CPU Comparison

A

AMD

AMD

AMD Ryzen 9 9955HX3D

CORE STATE Fire Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 128 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

i

Intel

INTEL

Xeon w3-2525

CORE STATE Sapphire Rapids

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.5 Base / 4.5 GHz Turbo

CACHE 22.5 MB

MAX TDP 175W

ARCHITECTURE Sapphire Rapids

nm

PROCESS 10 nm

LAUNCH DATE 2024

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

5,289

2,388

cinebench_cinebench_r15_singlecore

746

336

cinebench_cinebench_r20_multicore

22,039

9,953

cinebench_cinebench_r20_singlecore

3,111

1,404

cinebench_cinebench_r23_multicore

52,475

23,699

cinebench_cinebench_r23_singlecore

7,408

3,345

passmark_data_compression

762,606

337,116

passmark_data_encryption

38,516

16,932

passmark_extended_instructions

60,405

27,881

passmark_find_prime_numbers

521

125

passmark_floating_point_math

140,559

67,764

passmark_integer_math

219,084

86,889

passmark_multithread

61,403

27,882

passmark_physics

4,653

1,656

passmark_random_string_sorting

81,627

33,850

passmark_single_thread

4,492

3,430

passmark_singlethread

4,492

3,430

DETAILED SPECIFICATIONS

SPECIFICATION

9 9955HX3D

w3-2525

Core Specs

Cores

16

8 -50.0%

Threads

32

16 -50.0%

Base Clock (GHz)

2.5

3.5 +40.0%

Boost Clock (GHz)

5.4

4.5 -16.7%

Frequency (GHz)

2.5

3.5 +40.0%

Turbo Clock (GHz)

5.4

4.5 -16.7%

Multiplier

25

35 +40.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

80 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

2 MB (per core)

L3 Cache

128 MB (shared)

22.5 MB

Power

TDP (W)

55

175 +218.2%

PPT

74-101 W

—

Configurable TDP

75 W

—

Architecture

Architecture

Zen 5

Sapphire Rapids

Codename

Fire Range

Sapphire Rapids

Generation

Ryzen 9 (Zen 5 (Fire Range))

Xeon W (Sapphire Rapids)

Process Size

4 nm

10 nm

Transistors

16,630 million

—

Die Size

2x 70.6 mm²

—

Foundry

TSMC

Intel

Memory

Memory Support

DDR5

DDR5

Memory Bus

Dual-channel

Quad-channel

Memory Bandwidth

89.6 GB/s

140.8 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket FL1

Intel Socket 4677

PCIe

Gen 5, 28 Lanes(CPU only)

Gen 5, 64 Lanes(CPU only)

DMI

—

4.0 x8

AMD Multi-Die

IO Process Size

6 nm

—

Graphics

Integrated Graphics

Radeon 610M

—

Other

Market

Mobile

Server/Workstation

Production Status

Active

Active

Launch Price

—

$609

Part Number

100-000001030

SRN4J

Package

µFC-BGAFL1

FC-LGA16A

Tj Max

100°C

—

Bundled Cooler

None

—

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