AMD Ryzen AI 7 350 vs Intel Core 9 273PTE Comparison

FAQ

Q: How do the two processors compare in overall benchmark standing?

A: The AMD Ryzen AI 7 350 sits at the 84th percentile of all CPUs in the database, with an average benchmark score of 34222. The Intel Core 9 273PTE sits at the 82nd percentile, with an average score of 31143. That puts AMD roughly 9.9% higher in average score.

Q: What does the head-to-head benchmark count show?

A: The AMD Ryzen AI 7 350 wins 10 of the 15 recorded head-to-head tests. The Intel Core 9 273PTE wins 5. The AMD part takes all single-thread PassMark tests, while Intel counters with strong multi-core Cinebench results and a few specialized compute workloads.

Q: Which processor has the higher boost clock?

A: The Intel Core 9 273PTE boosts to 5.50 GHz, while the AMD Ryzen AI 7 350 boosts to 5.00 GHz. The Intel chip also has a lower base clock at 1.40 GHz compared to AMD's 2.00 GHz.

Q: What are the core and thread counts for each chip?

A: The AMD Ryzen AI 7 350 has 8 cores and 16 threads. The Intel Core 9 273PTE has 12 cores and 24 threads. Intel's part has 50% more cores and 50% more threads.

Q: Which chip has more L3 cache?

A: The Intel Core 9 273PTE has 36 MB of shared L3 cache. The AMD Ryzen AI 7 350 has 8 MB of L3 cache. Intel's L3 is substantially larger, though the AMD part uses a different per-core arrangement for its L1 and L2 caches.

Q: Do these processors support the same memory types?

A: No. The AMD Ryzen AI 7 350 supports DDR5 and LPDDR5X. The Intel Core 9 273PTE supports DDR4 and DDR5. The Intel chip also supports ECC memory, while the AMD chip does not.

Architecture Differences

The AMD Ryzen AI 7 350 is built on the Zen 5 architecture, using the Krackan Point codename. It belongs to the Ryzen AI 300 generation, which pairs Zen 5 cores with Zen 5c efficiency cores. The chip is fabricated on a 4 nm process at TSMC, with a die size of 195 mm². Its cache layout assigns 80 KB of L1 per core and 1 MB of L2 per core, with 8 MB of shared L3.

The Intel Core 9 273PTE uses the Bartlett Lake codename, part of the Core 9 generation. The database does not list a specific microarchitecture name for this chip. It is built on a 10 nm process at Intel's own foundry. Its cache configuration uses 80 KB of L1 per core, but doubles the L2 to 2 MB per core, and provides a much larger 36 MB of shared L3.

The process node difference is significant. AMD uses a 4 nm TSMC process, while Intel uses a 10 nm process. That said, the Intel chip compensates with a higher core count, a higher boost clock, and a larger L3 pool.

Memory support also diverges. The AMD part supports DDR5 and LPDDR5X, making it suitable for low-power mobile designs. The Intel part supports DDR4 and DDR5, which gives it broader compatibility with existing desktop platforms. Both support dual-channel memory at 89.6 GB/s of bandwidth, but only the Intel chip has ECC support.

PCIe connectivity differs as well. The AMD Ryzen AI 7 350 provides PCIe Gen 4 with 16 CPU lanes. The Intel Core 9 273PTE provides PCIe Gen 5 with 16 CPU lanes. That gives Intel a generational advantage in available I/O bandwidth, though the AMD part targets a different market segment.

The integrated graphics also differ. AMD uses the Radeon 860M, while Intel uses UHD Graphics 730. The database does not include iGPU benchmark results, so direct comparison is limited to their presence and naming.

The AMD chip is a mobile part using AMD Socket FP8, with a 28 W TDP. The Intel chip is a desktop part using Intel Socket 1700, with a 45 W TDP. The release dates differ by over a year: AMD launched on January 5, 2025, while Intel is dated March 8, 2026.

Neither chip has an unlocked multiplier. The AMD part carries part number 100-000001601; the Intel part carries part number SA4QJ. Intel's launch MSRP is $549; AMD's launch MSRP is not listed in the database.

Head-to-Head Benchmarks

The Cinebench results present a split picture. In Cinebench R15 multi-core, the AMD Ryzen AI 7 350 scores 2477 against Intel's 2060, a 20.2% advantage for AMD. In Cinebench R15 single-core, AMD leads by a slim 1.4%, scoring 294 versus 290. The tables turn in Cinebench R23. Intel scores 20445 in multi-core versus AMD's 16014.5, a 21.7% margin for Intel. In Cinebench R23 single-core, Intel leads by 32.2%, scoring 2886 against AMD's 1958.

The PassMark suite shows AMD winning the majority of tests. In data compression, AMD scores 304089 versus 258704, a 17.5% lead. Data encryption goes to AMD by 7%, 15244 to 14253. Extended instructions favor AMD heavily: 21678 versus 15952, a 35.9% margin. Integer math goes to AMD by 3.9%, with scores of 85651 and 82411. The multi-thread test gives AMD 24935 against 24054, a 3.7% edge. Random string sorting favors AMD by 14.8%, 33266 versus 28973. Both single-thread PassMark tests show AMD at 3834 versus Intel's 3433, an 11.7% lead.

The Intel chip takes the remaining PassMark workloads. Find prime numbers shows Intel at 142 versus AMD's 80, a 43.7% advantage for Intel. Floating point math goes to Intel by 12.3%, 60673 against 53230. The physics test gives Intel 1917 versus 1349, a 29.6% margin.

The pattern is clear. AMD wins the R15 generation of Cinebench, the entire PassMark general-purpose suite outside of three specific workloads, and every single-thread PassMark test. Intel wins the newer R23 Cinebench tests by large margins, plus prime number finding, floating point math, and physics.

The data suggests AMD's architecture delivers stronger per-thread performance in PassMark single-thread testing, while Intel's higher boost clock and larger cache pool pay off in Cinebench R23 and in compute-heavy PassMark subsets.

The Verdict

The AMD Ryzen AI 7 350 is the better choice for users who prioritize aggregate general-purpose performance. It holds a 9.9% higher average benchmark score, sits two percentile points higher in the database, and wins 10 of 15 head-to-head tests. Its leads are concentrated in data compression, encryption, extended instructions, integer math, random string sorting, and single-thread PassMark performance. The 35.9% margin in extended instructions is the largest AMD advantage, and the 20.2% lead in Cinebench R15 multi-core shows strength in older rendering workloads.

The Intel Core 9 273PTE is the better choice for users who need raw multi-core rendering performance in newer benchmarks and specific compute tasks. It wins Cinebench R23 multi-core by 21.7% and single-core by 32.2%. It also leads in prime number finding by 43.7%, floating point math by 12.3%, and physics by 29.6%. The 12-core, 24-thread configuration gives it a structural advantage in heavily threaded workloads, and the 36 MB L3 cache supports that capability.

The market segments reinforce the distinction. AMD's part is a mobile processor with a 28 W TDP, built for AMD Socket FP8. Intel's part is a desktop processor with a 45 W TDP, built for Intel Socket 1700. The AMD chip targets low-power mobile designs with LPDDR5X support and PCIe Gen 4. The Intel chip targets desktop systems with DDR4 or DDR5 support, ECC memory, and PCIe Gen 5.

For mobile users, the AMD Ryzen AI 7 350 delivers stronger general compute in a lower power envelope. For desktop users who need maximum Cinebench R23 scores and specialized math throughput, the Intel Core 9 273PTE is the data-supported pick.

Specification Differences

| Specification | AMD Ryzen AI 7 350 | Intel Core 9 273PTE |

|----------------|--------------------|---------------------|

| Cores | 8 | 12 |

| Threads | 16 | 24 |

| Base clock | 2.00 GHz | 1.40 GHz |

| Boost clock | 5.00 GHz | 5.50 GHz |

| TDP | 28 W | 45 W |

| Socket | AMD Socket FP8 | Intel Socket 1700 |

| Architecture | Zen 5 | Not listed |

| Codename | Krackan Point | Bartlett Lake |

| Generation | Ryzen AI 300 (Zen 5 / Zen 5c) | Core 9 (Bartlett Lake) |

| Process node | 4 nm | 10 nm |

| Foundry | TSMC | Intel |

| Die size | 195 mm² | Not listed |

| L1 cache | 80 KB (per core) | 80 KB (per core) |

| L2 cache | 1 MB (per core) | 2 MB (per core) |

| L3 cache | 8 MB | 36 MB (shared) |

| Memory support | DDR5, LPDDR5X | DDR4, DDR5 |

| Memory bus | Dual-channel | Dual-channel |

| Memory bandwidth | 89.6 GB/s | 89.6 GB/s |

| ECC memory | No | Yes |

| PCIe | Gen 4, 16 Lanes (CPU only) | Gen 5, 16 Lanes (CPU only) |

| Integrated graphics | Radeon 860M | UHD Graphics 730 |

| Market segment | Mobile | Desktop |

| Production status | Active | Active |

| Release date | 2025-01-05 | 2026-03-08 |

| Launch MSRP | Not listed | $549 |

| Multiplier unlocked | No | No |

| Part number | 100-000001601 | SA4QJ |