AMD Ryzen AI 9 HX PRO 370 vs Intel Core i9-13900F Comparison

Head-to-Head Benchmarks

The benchmark database shows a one-sided contest. The Intel Core i9-13900F wins all 15 recorded head-to-head comparisons against the AMD Ryzen AI 9 HX PRO 370. No test favors the AMD part. The margin varies from a modest single-digit edge to a dramatic 190% gap, reflecting the fundamentally different roles these two processors are designed to play.

The most extreme result appears in Cinebench R23 single-core performance. The Intel chip scores 5778, while the AMD chip manages only 1992, a delta of 190.1%. This is not a small gap; it is a chasm. The Intel part's high boost clock of 5.60 GHz, combined with its Raptor Lake architecture, delivers a level of single-threaded throughput that the Zen 5-based mobile chip cannot approach in this test. The Cinebench R15 single-core test tells a similar story, with Intel ahead by 88.3%, scoring 582 versus 309.

Multi-threaded workloads show an equally lopsided result. In Cinebench R23 multi-core, the Intel i9-13900F scores 40928 against the AMD's 18520, a 121% advantage. The Intel part's 24 cores and 32 threads outnumber the AMD chip's 12 cores and 24 threads, and that raw resource advantage shows up clearly in rendering workloads. Cinebench R15 multi-core sees a 29.8% lead for Intel, with scores of 4125 and 3178 respectively.

PassMark tests reinforce the pattern. The Intel chip leads by 57.6% in data compression (635147 versus 403113), by 83.8% in data encryption (38214 versus 20788), and by 56.7% in integer math (188022 versus 120016). Floating point math shows a 78.3% gap, with Intel scoring 131007 against AMD's 73493. The PassMark multi-thread test has Intel ahead by 49%, at 49693 versus 33349. Extended instructions, physics, and random string sorting all favor Intel by margins between 29.7% and 60.9%.

The closest results are in PassMark single-thread tests, where the Intel chip scores 4406 and the AMD chip scores 4003, a 10.1% lead. This suggests that in lightly threaded, short-duration tasks, the AMD part is competitive, though still behind. The data shows Intel's dominance is nearly total, but the single-thread margins indicate that AMD's Zen 5 architecture has narrowed the gap in specific scenarios.

Architecture Differences

The two chips come from different design philosophies. The Intel Core i9-13900F is a desktop part built on Raptor Lake, using a 10 nm process at Intel's own foundry. The AMD Ryzen AI 9 HX PRO 370 is a mobile processor using Zen 5 architecture, built on a 4 nm process at TSMC. This process difference is significant: the AMD chip uses a much smaller fabrication node, which typically enables better power efficiency, though the benchmark data does not directly measure power consumption.

Core counts diverge sharply. The Intel part has 24 cores and 32 threads, while the AMD part has 12 cores and 24 threads. The Intel chip's extra cores and threads are the primary driver of its multi-threaded victories. Cache configurations also differ. Intel provides 2 MB of L2 cache per core and 36 MB of shared L3 cache. AMD provides 1 MB of L2 per core and 16 MB of L3. Both use 80 KB of L1 cache per core. The larger cache pool on the Intel side likely contributes to its performance in data-heavy workloads like compression and encryption.

Memory support differs as well. The Intel chip supports both DDR4 and DDR5, while the AMD chip supports DDR5 and LPDDR5X. The AMD part has a listed memory bandwidth of 89.6 GB/s, while the Intel part has no bandwidth figure in the database. Both support ECC memory. PCIe capabilities vary: Intel offers Gen 5 with 20 lanes, AMD offers Gen 4 with 16 lanes. The AMD chip includes integrated Radeon 890M graphics, while the Intel part has no integrated graphics listed.

The physical packages reflect their intended platforms. Intel uses Socket 1700 for desktop builds; AMD uses Socket FP8 for mobile systems. The Intel die is 257 mm², the AMD die is 233 mm². Both parts are locked, with no unlocked multiplier. The Intel chip was released in January 2023 with a launch MSRP of $524; the AMD chip was released in January 2025 with no launch MSRP listed. The process node difference of 10 nm versus 4 nm is the most notable architectural divergence, and it explains why AMD can fit a competitive mobile chip into a much lower thermal envelope, even if it loses on raw performance.

The Verdict

The data is unambiguous. The Intel Core i9-13900F is the faster processor in every benchmark recorded. It wins all 15 head-to-head comparisons, with an average benchmark score of 51730 against the AMD chip's 50448. The Intel part sits at the 91st percentile among all CPUs, while the AMD chip sits at the 90th percentile. These are close overall standings, but the head-to-head results are not close at all.

For users who prioritize raw compute throughput in rendering, encoding, or heavy multi-threaded tasks, the Intel chip is the clear choice. Its 121% lead in Cinebench R23 multi-core and 49% lead in PassMark multi-thread are decisive. For users who need a mobile processor with integrated graphics, the AMD chip is the only option of the two, as it is designed for laptops and includes the Radeon 890M. The Intel part has no integrated graphics and targets desktop systems.

The AMD chip's advantages are not visible in the benchmark scores. It has a much lower TDP of 28 watts versus Intel's 65 watts, which suggests better power efficiency, but the database does not include efficiency metrics. The AMD part also uses a newer process node and supports LPDDR5X memory, which are relevant for mobile designs. However, based strictly on the recorded performance data, the Intel Core i9-13900F is the superior processor. The AMD Ryzen AI 9 HX PRO 370 is competitive in single-threaded tasks, trailing by only 10.1%, but falls far behind in almost every other category.

Specification Differences

The two processors differ in nearly every specification category. The Intel Core i9-13900F has 24 cores and 32 threads, while the AMD Ryzen AI 9 HX PRO 370 has 12 cores and 24 threads. Base clocks are nearly identical at 2.00 GHz, but boost clocks differ: Intel reaches 5.60 GHz, AMD reaches 5.10 GHz. TDP differs substantially, with Intel at 65 watts and AMD at 28 watts.

The Intel chip uses Intel Socket 1700, the AMD chip uses AMD Socket FP8. Architecture differs: Raptor Lake versus Zen 5. The process node is 10 nm for Intel and 4 nm for AMD. Die sizes are 257 mm² and 233 mm² respectively. Cache configurations differ in L2 and L3: Intel has 2 MB per core L2 and 36 MB shared L3; AMD has 1 MB per core L2 and 16 MB L3. Both share the same 80 KB per core L1 cache.

Memory support varies: Intel supports DDR4 and DDR5; AMD supports DDR5 and LPDDR5X. AMD lists a memory bandwidth of 89.6 GB/s; Intel does not list one. Both support ECC memory. PCIe differs: Intel has Gen 5 with 20 lanes; AMD has Gen 4 with 16 lanes. The AMD chip has integrated Radeon 890M graphics; the Intel chip has none listed. Intel has a launch MSRP of $524; AMD has none. Both are locked, both are active in production, and both lack v-cache.

FAQ

Q: Which processor wins in multi-threaded performance?

A: The Intel Core i9-13900F wins decisively. It leads by 121% in Cinebench R23 multi-core and by 49% in PassMark multi-thread.

Q: How close are they in single-threaded performance?

A: They are closest in PassMark single-thread tests, where Intel leads by 10.1% with a score of 4406 against AMD's 4003. In Cinebench R23 single-core, the gap is much larger at 190.1%.

Q: What is the core and thread count difference?

A: The Intel chip has 24 cores and 32 threads. The AMD chip has 12 cores and 24 threads.

Q: Do both processors support ECC memory?

A: Yes, both the Intel Core i9-13900F and the AMD Ryzen AI 9 HX PRO 370 support ECC memory.

Q: Which processor has integrated graphics?

A: Only the AMD Ryzen AI 9 HX PRO 370 has integrated graphics, the Radeon 890M. The Intel Core i9-13900F has no integrated graphics listed.

Q: What are the process nodes for each chip?

A: The Intel Core i9-13900F uses a 10 nm process at Intel. The AMD Ryzen AI 9 HX PRO 370 uses a 4 nm process at TSMC.