CPU Comparison

A

AMD

AMD

AMD Ryzen 9 9955HX3D

CORE STATE Fire Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 128 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

i

Intel

INTEL

Xeon D-2752TER

CORE STATE Ice Lake-D

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 1800 Base / 2.8 GHz Turbo

CACHE 20 MB (shared)

MAX TDP 77W

ARCHITECTURE Ice Lake

nm

PROCESS 10 nm

LAUNCH DATE 2022

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

5,289

1,636

cinebench_cinebench_r15_singlecore

746

230

cinebench_cinebench_r20_multicore

22,039

6,819

cinebench_cinebench_r20_singlecore

3,111

962

cinebench_cinebench_r23_multicore

52,475

16,236

cinebench_cinebench_r23_singlecore

7,408

2,292

passmark_data_compression

762,606

227,763

passmark_data_encryption

38,516

13,097

passmark_extended_instructions

60,405

13,846

passmark_find_prime_numbers

521

96

passmark_floating_point_math

140,559

33,533

passmark_integer_math

219,084

60,881

passmark_multithread

61,403

19,102

passmark_physics

4,653

1,777

passmark_random_string_sorting

81,627

31,802

passmark_single_thread

4,492

1,990

passmark_singlethread

4,492

1,990

DETAILED SPECIFICATIONS

SPECIFICATION

9 9955HX3D

D-2752TER

Core Specs

Cores

16

12 -25.0%

Threads

32

24 -25.0%

Base Clock (GHz)

2.5

1,800 +71900.0%

Boost Clock (GHz)

5.4

2.8 -48.1%

Frequency (GHz)

2.5

1,800 +71900.0%

Turbo Clock (GHz)

5.4

2.8 -48.1%

Multiplier

25

18 -28.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

80 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

1.25 MB (per core)

L3 Cache

128 MB (shared)

20 MB (shared)

Power

TDP (W)

55

77 +40.0%

PPT

74-101 W

—

Configurable TDP

75 W

—

Architecture

Architecture

Zen 5

Ice Lake

Codename

Fire Range

Ice Lake-D

Generation

Ryzen 9 (Zen 5 (Fire Range))

Xeon D (Ice Lake-D)

Process Size

4 nm

10 nm

Transistors

16,630 million

—

Die Size

2x 70.6 mm²

—

Foundry

TSMC

Intel

Memory

Memory Support

DDR5

DDR4

Memory Bus

Dual-channel

Quad-channel

Memory Bandwidth

89.6 GB/s

85.3 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket FL1

Intel BGA 2579

PCIe

Gen 5, 28 Lanes(CPU only)

Gen 4, 32 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

Graphics

Integrated Graphics

Radeon 610M

—

Other

Market

Mobile

Server/Workstation

Production Status

Active

Active

Launch Price

—

$1061

Part Number

100-000001030

SRLCNSRM27

Package

µFC-BGAFL1

FC-BGA16B

Tj Max

100°C

—

Bundled Cooler

None

—

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