

5 2600X

AI Max+ 395

Core Specs

Cores

6

16 +166.7%

Threads

12

32 +166.7%

Base Clock (GHz)

3.6

3 -16.7%

Boost Clock (GHz)

4.25

5.1 +20.0%

Frequency (GHz)

3.6

3 -16.7%

Turbo Clock (GHz)

4.25

5.1 +20.0%

Multiplier

36

30 -16.7%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

96 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

16 MB (shared)

64 MB (shared)

Power

TDP (W)

95

55 -42.1%

Configurable TDP

—

45-120 W

Architecture

Architecture

Zen

Zen 5

Codename

Zen

Strix Halo

Generation

Ryzen 5 (Zen+ (Pinnacle Ridge))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

12 nm

4 nm

Transistors

4,800 million

—

Die Size

213 mm²

2x 70.6 mm²

Foundry

GlobalFoundries

TSMC

Memory

Memory Support

DDR4

LPDDR5X

Memory Bus

Dual-channel

Quad-channel

Memory Bandwidth

46.9 GB/s

256.0 GB/s

ECC Memory

No

Yes

Platform

Socket

AMD Socket AM4

AMD Socket FP11

Chipsets

AMD 300 Series, AMD 400 Series, AMD 500 Series

—

PCIe

Gen 3, 16 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8060S

Other

Market

Desktop

Mobile

Production Status

Active

Active

Launch Price

$229

—

Part Number

YD260XBCM6IAF YD260XBCAFBOX

100-000001099

Package

µOPGA-1331

FC-BGA

Tj Max

95°C

100°C

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