CPU Comparison

AMD
AMD

AMD Ryzen 9 PRO 5945

CORE STATE Vermeer
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3 Base / 4.7 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2022
VS
Intel
INTEL

Core i7-9750H

CORE STATE Coffee Lake-HR
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 2.6 Base / 4.5 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 45W
ARCHITECTURE Coffee Lake
nm
PROCESS 14 nm
LAUNCH DATE 2019

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,959
913
cinebench_cinebench_r15_singlecore
417
128
cinebench_cinebench_r20_multicore
12,333
3,808
cinebench_cinebench_r20_singlecore
1,740
537
cinebench_cinebench_r23_multicore
29,366
9,069
cinebench_cinebench_r23_singlecore
4,145
1,280
passmark_data_compression
416,599
150,443
passmark_data_encryption
26,313
3,756
passmark_extended_instructions
27,031
9,187
passmark_find_prime_numbers
228
32
passmark_floating_point_math
70,291
23,343
passmark_integer_math
129,768
37,822
passmark_multithread
34,549
10,671
passmark_physics
1,772
670
passmark_random_string_sorting
43,447
19,862
passmark_single_thread
3,499
2,404
passmark_singlethread
3,499
2,404
geekbench_multicore
N/A
4,981
geekbench_singlecore
N/A
1,361

DETAILED SPECIFICATIONS

SPECIFICATION
9 PRO 5945
i7-9750H
Core Specs
Cores
12
6 -50.0%
Threads
24
12 -50.0%
Base Clock (GHz)
3
2.6 -13.3%
Boost Clock (GHz)
4.7
4.5 -4.3%
Frequency (GHz)
3
2.6 -13.3%
Turbo Clock (GHz)
4.7
4.5 -4.3%
Multiplier
30
26 -13.3%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
256 KB (per core)
L3 Cache
64 MB
12 MB (shared)
Power
TDP (W)
65
45 -30.8%
PPT
88 W
—
Architecture
Architecture
Zen 3
Coffee Lake
Codename
Vermeer
Coffee Lake-HR
Generation
Ryzen 9 (Zen 3 (Vermeer))
Core i7 (Coffee Lake-HR)
Process Size
7 nm
14 nm
Transistors
8,300 million
—
Die Size
2x 74 mm²
149 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
42.7 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket AM4
Intel BGA 1440
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 3
AMD Multi-Die
IO Process Size
12 nm
—
Graphics
Integrated Graphics
—
UHD 630
Other
Market
Desktop
Mobile
Production Status
Active
End-of-life
Part Number
100-000000831
SRF6USRFCP
Package
µOPGA-1331
FC-BGA1440
Tj Max
—
100°C
Bundled Cooler
None
—
View Ryzen 9 PRO 5945 Details View Core i7-9750H Details