CPU Comparison

A

AMD

AMD

AMD Ryzen 9 9955HX3D

CORE STATE Fire Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 128 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

i

Intel

INTEL

Xeon Phi 7290

CORE STATE Knights Landing

CORE SPECS 72 Cores / 288 Threads

CLOCK SPEED 1500 Base / 1700 GHz Turbo

CACHE —

MAX TDP 245W

ARCHITECTURE Knights Landing

nm

PROCESS 14 nm

LAUNCH DATE 2016

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

5,289

1,528

cinebench_cinebench_r15_singlecore

746

215

cinebench_cinebench_r20_multicore

22,039

6,368

cinebench_cinebench_r20_singlecore

3,111

898

cinebench_cinebench_r23_multicore

52,475

15,163

cinebench_cinebench_r23_singlecore

7,408

2,140

passmark_data_compression

762,606

564,535

passmark_data_encryption

38,516

12,505

passmark_extended_instructions

60,405

41,517

passmark_find_prime_numbers

521

114

passmark_floating_point_math

140,559

47,417

passmark_integer_math

219,084

126,922

passmark_multithread

61,403

17,839

passmark_physics

4,653

2,257

passmark_random_string_sorting

81,627

68,593

passmark_single_thread

4,492

485

passmark_singlethread

4,492

485

DETAILED SPECIFICATIONS

SPECIFICATION

9 9955HX3D

Phi 7290

Core Specs

Cores

16

72 +350.0%

Threads

32

288 +800.0%

Base Clock (GHz)

2.5

1,500 +59900.0%

Boost Clock (GHz)

5.4

1,700 +31381.5%

Frequency (GHz)

2.5

1,500 +59900.0%

Turbo Clock (GHz)

5.4

1,700 +31381.5%

Multiplier

25

15 -40.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

80 KB (per core)

32 KB (per core)

L2 Cache

1 MB (per core)

512 KB (per core)

L3 Cache

128 MB (shared)

—

Power

TDP (W)

55

245 +345.5%

PPT

74-101 W

—

Configurable TDP

75 W

—

Architecture

Architecture

Zen 5

Knights Landing

Codename

Fire Range

Knights Landing

Generation

Ryzen 9 (Zen 5 (Fire Range))

Xeon Phi (Knights Landing)

Process Size

4 nm

14 nm

Transistors

16,630 million

8,000 million

Die Size

2x 70.6 mm²

—

Foundry

TSMC

Intel

Memory

Memory Support

DDR5

DDR4

Memory Bus

Dual-channel

—

Memory Bandwidth

89.6 GB/s

—

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket FL1

Intel Socket 3647

PCIe

Gen 5, 28 Lanes(CPU only)

—

AMD Multi-Die

IO Process Size

6 nm

—

Graphics

Integrated Graphics

Radeon 610M

—

Other

Market

Mobile

Server/Workstation

Production Status

Active

—

Part Number

100-000001030

SR2WY

Package

µFC-BGAFL1

FC-LGA3647

Tj Max

100°C

—

Bundled Cooler

None

—

View Ryzen 9 9955HX3D Details View Xeon Phi 7290 Details