CPU Comparison

AMD
AMD

AMD EPYC 75F3

CORE STATE Milan
CORE SPECS 32 Cores / 64 Threads
CLOCK SPEED 2.95 Base / 4 GHz Turbo
CACHE 256 MB (shared)
MAX TDP 280W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2021
VS
AMD
AMD

Ryzen AI Max 390

CORE STATE Strix Halo
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.2 Base / 5 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
5,526
3,635
cinebench_cinebench_r15_singlecore
780
513
cinebench_cinebench_r20_multicore
23,028
15,146
cinebench_cinebench_r20_singlecore
3,250
2,138
cinebench_cinebench_r23_multicore
54,829
36,064
cinebench_cinebench_r23_singlecore
7,740
5,091
passmark_data_compression
N/A
493,517
passmark_data_encryption
N/A
25,692
passmark_extended_instructions
N/A
39,250
passmark_find_prime_numbers
N/A
322
passmark_floating_point_math
N/A
93,598
passmark_integer_math
N/A
148,707
passmark_multithread
N/A
42,429
passmark_physics
N/A
2,754
passmark_random_string_sorting
N/A
53,851
passmark_single_thread
N/A
4,025
passmark_singlethread
N/A
4,025

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 75F3
AI Max 390
Core Specs
Cores
32
12 -62.5%
Threads
64
24 -62.5%
Base Clock (GHz)
2.95
3.2 +8.5%
Boost Clock (GHz)
4
5 +25.0%
Frequency (GHz)
2.95
3.2 +8.5%
Turbo Clock (GHz)
4
5 +25.0%
Multiplier
29.5
32 +8.5%
SMP CPUs
2
1 -50.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
256 MB (shared)
64 MB (shared)
Power
TDP (W)
280
55 -80.4%
Configurable TDP
225 W
45-120 W
Architecture
Architecture
Zen 3
Zen 5
Codename
Milan
Strix Halo
Generation
EPYC (Zen 3 (Milan))
Ryzen AI Max (Zen 5 (Strix Halo))
Process Size
7 nm
4 nm
Transistors
33,200 million
Die Size
8x 81 mm²
2x 70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
LPDDR5X
Memory Bus
Eight-channel
Quad-channel
Memory Bandwidth
204.8 GB/s
256.0 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket SP3
AMD Socket FP11
PCIe
Gen 4, 128 Lanes(CPU only)
Gen 4, 16 Lanes(CPU only)
AMD Multi-Die
CCDs
8
Cores per CCD
4
IO Process Size
12 nm
AI/NPU
NPU
Yes / 50 TOPS
Graphics
Integrated Graphics
Radeon 8050S
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Launch Price
$4860
Part Number
100-000000313100-100000313WOF
100-000001423
Package
FCLGA-4094
FC-BGA
Tj Max
100°C
View EPYC 75F3 Details View Ryzen AI Max 390 Details