CPU Comparison

A

AMD

AMD

AMD Ryzen 5 7645HX

CORE STATE Dragon Range

CORE SPECS 6 Cores / 12 Threads

CLOCK SPEED 4 Base / 5 GHz Turbo

CACHE 32 MB (shared)

MAX TDP 45W

ARCHITECTURE Zen 4

nm

PROCESS 5 nm

LAUNCH DATE 2023

VS

A

AMD

AMD

Ryzen AI Max 390

CORE STATE Strix Halo

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.2 Base / 5 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,268

3,635

cinebench_cinebench_r15_singlecore

320

513

cinebench_cinebench_r20_multicore

9,451

15,146

cinebench_cinebench_r20_singlecore

1,334

2,138

cinebench_cinebench_r23_multicore

22,504

36,064

cinebench_cinebench_r23_singlecore

3,177

5,091

geekbench_multicore

11,586

N/A

geekbench_singlecore

2,657

N/A

passmark_data_compression

302,256

493,517

passmark_data_encryption

17,900

25,692

passmark_extended_instructions

22,969

39,250

passmark_find_prime_numbers

178

322

passmark_floating_point_math

48,798

93,598

passmark_integer_math

77,432

148,707

passmark_multithread

26,476

42,429

passmark_physics

1,497

2,754

passmark_random_string_sorting

34,434

53,851

passmark_single_thread

3,907

4,025

passmark_singlethread

3,907

4,025

DETAILED SPECIFICATIONS

SPECIFICATION

5 7645HX

AI Max 390

Core Specs

Cores

6

12 +100.0%

Threads

12

24 +100.0%

Base Clock (GHz)

4

3.2 -20.0%

Boost Clock (GHz)

5

5 0.0%

Frequency (GHz)

4

3.2 -20.0%

Turbo Clock (GHz)

5

5 0.0%

Multiplier

40

32 -20.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

32 MB (shared)

64 MB (shared)

Power

TDP (W)

45

55 +22.2%

Configurable TDP

75 W

45-120 W

Architecture

Architecture

Zen 4

Zen 5

Codename

Dragon Range

Strix Halo

Generation

Ryzen 5 (Zen 4 (Dragon Range))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

5 nm

4 nm

Transistors

6,570 million

—

Die Size

71 mm²

2x 70.6 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

LPDDR5X

Memory Bus

Dual-channel

Quad-channel

Memory Bandwidth

83.2 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket FL1

AMD Socket FP11

PCIe

Gen 5, 28 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

Radeon 610M

Radeon 8050S

Other

Market

Mobile

Mobile

Production Status

Active

Active

Part Number

100-000000872

100-000001423

Package

µFC-BGAFL1

FC-BGA

Tj Max

100°C

100°C

View Ryzen 5 7645HX Details View Ryzen AI Max 390 Details