CPU Comparison

A

AMD

AMD

AMD Ryzen 3 PRO 8300G

CORE STATE Phoenix2

CORE SPECS 4 Cores / 8 Threads

CLOCK SPEED 3.4 Base / 4.9 GHz Turbo

CACHE 8 MB (shared)

MAX TDP 65W

ARCHITECTURE Zen 4

nm

PROCESS 4 nm

LAUNCH DATE 2024

VS

A

AMD

AMD

Ryzen AI Max+ 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

1,245

4,558

cinebench_cinebench_r15_singlecore

175

643

cinebench_cinebench_r20_multicore

5,190

18,995

cinebench_cinebench_r20_singlecore

732

2,681

cinebench_cinebench_r23_multicore

12,359

45,228

cinebench_cinebench_r23_singlecore

1,744

6,385

passmark_data_compression

163,197

656,891

passmark_data_encryption

9,350

34,086

passmark_extended_instructions

12,360

52,958

passmark_find_prime_numbers

54

298

passmark_floating_point_math

25,293

123,833

passmark_integer_math

40,469

195,223

passmark_multithread

14,540

53,137

passmark_physics

897

3,448

passmark_random_string_sorting

20,343

72,894

passmark_single_thread

3,844

4,123

passmark_singlethread

3,844

4,123

DETAILED SPECIFICATIONS

SPECIFICATION

3 PRO 8300G

AI Max+ 395

Core Specs

Cores

4

16 +300.0%

Threads

8

32 +300.0%

Base Clock (GHz)

3.4

3 -11.8%

Boost Clock (GHz)

4.9

5.1 +4.1%

Frequency (GHz)

3.4

3 -11.8%

Turbo Clock (GHz)

4.9

5.1 +4.1%

Multiplier

40

30 -25.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

8 MB (shared)

64 MB (shared)

Power

TDP (W)

65

55 -15.4%

PPT

61-88 W

—

Configurable TDP

45 W

45-120 W

Architecture

Architecture

Zen 4

Zen 5

Codename

Phoenix2

Strix Halo

Generation

Ryzen 3 (Zen 4 (Phoenix))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

4 nm

4 nm

Transistors

20,900 million

—

Die Size

137 mm²

2x 70.6 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

LPDDR5X

Memory Bus

Dual-channel

Quad-channel

Memory Bandwidth

83.2 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket AM5

AMD Socket FP11

Chipsets

X870E, X870, B850, B840, X670E, X670, B650E, B650, A620

—

PCIe

Gen 4, 14 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

Intel Hybrid

Hybrid Cores

1 + 3

—

E-Core Frequency

3.2 GHz up to 3.6 GHz

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

Radeon 740M

Radeon 8060S

Other

Market

Desktop

Mobile

Production Status

Active

Active

Part Number

100-000001187

100-000001099

Package

FC-LGA1718

FC-BGA

Tj Max

95°C

100°C

Bundled Cooler

Wraith Stealth

—

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