CPU Comparison

AMD
AMD

AMD Ryzen 9 PRO 5945

CORE STATE Vermeer
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3 Base / 4.7 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2022
VS
Intel
INTEL

Core i3-10320

CORE STATE Comet Lake
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3.8 Base / 4.6 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 91W
ARCHITECTURE Comet Lake
nm
PROCESS 14 nm
LAUNCH DATE 2020

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,959
855
cinebench_cinebench_r15_singlecore
417
120
cinebench_cinebench_r20_multicore
12,333
3,563
cinebench_cinebench_r20_singlecore
1,740
502
cinebench_cinebench_r23_multicore
29,366
8,484
cinebench_cinebench_r23_singlecore
4,145
1,197
passmark_data_compression
416,599
140,255
passmark_data_encryption
26,313
3,458
passmark_extended_instructions
27,031
9,284
passmark_find_prime_numbers
228
32
passmark_floating_point_math
70,291
19,483
passmark_integer_math
129,768
31,071
passmark_multithread
34,549
9,982
passmark_physics
1,772
689
passmark_random_string_sorting
43,447
17,821
passmark_single_thread
3,499
2,841
passmark_singlethread
3,499
2,841

DETAILED SPECIFICATIONS

SPECIFICATION
9 PRO 5945
i3-10320
Core Specs
Cores
12
4 -66.7%
Threads
24
8 -66.7%
Base Clock (GHz)
3
3.8 +26.7%
Boost Clock (GHz)
4.7
4.6 -2.1%
Frequency (GHz)
3
3.8 +26.7%
Turbo Clock (GHz)
4.7
4.6 -2.1%
Multiplier
30
38 +26.7%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
256 KB (per core)
L3 Cache
64 MB
8 MB (shared)
Power
TDP (W)
65
91 +40.0%
PL1
โ€”
65 W
PL2
โ€”
90 W
PPT
88 W
โ€”
Architecture
Architecture
Zen 3
Comet Lake
Codename
Vermeer
Comet Lake
Generation
Ryzen 9 (Zen 3 (Vermeer))
Core i3 (Comet Lake)
Process Size
7 nm
14 nm
Transistors
8,300 million
โ€”
Die Size
2x 74 mmยฒ
โ€”
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
42.7 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket AM4
Intel Socket 1200
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 3, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
โ€”
Graphics
Integrated Graphics
โ€”
UHD Graphics 630
Other
Market
Desktop
Desktop
Production Status
Active
Active
Part Number
100-000000831
SRH3G
Package
ยตOPGA-1331
FC-LGA1200
Tj Max
โ€”
100ยฐC
Bundled Cooler
None
โ€”
View Ryzen 9 PRO 5945 Details View Core i3-10320 Details