CPU Comparison

A

AMD

AMD

AMD Ryzen 9 9955HX3D

CORE STATE Fire Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 128 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

i

Intel

INTEL

Xeon Gold 5318H

CORE STATE Cooper Lake-SP

CORE SPECS 18 Cores / 36 Threads

CLOCK SPEED 2.5 Base / 3.8 GHz Turbo

CACHE 24.75 MB (shared)

MAX TDP 150W

ARCHITECTURE Cooper Lake

nm

PROCESS 14 nm

LAUNCH DATE 2021

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

5,289

2,510

cinebench_cinebench_r15_singlecore

746

354

cinebench_cinebench_r20_multicore

22,039

10,460

cinebench_cinebench_r20_singlecore

3,111

1,476

cinebench_cinebench_r23_multicore

52,475

24,905

cinebench_cinebench_r23_singlecore

7,408

3,516

passmark_data_compression

762,606

470,916

passmark_data_encryption

38,516

10,743

passmark_extended_instructions

60,405

33,730

passmark_find_prime_numbers

521

141

passmark_floating_point_math

140,559

66,610

passmark_integer_math

219,084

107,603

passmark_multithread

61,403

29,301

passmark_physics

4,653

2,309

passmark_random_string_sorting

81,627

58,841

passmark_single_thread

4,492

2,225

passmark_singlethread

4,492

2,225

DETAILED SPECIFICATIONS

SPECIFICATION

9 9955HX3D

Gold 5318H

Core Specs

Cores

16

18 +12.5%

Threads

32

36 +12.5%

Base Clock (GHz)

2.5

2.5 0.0%

Boost Clock (GHz)

5.4

3.8 -29.6%

Frequency (GHz)

2.5

2.5 0.0%

Turbo Clock (GHz)

5.4

3.8 -29.6%

Multiplier

25

25 0.0%

SMP CPUs

1

4 +300.0%

Cache

L1 Cache

80 KB (per core)

64 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

128 MB (shared)

24.75 MB (shared)

Power

TDP (W)

55

150 +172.7%

PPT

74-101 W

—

Configurable TDP

75 W

—

Architecture

Architecture

Zen 5

Cooper Lake

Codename

Fire Range

Cooper Lake-SP

Generation

Ryzen 9 (Zen 5 (Fire Range))

Xeon Gold (Cooper Lake-SP)

Process Size

4 nm

14 nm

Transistors

16,630 million

—

Die Size

2x 70.6 mm²

—

Foundry

TSMC

Intel

Memory

Memory Support

DDR5

DDR4

Memory Bus

Dual-channel

Six-channel

Memory Bandwidth

89.6 GB/s

128.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket FL1

Intel Socket 4189

PCIe

Gen 5, 28 Lanes(CPU only)

Gen 3, 48 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

Graphics

Integrated Graphics

Radeon 610M

—

Other

Market

Mobile

Server/Workstation

Production Status

Active

Active

Part Number

100-000001030

SRJY3CD8070604481600

Package

µFC-BGAFL1

FC-LGA4189

Tj Max

100°C

—

Bundled Cooler

None

—

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