CPU Comparison

A

AMD

AMD

AMD Ryzen 9 PRO 5945

CORE STATE Vermeer

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3 Base / 4.7 GHz Turbo

CACHE 64 MB

MAX TDP 65W

ARCHITECTURE Zen 3

nm

PROCESS 7 nm

LAUNCH DATE 2022

VS

A

AMD

AMD

Ryzen AI Max+ 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,959

4,558

cinebench_cinebench_r15_singlecore

417

643

cinebench_cinebench_r20_multicore

12,333

18,995

cinebench_cinebench_r20_singlecore

1,740

2,681

cinebench_cinebench_r23_multicore

29,366

45,228

cinebench_cinebench_r23_singlecore

4,145

6,385

passmark_data_compression

416,599

656,891

passmark_data_encryption

26,313

34,086

passmark_extended_instructions

27,031

52,958

passmark_find_prime_numbers

228

298

passmark_floating_point_math

70,291

123,833

passmark_integer_math

129,768

195,223

passmark_multithread

34,549

53,137

passmark_physics

1,772

3,448

passmark_random_string_sorting

43,447

72,894

passmark_single_thread

3,499

4,123

passmark_singlethread

3,499

4,123

DETAILED SPECIFICATIONS

SPECIFICATION

9 PRO 5945

AI Max+ 395

Core Specs

Cores

12

16 +33.3%

Threads

24

32 +33.3%

Base Clock (GHz)

3

3 0.0%

Boost Clock (GHz)

4.7

5.1 +8.5%

Frequency (GHz)

3

3 0.0%

Turbo Clock (GHz)

4.7

5.1 +8.5%

Multiplier

30

30 0.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

64 MB

64 MB (shared)

Power

TDP (W)

65

55 -15.4%

PPT

88 W

—

Configurable TDP

—

45-120 W

Architecture

Architecture

Zen 3

Zen 5

Codename

Vermeer

Strix Halo

Generation

Ryzen 9 (Zen 3 (Vermeer))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

7 nm

4 nm

Transistors

8,300 million

—

Die Size

2x 74 mm²

2x 70.6 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

LPDDR5X

Memory Bus

Dual-channel

Quad-channel

Memory Bandwidth

51.2 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket AM4

AMD Socket FP11

PCIe

Gen 4, 20 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

12 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8060S

Other

Market

Desktop

Mobile

Production Status

Active

Active

Part Number

100-000000831

100-000001099

Package

µOPGA-1331

FC-BGA

Tj Max

—

100°C

Bundled Cooler

None

—

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