CPU Comparison

AMD
AMD

AMD EPYC 8024P

CORE STATE Siena
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 2.4 Base / 3 GHz Turbo
CACHE 32 MB (shared)
MAX TDP 90W
ARCHITECTURE Zen 4c
nm
PROCESS 5 nm
LAUNCH DATE 2023
VS
AMD
AMD

Ryzen AI Max 390

CORE STATE Strix Halo
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.2 Base / 5 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,761
3,635
cinebench_cinebench_r15_singlecore
248
513
cinebench_cinebench_r20_multicore
7,338
15,146
cinebench_cinebench_r20_singlecore
1,035
2,138
cinebench_cinebench_r23_multicore
17,472
36,064
cinebench_cinebench_r23_singlecore
2,466
5,091
passmark_data_compression
232,242
493,517
passmark_data_encryption
15,809
25,692
passmark_extended_instructions
14,251
39,250
passmark_find_prime_numbers
109
322
passmark_floating_point_math
34,757
93,598
passmark_integer_math
62,128
148,707
passmark_multithread
20,556
42,429
passmark_physics
1,905
2,754
passmark_random_string_sorting
34,613
53,851
passmark_single_thread
2,371
4,025
passmark_singlethread
2,371
4,025

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 8024P
AI Max 390
Core Specs
Cores
8
12 +50.0%
Threads
16
24 +50.0%
Base Clock (GHz)
2.4
3.2 +33.3%
Boost Clock (GHz)
3
5 +66.7%
Frequency (GHz)
2.4
3.2 +33.3%
Turbo Clock (GHz)
3
5 +66.7%
Multiplier
24
32 +33.3%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
32 MB (shared)
64 MB (shared)
Power
TDP (W)
90
55 -38.9%
Configurable TDP
70-100 W
45-120 W
Architecture
Architecture
Zen 4c
Zen 5
Codename
Siena
Strix Halo
Generation
EPYC (Zen 4c (Siena))
Ryzen AI Max (Zen 5 (Strix Halo))
Process Size
5 nm
4 nm
Transistors
8,875 million
Die Size
73 mm²
2x 70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
LPDDR5X
Memory Bus
Six-channel
Quad-channel
Memory Bandwidth
230.4 GB/s
256.0 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket SP6
AMD Socket FP11
PCIe
Gen 5, 96 Lanes(CPU only)
Gen 4, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
AI/NPU
NPU
Yes / 50 TOPS
Graphics
Integrated Graphics
Radeon 8050S
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Launch Price
$409
Part Number
100-000001136
100-000001423
Package
FC-LGA4844
FC-BGA
Tj Max
100°C
Bundled Cooler
None
View EPYC 8024P Details View Ryzen AI Max 390 Details