CPU Comparison

AMD
AMD

AMD EPYC 8024P

CORE STATE Siena
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 2.4 Base / 3 GHz Turbo
CACHE 32 MB (shared)
MAX TDP 90W
ARCHITECTURE Zen 4c
nm
PROCESS 5 nm
LAUNCH DATE 2023
VS
AMD
AMD

Ryzen AI Max+ 395

CORE STATE Strix Halo
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 3 Base / 5.1 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,761
4,558
cinebench_cinebench_r15_singlecore
248
643
cinebench_cinebench_r20_multicore
7,338
18,995
cinebench_cinebench_r20_singlecore
1,035
2,681
cinebench_cinebench_r23_multicore
17,472
45,228
cinebench_cinebench_r23_singlecore
2,466
6,385
passmark_data_compression
232,242
656,891
passmark_data_encryption
15,809
34,086
passmark_extended_instructions
14,251
52,958
passmark_find_prime_numbers
109
298
passmark_floating_point_math
34,757
123,833
passmark_integer_math
62,128
195,223
passmark_multithread
20,556
53,137
passmark_physics
1,905
3,448
passmark_random_string_sorting
34,613
72,894
passmark_single_thread
2,371
4,123
passmark_singlethread
2,371
4,123

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 8024P
AI Max+ 395
Core Specs
Cores
8
16 +100.0%
Threads
16
32 +100.0%
Base Clock (GHz)
2.4
3 +25.0%
Boost Clock (GHz)
3
5.1 +70.0%
Frequency (GHz)
2.4
3 +25.0%
Turbo Clock (GHz)
3
5.1 +70.0%
Multiplier
24
30 +25.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
32 MB (shared)
64 MB (shared)
Power
TDP (W)
90
55 -38.9%
Configurable TDP
70-100 W
45-120 W
Architecture
Architecture
Zen 4c
Zen 5
Codename
Siena
Strix Halo
Generation
EPYC (Zen 4c (Siena))
Ryzen AI Max (Zen 5 (Strix Halo))
Process Size
5 nm
4 nm
Transistors
8,875 million
Die Size
73 mm²
2x 70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
LPDDR5X
Memory Bus
Six-channel
Quad-channel
Memory Bandwidth
230.4 GB/s
256.0 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket SP6
AMD Socket FP11
PCIe
Gen 5, 96 Lanes(CPU only)
Gen 4, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
AI/NPU
NPU
Yes / 50 TOPS
Graphics
Integrated Graphics
Radeon 8060S
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Launch Price
$409
Part Number
100-000001136
100-000001099
Package
FC-LGA4844
FC-BGA
Tj Max
100°C
Bundled Cooler
None
View EPYC 8024P Details View Ryzen AI Max+ 395 Details