AMD Ryzen AI 9 HX PRO 470 vs Intel Processor N150 Comparison

AMD
AMD

AMD Ryzen AI 9 HX PRO 470

CORE STATE Gorgon Point
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 2 Base / 5.2 GHz Turbo
CACHE 16 MB
MAX TDP 28W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2026
VS
Intel
INTEL

Processor N150

CORE STATE Twin Lake
CORE SPECS 4 Cores / 4 Threads
CLOCK SPEED 0.1 Base / 3.6 GHz Turbo
CACHE 6 MB (shared)
MAX TDP 6W
ARCHITECTURE Twin Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
3,234
422.5
cinebench_cinebench_r15_singlecore
313
153.15
cinebench_cinebench_r23_multicore
19,095
2,590.5
cinebench_cinebench_r23_singlecore
2,054
935
passmark_data_compression
461,195
N/A
passmark_data_encryption
22,929
N/A
passmark_extended_instructions
32,803
N/A
passmark_find_prime_numbers
136
N/A
passmark_floating_point_math
80,023
N/A
passmark_integer_math
127,573
N/A
passmark_multithread
36,402
N/A
passmark_physics
1,915
N/A
passmark_random_string_sorting
48,824
N/A
passmark_single_thread
4,050
N/A
passmark_singlethread
4,050
N/A

Analysis: AMD Ryzen AI 9 HX PRO 470 vs Intel Processor N150

The Verdict

The recorded data presents a decisive split between these two mobile processors. The AMD Ryzen AI 9 HX PRO 470 is a high-performance, high-core-count part designed for demanding parallel workloads, while the Intel Processor N150 is a low-power, low-core-count chip aimed at basic, energy-efficient tasks. The AMD part wins all four head-to-head benchmark comparisons, with its most significant lead in multi-threaded tests. The Intel N150, with its 6 W TDP and 4-core/4-thread configuration, is clearly positioned for fanless or ultra-low-power systems where absolute performance is secondary to power draw. The Ryzen AI 9 HX PRO 470, a 12-core/24-thread processor in a 28 W envelope, is for users who need strong multi-tasking and sustained compute throughput. The data shows no scenario in the recorded benchmarks where the Intel part beats the AMD part, so the choice is determined by whether the workload requires the AMD part's capabilities at all.

FAQ

Q: How much faster is the AMD Ryzen AI 9 HX PRO 470 in multi-core workloads?

A: In Cinebench R23 multi-core, the AMD part scores 19095 against 2590.5 for the Intel N150, a delta of 637.1%. In Cinebench R15 multi-core, the AMD part scores 3234 against 422.5, a delta of 665.4%.

Q: What is the difference in single-core performance?

A: The AMD part leads by 119.7% in Cinebench R23 single-core (2054 vs 935) and by 104.4% in Cinebench R15 single-core (313 vs 153.15). The gap is still large, but smaller than the multi-core gap.

Q: Which processor has more cores and threads?

A: The AMD Ryzen AI 9 HX PRO 470 has 12 cores and 24 threads. The Intel Processor N150 has 4 cores and 4 threads.

Q: What are the TDP figures for each chip?

A: The AMD part has a TDP of 28 W. The Intel part has a TDP of 6 W, which is significantly lower.

Q: How do the two processors compare in overall standings?

A: The AMD Ryzen AI 9 HX PRO 470 sits in the 92nd percentile of all CPUs, while the Intel Processor N150 sits in the 28th percentile. The AMD part's average benchmark score is 56306, versus 1025 for the Intel part.

Q: What are the nearest rivals for each chip in the database?

A: The AMD part's nearest rival by average score is the AMD Ryzen AI Max 390 at 56273 (0.1% delta). The Intel part's nearest rival is the AMD Phenom II X6 1075T at 1024 (0.1% delta).

Architecture Differences

The two processors are built on fundamentally different architectures. The AMD Ryzen AI 9 HX PRO 470 uses the Zen 5 architecture, specifically a hybrid configuration of Zen 5 and Zen 5c cores, under the codename Gorgon Point. It is manufactured on a 4 nm process at TSMC. The Intel Processor N150 uses the Twin Lake architecture, a successor to Alder Lake-N, and is built on a 10 nm process at Intel.

The AMD part's cache layout includes 80 KB of L1 per core, 1 MB of L2 per core, and a 16 MB L3 cache. The Intel part has 96 KB of L1 per core, 2 MB of shared L2, and 6 MB of shared L3. The AMD part's per-core L2 design is standard for high-end Zen parts, while Intel's shared L2 and smaller L3 reflect a simpler, lower-cost design.

Memory support also differs. The AMD part supports DDR5 and LPDDR5X with dual-channel memory, yielding a memory bandwidth of 89.6 GB/s. The Intel part supports DDR4, DDR5, and LPDDR5, but only single-channel, with a memory bandwidth of 38.4 GB/s. The AMD part also supports ECC memory, which the Intel part does not. PCIe connectivity differs as well: the AMD part provides Gen 4 with 16 lanes (CPU only), while the Intel part provides Gen 3 with 9 lanes (CPU only).

The integrated graphics differ. The AMD part uses the Radeon 890M, while the Intel part uses the UHD Graphics 730. The AMD part's die size is recorded at 233 mm², while the Intel part's die size is not recorded in the database.

Specification Differences

The table below lists the key specifications where the two parts differ, based on the recorded data.

| Specification | AMD Ryzen AI 9 HX PRO 470 | Intel Processor N150 |

|----------------|---------------------------|----------------------|

| Cores | 12 | 4 |

| Threads | 24 | 4 |

| Base Clock | 2.00 GHz | 0.10 GHz |

| Boost Clock | 5.20 GHz | 3.60 GHz |

| TDP | 28 W | 6 W |

| Socket | AMD Socket FP8 | Intel BGA 1264 |

| Architecture | Zen 5 | Twin Lake |

| Codename | Gorgon Point | Twin Lake |

| Process Node | 4 nm | 10 nm |

| Foundry | TSMC | Intel |

| L1 Cache | 80 KB (per core) | 96 KB (per core) |

| L2 Cache | 1 MB (per core) | 2 MB (shared) |

| L3 Cache | 16 MB | 6 MB (shared) |

| Memory Support | DDR5, LPDDR5X | DDR4, DDR5, LPDDR5 |

| Memory Bus | Dual-channel | Single-channel |

| Memory Bandwidth | 89.6 GB/s | 38.4 GB/s |

| ECC Memory | Yes | No |

| PCIe | Gen 4, 16 Lanes (CPU only) | Gen 3, 9 Lanes (CPU only) |

| Integrated Graphics | Radeon 890M | UHD Graphics 730 |

| Release Date | 2026-01-04 | 2024-11-19 |

| Part Number | 100-000001937 | SRPNR |

Head-to-Head Benchmarks

The database records four direct comparisons between the two processors, all in Cinebench tests. The AMD Ryzen AI 9 HX PRO 470 wins every test, and the margins are substantial.

In Cinebench R15 multi-core, the AMD part scores 3234 against 422.5 for the Intel N150. That is a 665.4% advantage. This test is heavily reliant on core count and thread count, and the AMD part's 12 cores and 24 threads overwhelm the Intel part's 4 cores and 4 threads.

In Cinebench R23 multi-core, the AMD part scores 19095 against 2590.5, a delta of 637.1%. The absolute score difference is over 16,500 points, which reflects the AMD part's ability to sustain high throughput across many threads.

Single-core results are closer but still one-sided. In Cinebench R15 single-core, the AMD part scores 313 versus 153.15 for the Intel part, a 104.4% lead. In Cinebench R23 single-core, the AMD part scores 2054 versus 935, a 119.7% lead. The AMD part's higher boost clock of 5.20 GHz, compared to 3.60 GHz for the Intel part, contributes to this advantage, as does the Zen 5 architecture's stronger per-core instructions per clock.

The win count is 4 for the AMD part and 0 for the Intel part. The data does not include any test where the Intel N150 closes the gap to a competitive margin.

Where Each One Wins

The AMD Ryzen AI 9 HX PRO 470 wins in every recorded benchmark category. Its largest leads are in multi-core tests, where its 12-core/24-thread configuration and dual-channel memory bandwidth of 89.6 GB/s provide a clear advantage for parallel workloads. The Cinebench R23 multi-core score of 19095 places it in the 92nd percentile of all CPUs, a strong indicator of sustained multi-threaded performance. The 16 MB L3 cache and per-core L2 of 1 MB also help with data-heavy tasks.

The Intel Processor N150 has no benchmark wins in the database. Its advantage is not in performance but in power efficiency. With a TDP of 6 W, it draws far less power than the AMD part's 28 W. This makes it suitable for systems where thermal output and battery life are the primary constraints, such as compact fanless laptops or industrial embedded devices. Its 4-core/4-thread design and 10 nm process are aimed at basic tasks like web browsing, document editing, and light media playback. The single-channel memory bus and 38.4 GB/s bandwidth are consistent with this low-intensity role.

The AMD part's release date is 2026-01-04, while the Intel part was released on 2024-11-19, so the Intel part is an earlier product. The AMD part also includes ECC memory support, which the Intel part lacks, making it the more robust choice for workstation or server-adjacent use cases. The AMD part's Radeon 890M integrated graphics are a higher-tier solution than the Intel UHD Graphics 730, though the database does not include graphics benchmarks.

In summary, the data supports a clear split: the AMD Ryzen AI 9 HX PRO 470 is for compute-heavy mobile workloads, and the Intel Processor N150 is for ultra-low-power systems where raw performance is not the priority. The 92nd versus 28th percentile standings quantify the overall performance hierarchy.

DETAILED SPECIFICATIONS

SPECIFICATION
AI 9 HX PRO 470
Processor N150
Core Specs
Cores
12
4 -66.7%
Threads
24
4 -83.3%
Base Clock (GHz)
2
0.1 -95.0%
Boost Clock (GHz)
5.2
3.6 -30.8%
Frequency (GHz)
2
0.1 -95.0%
Turbo Clock (GHz)
5.2
3.6 -30.8%
Multiplier
20
1 -95.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
96 KB (per core)
L2 Cache
1 MB (per core)
2 MB (shared)
L3 Cache
16 MB
6 MB (shared)
Power
TDP (W)
28
6 -78.6%
Configurable TDP
15-54 W
—
Architecture
Architecture
Zen 5
Twin Lake
Codename
Gorgon Point
Twin Lake
Generation
Ryzen AI PRO 400 (Zen 5 / Zen 5c)
Intel Processor (Alder Lake-N)
Process Size
4 nm
10 nm
Die Size
233 mm²
—
Foundry
TSMC
Intel
Memory
Memory Support
DDR5, LPDDR5X
DDR4, DDR5, LPDDR5
Memory Bus
Dual-channel
Single-channel
Memory Bandwidth
89.6 GB/s
38.4 GB/s
ECC Memory
Yes
No
DDR4 Speed
—
3200 MT/s
Platform
Socket
AMD Socket FP8
Intel BGA 1264
PCIe
Gen 4, 16 Lanes(CPU only)
Gen 3, 9 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
4 + 8
—
E-Core Frequency
1400 MHz up to 3.3 GHz
—
AI/NPU
NPU
Yes / 55 TOPS
—
Graphics
Integrated Graphics
Radeon 890M
UHD Graphics 730
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
100-000001937
SRPNR
Package
FP8
FC-BGA16F
Tj Max
100°C
105°C
View Ryzen AI 9 HX PRO 470 Details View Processor N150 Details