AMD Ryzen AI 9 HX PRO 370 vs Intel Core 5 221E Comparison

AMD
AMD

AMD Ryzen AI 9 HX PRO 370

CORE STATE Strix Point
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 2 Base / 5.1 GHz Turbo
CACHE 16 MB
MAX TDP 28W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025
VS
Intel
INTEL

Core 5 221E

CORE STATE Bartlett Lake
CORE SPECS 14 Cores / 20 Threads
CLOCK SPEED 2.7 Base / 5.2 GHz Turbo
CACHE 24 MB (shared)
MAX TDP 65W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
3,178
2,613
cinebench_cinebench_r15_singlecore
309
368
cinebench_cinebench_r23_multicore
18,520
25,933
cinebench_cinebench_r23_singlecore
1,992
3,661
passmark_data_compression
403,113
324,285
passmark_data_encryption
20,788
19,205
passmark_extended_instructions
28,165
18,216
passmark_find_prime_numbers
131
173
passmark_floating_point_math
73,493
79,028
passmark_integer_math
120,016
117,813
passmark_multithread
33,349
30,510
passmark_physics
1,892
2,230
passmark_random_string_sorting
43,767
37,686
passmark_single_thread
4,003
4,147
passmark_singlethread
4,003
4,147
cinebench_cinebench_r20_multicore
N/A
10,891
cinebench_cinebench_r20_singlecore
N/A
1,537

Analysis: AMD Ryzen AI 9 HX PRO 370 vs Intel Core 5 221E

FAQ

Q: Which processor has more cores and threads?

A: The AMD Ryzen AI 9 HX PRO 370 has 12 cores and 24 threads, while the Intel Core 5 221E has 14 cores and 20 threads. Intel offers two more physical cores, but AMD supports four more threads.

Q: What are the boost clock speeds of these two processors?

A: The AMD Ryzen AI 9 HX PRO 370 boosts up to 5.10 GHz, and the Intel Core 5 221E boosts up to 5.20 GHz. The Intel part has a 0.10 GHz higher boost ceiling.

Q: How do their average benchmark scores compare?

A: The AMD Ryzen AI 9 HX PRO 370 has an average benchmark score of 50448, placing it in the 90th percentile. The Intel Core 5 221E has an average score of 40144, placing it in the 87th percentile. The AMD part sits about 25.7% higher in average score.

Q: Which processor has a higher TDP?

A: The Intel Core 5 221E has a TDP of 65 watts, while the AMD Ryzen AI 9 HX PRO 370 has a TDP of 28 watts. The Intel chip draws more than twice the power budget.

Q: Do both processors support ECC memory?

A: Yes, both the AMD Ryzen AI 9 HX PRO 370 and the Intel Core 5 221E list ECC memory support as enabled.

Q: What integrated graphics do they each use?

A: The AMD Ryzen AI 9 HX PRO 370 uses the Radeon 890M, while the Intel Core 5 221E uses the UHD Graphics 730.

Architecture Differences

The AMD Ryzen AI 9 HX PRO 370 is built on TSMC's 4 nm process using the Zen 5 architecture with the Strix Point codename, part of the Ryzen AI PRO 300 generation that mixes Zen 5 and Zen 5c cores. The die measures 233 mm². The Intel Core 5 221E comes from the Bartlett Lake codename in the Core 5 generation, fabricated on Intel's 10 nm process with a die size of 257 mm². AMD uses a smaller process node and a smaller physical die.

Cache organization differs substantially. Both parts allocate 80 KB of L1 per core, but the AMD chip has 1 MB of L2 per core while the Intel chip has 2 MB of L2 per core. The L3 cache also differs: AMD has 16 MB total, while Intel has 24 MB shared. Intel's larger cache pool could benefit workloads that repeatedly access a sizeable working set.

Memory support splits along platform lines. The AMD processor supports DDR5 and LPDDR5X, while the Intel processor supports DDR4 and DDR5. Both use a dual-channel memory bus with 89.6 GB/s of bandwidth. PCIe connectivity differs by generation: AMD provides Gen 4 with 16 lanes (CPU only), and Intel provides Gen 5 with 16 lanes (CPU only). Intel's PCIe Gen 5 support offers double the per-lane bandwidth for compatible devices.

The socket and market segment separate these parts clearly. AMD uses Socket FP8 and targets mobile systems. Intel uses Socket 1700 and targets desktop systems. The AMD chip has a 28 W TDP, while the Intel chip has a 65 W TDP. Production status is active for both, and neither has an unlocked multiplier.

The Verdict

The recorded data splits these two processors into separate use cases. The AMD Ryzen AI 9 HX PRO 370 wins 7 head-to-head benchmarks, and the Intel Core 5 221E wins 8. The AMD part's 28 W TDP, mobile socket, and 4 nm process position it for thin-and-light laptops where power efficiency matters. The Intel part's 65 W TDP, desktop socket, and 14 physical cores position it for desktop systems where sustained multithreaded performance and single-core speed take priority.

Users who need the highest single-core Cinebench scores should choose the Intel Core 5 221E. The data shows a 45.6% lead in Cinebench R23 single-core and a 16% lead in Cinebench R15 single-core. Users who need data compression throughput, extended instruction throughput, or encryption throughput should choose the AMD Ryzen AI 9 HX PRO 370, which leads by 24.3%, 54.6%, and 8.2% respectively in those Passmark tests.

The AMD part also holds the higher overall average benchmark score at 50448 versus 40144, and the higher percentile at 90 versus 87. But the Intel part's Cinebench R23 multicore score of 25933 versus 18520 is a decisive win for heavily threaded rendering. The choice depends on whether the workload leans toward the AMD wins in compression and instructions or the Intel wins in rendering and physics.

Specification Differences

| Specification | AMD Ryzen AI 9 HX PRO 370 | Intel Core 5 221E |

|---|---|---|

| Cores | 12 | 14 |

| Threads | 24 | 20 |

| Base Clock | 2.00 GHz | 2.70 GHz |

| Boost Clock | 5.10 GHz | 5.20 GHz |

| TDP | 28 W | 65 W |

| Socket | AMD Socket FP8 | Intel Socket 1700 |

| Codename | Strix Point | Bartlett Lake |

| Process Node | 4 nm | 10 nm |

| Foundry | TSMC | Intel |

| Die Size | 233 mm² | 257 mm² |

| L2 Cache | 1 MB (per core) | 2 MB (per core) |

| L3 Cache | 16 MB | 24 MB (shared) |

| Memory Support | DDR5, LPDDR5X | DDR4, DDR5 |

| Memory Bandwidth | 89.6 GB/s | 89.6 GB/s |

| PCIe | Gen 4, 16 Lanes (CPU only) | Gen 5, 16 Lanes (CPU only) |

| Integrated Graphics | Radeon 890M | UHD Graphics 730 |

| Market Segment | Mobile | Desktop |

| Release Date | 2025-01-05 | 2025-01-12 |

| Launch MSRP | Not available | $232 |

Both processors use dual-channel memory, support ECC, and have 80 KB of L1 cache per core. The Intel part has a higher base clock by 0.70 GHz, a higher boost clock by 0.10 GHz, two more cores, and 8 MB more L3 cache. The AMD part has four more threads, a smaller process node, a smaller die, and a much lower TDP.

Head-to-Head Benchmarks

The biggest win for the AMD Ryzen AI 9 HX PRO 370 appears in Passmark extended instructions, where it scores 28165 against 18216, a 54.6% advantage. This indicates substantially stronger SIMD and instruction-set throughput. Data compression also favors AMD strongly: 403113 versus 324285, a 24.3% lead. Random string sorting goes to AMD at 43767 versus 37686, a 16.1% lead. Passmark multithread shows AMD ahead at 33349 versus 30510, a 9.3% gain. Data encryption goes to AMD at 20788 versus 19205, an 8.2% gain. Integer math is nearly tied: AMD leads 120016 to 117813, just 1.9% ahead.

The largest win for the Intel Core 5 221E comes in Cinebench R23 single-core, where it scores 3661 against 1992, a 45.6% lead. Cinebench R23 multicore also goes clearly to Intel at 25933 versus 18520, a 28.6% margin. Cinebench R15 single-core favors Intel at 368 versus 309, a 16% lead. Passmark physics goes to Intel at 2230 versus 1892, a 15.2% lead. Passmark floating point math goes to Intel at 79028 versus 73493, a 7% lead. Passmark single-thread favors Intel at 4147 versus 4003, a 3.5% lead. Find prime numbers goes to Intel at 173 versus 131, a 24.3% lead. Cinebench R15 multicore is the only multicore test AMD wins: 3178 versus 2613, a 21.6% margin.

The pattern is consistent. AMD wins compression, encryption, extended instructions, integer math, random string sorting, and the older Cinebench R15 multicore test. Intel wins every single-core test, the modern Cinebench R23 multicore test, physics, floating point math, and prime number finding.

Where Each One Wins

The AMD Ryzen AI 9 HX PRO 370 wins in workloads that stress data movement, compression, and instruction throughput. Passmark data compression at 403113, extended instructions at 28165, and random string sorting at 43767 all show decisive AMD advantages. The 24-thread count helps in these parallel data tasks. The 4 nm process and 28 W TDP also make it the appropriate choice for a mobile platform where thermal headroom is limited. Its average benchmark score of 50448 and 90th percentile ranking confirm that it delivers a high overall performance level from a low-power mobile package.

The Intel Core 5 221E wins in rendering workloads and single-threaded tasks. The Cinebench R23 multicore score of 25933 versus 18520 is the standout result, and the Cinebench R23 single-core score of 3661 versus 1992 is the largest single-test gap in the entire comparison. The 5.20 GHz boost clock and 24 MB shared L3 cache support these wins. Passmark physics at 2230 and floating point math at 79028 add to the Intel side. The 14 physical cores give it an advantage in workloads that scale with core count rather than thread count.

For a desktop system where rendering, physics simulation, and single-core responsiveness are the priorities, the Intel Core 5 221E delivers those strengths. For a mobile system where data compression, encryption, and extended instruction throughput matter within a 28 W power envelope, the AMD Ryzen AI 9 HX PRO 370 is the stronger match. The data records 7 wins for AMD and 8 wins for Intel, so neither part dominates across the board.

DETAILED SPECIFICATIONS

SPECIFICATION
AI 9 HX PRO 370
5 221E
Core Specs
Cores
12
14 +16.7%
Threads
24
20 -16.7%
Base Clock (GHz)
2
2.7 +35.0%
Boost Clock (GHz)
5.1
5.2 +2.0%
Frequency (GHz)
2
2.7 +35.0%
Turbo Clock (GHz)
5.1
5.2 +2.0%
Multiplier
20
27 +35.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
2 MB (per core)
L3 Cache
16 MB
24 MB (shared)
Power
TDP (W)
28
65 +132.1%
PL1
—
65 W
PL2
—
154 W
Configurable TDP
15-54 W
—
Architecture
Architecture
Zen 5
—
Codename
Strix Point
Bartlett Lake
Generation
Ryzen AI PRO 300 (Zen 5 / Zen 5c)
Core 5 (Bartlett Lake)
Process Size
4 nm
10 nm
Die Size
233 mm²
257 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5, LPDDR5X
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
89.6 GB/s
ECC Memory
Yes
Yes
DDR4 Speed
—
3200 MT/s
Platform
Socket
AMD Socket FP8
Intel Socket 1700
Chipsets
—
W680, R680E, Q670e, Q670, H610E, H610
PCIe
Gen 4, 16 Lanes(CPU only)
Gen 5, 16 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
4 + 8
P-Cores: 6 E-Cores: 8
E-Core Frequency
1400 MHz up to 3.3 GHz
2.1 GHz up to 3.9 GHz
AI/NPU
NPU
Yes / 50 TOPS
—
Graphics
Integrated Graphics
Radeon 890M
UHD Graphics 730
Other
Market
Mobile
Desktop
Production Status
Active
Active
Launch Price
—
$232
Part Number
100-000001569
SRQDVQ659
Package
FP8
FC-LGA16A
Tj Max
100°C
100°C
View Ryzen AI 9 HX PRO 370 Details View Core 5 221E Details